• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.6
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• pp.1131-1135
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• 2010

The development of modern civilization result from the abundance of material. Yet modern people live with chronic mild stress. Excessive chronic mild stress leads to various diseases. From the risk of the disease in order to protect our bodies need to manage chronic mild stress. The purpose of this study is to inspection the effectiveness of detecting in chronic mild stress using the Multi-sensor system. The Multi-sensor system is designed that can be measure three kinds of vital signals of chronic mild stress for the detection. First Photoplethysmogram(PPG), second Electro Dermal Activity(EDA), third Skin Temperature(SKT). The ages and occupations exposed to chronic mild stress, people often use out of this system was applied to dairy products(Pen). In addition, vital signals that occur when the variety of noise was used to remove the accelerometer. Chronic mild stress by the analysis of measured vital signals from Multi-sensor system to the measurement information to a PC to a wireless transmission(Bluetooth). In this study, using Multi-sensor system writing conditions and a variety of situations in the movement to measure vital signals and measurement results verified the accuracy and reliability. Through this measure chronic mild stress in everyday life and managing to maintain will help more healthy lifestyle.

• International Journal of Concrete Structures and Materials
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• v.3 no.1
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• pp.33-37
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• 2009

Fiber Bragg grating (FBG) sensors already have been the focus for structural health monitoring (SHM) due to their distinguishing advantages. However, as bare optical fiber is very fragile, bare FBG strain sensor without encapsulation can not properly be applied in practical infrastructures. Therefore encapsulation techniques for making encapsulated FBG strain sensor show very important in pushing forward the application of FBG strain sensors in SHM. In this paper, a simplified approximate method to analyze the stress transferring rules for embedded FBG strain sensors in concrete monitoring is put forward according to mechanics of composite materials. Shear lag theory is applied to analyze the stress transferring rule of embedded FBG strain sensor in measured host material at the first time. The measured host objects (concrete) and the encapsulated FBG strain sensor are regarded as a composite, and then the stress transfer formula and stress transfer coefficient of encapsulated FBG strain sensor are obtained.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.180-185
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• 2017

In this research, we proposed the simple and efficient method to calculate the shear stresses by using the mid-point measurements in ${\pm}45^{\circ}$ semiconductor resistor-sensor pair. Compared to the previous works, the measurements became much simpler by combining the approximation theory with the technique of mid-point measurement. In addition, we proposed another novel method for the stress calculation in which we could increase the sensitivity of the stress sensor by controlling the applied voltage between the sensor-pair. For the applied voltage of 8 V, the sensitivity showed a significant increase by 100%.

• Journal of the Korea institute for structural maintenance and inspection
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• v.4 no.4
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• pp.109-119
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• 2000

PVDF film sensor was applied to measure the stress concentration for monitoring the structural integrity. The strain calibration of this film sensor was performed by the bending test of aluminum beam. The PVDF sensor and the electrical strain gage were bonded on the beam. When the beam was loaded, the output of electrical strain gage was compared with the output of the PVDF sensor. The waveform of PVDF sensor output was shown as the same form of the output of electrical strain gage. The gain was determined as 1.7 by comparing these two signals to determine the exact value of the strain. In order to experiment the stress concentration, the stress field was analyzed by finite element analysis. The tensile test of notched steel specimens was conducted to develop the measurement technique of stress concentration. The output voltage ratio between the PVDF sensor near the notch and the PVDF sensor far from the notch could give the information about the load bearing capacity of steel specimen.

• Journal of the Korean GEO-environmental Society
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• v.12 no.11
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• pp.71-77
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• 2011

Recently, non-destructive stress measurement method using magnetic anisotropy sensor has been applied to the construction site such as steel bridges and steel pipes. In addition, steel rib used in the tunnel construction site was found to be possible to measure the stress by non-destructive method. In this study, steel loading experiments using magnetic anisotropy sensor developed in Japan and strain gauges were conducted to derive stress sensitivity curve for domestic steel SS400. Also, additional steel loading experiments and numerical analysis were performed for evaluation of applicability for non-destructive stress measurement method using magnetic anisotropy sensor. As a result of this study, stress sensitivity curves for domestic steel SS400 were derived using output voltage measured by magnetic anisotropy sensor and average of stress measured by strain gauges depending on the measurement location. And as a result of comparing additional steel loading experiments with the numerical analysis, error level of magnetic anisotropy sensor is around 20MPa. When considering the level of the yield stress(245MPa) of steel, in case of using magnetic anisotropy sensor in order to determine the stress status of steel, it has sufficient accuracy in engineering. Especially, magnetic anisotropy sensor can easily identify the current state of stress which considers residual stress at steel structure that stress measurement sensor is not installed, so we found that magnetic anisotropy sensor can be applied at maintenance of steel structure conveniently.

• Korean Journal of Materials Research
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• v.12 no.2
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• pp.103-111
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• 2002

The thermally insulated underground pipelines have been used for district heating system. The sensor wire embedded in the insulation was used for monitoring the insulating resistance between the sensor wire and the pipe. The resistance measurement system detects corrosion of steel pipe under insulation. The corrosion and stress corrosion cracking(SCC) characteristics of sensor wire in synthetic ground water were investigated using the electrochemical methods and constant load SCC tests. The polarization tests were used to study the electrochemical behavior of sensor wire. The sensor wire was passivated at temperatures ranging from 25 to $95^{\circ}C$. However, the applied sensing current larger than passive current resulted in breakdown of passive film. The constant load SCC tests were performed to investigate the effects of applied current and load on the fracture behavior. Stress-corrosion cracks initiated at pits that were produced by sensing current. The growth of the pit involves a tunnelling mechanism, which leads to ductile fracture.

• Journal of Sensor Science and Technology
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• v.19 no.1
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• pp.62-66
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• 2010

We have proposed and demonstrated a rotation angle sensor based on the stress -optic effect of a fused fiber coupler whose transmission spectrum is altered by the torsional stress. The peak of transmission spectrum was shifted to longer wavelength region with rotation of the coupler. The rotation angle sensor revealed reproducibility and symmetric behavior with respect to the rotation direction. The sensitivity of the sensor was 0.367 [nm/degee].

• Journal of IKEEE
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• v.1 no.1 s.1
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• pp.1-10
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• 1997

It is well-known that rectangular bulk-Si sensors prepared by etch or epi etch-stop micromachining technology are already in practical use today, but the conventional bulk-Si sensor shows some drawbacks such as large chip size and limited applications as silicon sensor device is to be miniaturized. We consider a circular-shape SOI(Silicon-On-Insulator) micro-cavity technology to facilitate multiple sensors on very small chip, to make device easier to package than conventional sensor like pressure sensor and to provide very high over-pressure capability. This paper demonstrates the cross-functional results for stress analyses(targeting $5{\mu}m$ deflection and 100MPa stress as maximum at various applicable pressure ranges), for finding permissible diaphragm dimension by output sensitivity, and piezoresistive sensor theory from two-type SOI structures where the double SOI structure shows the most feasible deflection and small stress at various ambient pressures. Those results can be compared with the ones of circular-shape bulk-Si based sensor$^{[17]}. The SOI micro-cavity formed the sensors is promising to integrate with calibration, gain stage and controller unit plus high current/high voltage CMOS drivers onto monolithic chip.

• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.