• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 추계학술대회 논문집 학회본부
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• pp.299-303
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• 1991

A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

• 비파괴검사학회지
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• 제31권5호
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• pp.500-507
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• 2011

본 연구에서는 치아 시편에 AE 센서를 직접 부착하는 방법과 웨이브 가이드(waveguide)를 사용하는 방법을 이용하여 치아에 충전된 치과용 복합레진의 광중합 수축에 따른 AE 신호를 검출하여 해석하였다. PMMA, 스테인리스 스틸, 인간 치아 시편을 사용하여 AE hit와 AE 진폭(amplitude) 거동을 비교하였다. 웨이브 가이드를 사용한 경우 전파 중에 발생하는 반사파에 의한 파형의 변형으로 진폭 및 hit 수의 감소가 나타났으나, 시편의 재질에 따른 신호의 발생빈도와 1차 중심주파수의 대역은 웨이브 가이드 사용 여부에 따라 차이가 없었다.

• 한국안광학회지
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• 제9권1호
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• pp.161-166
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• 2004

본 연구에서는 이온빔 증착방법을 사용하여 스테인레스 스틸 기판 위에 TiN 박막을 성장하였다. $10^{-5}$ Torr의 질소 분위기에서 아르곤 가스를 보조 이온빔으로 사용하여 TiN 박막을 성장하였다. TiN 박막의 화학 조성, 색상, 밀착력 등을 En의(원자당 이용에너지) 변화에 따라서 측정하였다. En이 증가 할 때 질소와 Ti의 비율은 선형적으로 변화 하였고, 높은 En의 경우에는 질소와 Ti의 비율은 1.2를 가지며 포화되었다. 밝은 금색은 En이 어떤 임계값(Ecn)에 도달 하였을 때 얻어졌다. 이때의 질소와 Ti의 비율은 0.9 이다.

• Progress in Superconductivity
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• 제5권2호
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• pp.109-113
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• 2004

MgB$_2$ and FeTi composites was prepared to study the effect of FeTi particles on superconductivity of MgB$_2$. The sample, which had contained magnesium, boron and FeTi particles, was synthesized by the Commercial Stainless Steel Tube Enveloping Technique(COSSET) at 92$0^{\circ}C$ for 2 hours. The structure and properties of the sample was investigated by XRD, SEM, and SQUID magnetometer. It was found that there was a little change of T$_{c}$ compared with pure MgB$_2$ superconductor in spite of high percentage of FeTi particles, and there was no proof of structure change of MgB$_2$ superconductor due to FeTi particles. But the high porosity which was appeared in the pure MgB$_2$ was disappeared in the composites. We conclude that FeTi particles do not influence the superconductivity of MgB$_2$ and it is expected that fe-Ti material system will be a good material for a tube of the PIT process and for a substrate of the film.m.

• 한국표면공학회지
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• 제47권4호
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• pp.174-180
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• 2014

In this study, TiAlSiN coatings have been successfully synthesized on stainless steel and tungsten carbide substrate by a hybrid coating method employing a cathodic arc and a magnetron sputtering source. TiAl and Si target were vaporized with the cathodic arc source and the magnetron sputtering source, respectively. Process gas was the mixture of nitrogen and argon gas. With the increase of Si content, the crystallinity and the grain size of TiAlSiN film was decreased. At the Si content of more than 8 at.%, grain size of TiAlSiN was saturated at around 2 nm. The hardness value of the TiAlSiN film increased with incorporation of Si, and had the maximum value of ~ 3,233 Hv at the Si content of 9.2 at.%. The oxidation resistance of TiAlSiN film was enhanced with the increase of Si content.

• Journal of Welding and Joining
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• 제20권6호
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• pp.106-106
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and Ti₃Ag and titanium oxide, TiO₂were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of 900℃ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about 30㎛, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• 한국진공학회지
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• 제1권1호
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• pp.162-167
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• 1992

반응성 RF 스파타 증착법으로 스테인레스 스틸 기판 위에 TiC 박막과 TiN 박막을 증착하였다. 스파타기체로 Ar를, 반응기체로 C2H2와 N2 기체를 사용하였다. 박막의 증착율 은 RF 출력증가에 따라 선형적으로 증가하였으며 스파타기체에 대한 반응 기체의 분압비 증가에 따라 급격하게 감소하였다. 박막의 성분은 TiC 박막의 경우 분압비 0.03에서, TiN 박막의 경우 분압비 0.05에서 stoichiometric한 성분이 된다. 이 TiC, TiN 박막의 morphology와 미세구조 및 계면을 AES, SEM 그리고 TEM으로 조사하였다. 또한 N+ 이온 을 주입하여 N+ 이온 주입효과와 열처리 효과도 조사하였다.

• 한국초전도ㆍ저온공학회논문지
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• 제14권3호
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• pp.13-17
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• 2012

KEPCO Research Institute has been researching a Superconducting Fault Current Limiter (SFCL) which is considered one of solutions of fault current problems with Korea Institute of Machinery & Materials (KIMM) and Hanyang University since 2011. In this paper, we fabricated a current limiting module and conducted electrical short circuit tests for checking the validity of the transmission level SFCL design. Based on the short circuit characteristics of the second generation High Temperature Superconductor (HTS), we analyzed the short circuit characteristics of 3 parallel connected superconducting wires. The structure of the HTS wire is as follows: the stainless steel stabilizer of $100{\mu}m$ is laminated on the superconductor layer and under the substrate, both of which are electrically jointed with solder. We fabricated the current limiting module which has 40 series and 6 parallel connections and studied the short circuit characteristics of the module under various voltage levels.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.693-694
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• 2006

In order to develop a high temperature superconducting(HTS) coil for the fault current limiter(FCL), the over-current characteristics in YBCO coated conductor(CC) with Ni-W alloy substrate are analyzed. The HTS wire is wound by bifilar winding method for resistive current limitation and it is operated in 65K sub-cooled nitrogen. In order to analyze the resistance and the temperature characteristics of the CC wire, an analysis program is developed considering all the composition materials except the buffer layer. Using this program, the temperature rise, the resistance development and the current limitation of CC are calculated depending on the applied voltage and the stabilizer materials. According to the analysis results, under the temperature restriction of 300K, the maximum voltage per meter is determined as 40V/m if the stabilizer is $25{\mu}m$ thick stainless steel at each side. Finally, the wire length needed for the distribution level HTS FCL is estimated.

• Journal of Welding and Joining
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• 제20권6호
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• pp.830-837
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.