• Journal of the Korean Institute of Gas
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• v.24 no.5
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• pp.74-81
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• 2020

In general, when manufacturing a semiconductor, a number of hazardous and dangerous substances such as flammability, toxic, and corrosiveness are used. In particular, semiconductors are manufactured using specialty gas in processes such as CVD and etching. The specialty gas is filled in a container in the state of compressed or liquefied gas, and a gas cylinder cabinet is used as a facility for supplying this specialty gas to the semiconductor manufacturing process. When a accident occurs in the gas supply system, gas is released through a pressure release device installed in the gas cylinder to secure the safety of the supply system. In this case, the gas released inside the gas cabinet, there is a risk of leaking to the outside. After that, by analyzing the gas flow in the gas cabinet, it is intended to identify the risk associated with leak and to provide measures to prevent accidents.

• Journal of the Korean Institute of Gas
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• v.25 no.2
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• pp.42-51
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• 2021

Facilities that supply specialty gases used in semiconductor manufacturing mainly handles with hazardous and dangerous substances with flammable, toxic, and corrosive properties, and gas cabinets are mainly used as such supply facilities. The effects of the supply facilities were analyzed for each leak through the rupture disk in the gas cabinet and a leak where the leak hole. In this case, gas leaked to the outside depending on the leak area. It is a factor that creates a risk depending on the concentration of the leaked gas. Depending on the risk of leakage, all measures such as safe operation procedures should be reviewed again.

• Journal of Microbiology and Biotechnology
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• v.25 no.12
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• pp.2116-2124
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• 2015

To understand the effects of physicochemical factors on nitrite transformation by microalgae, a lipid-rich Chlorella with high nitrite tolerance was cultured with 8 mmol/l sodium nitrite as sole nitrogen source under different conditions. The results showed that nitrite transformation was mainly dependent on the metabolic activities of algal cells rather than oxidation of nitrite by dissolved oxygen. Light intensity, temperature, pH, NaHCO₃ concentrations, and initial cell densities had significant effects on the rate of nitrite transformation. Single-factor experiments revealed that the optimum conditions for nitrite transformation were light intensity: 300 μmol/m²/s; temperature: 30℃ pH: 7-8; NaHCO₃ concentration: 2.0 g/l; and initial cell density: 0.15 g/l; and the highest nitrite transformation rate of 1.36 mmol/l/d was achieved. There was a positive correlation between nitrite transformation rate and the growth of Chlorella. The relationship between nitrite transformation rate (mg/l/d) and biomass productivity (g/l/d) could be described by the regression equation y = 61.3x (R² = 0.9665), meaning that 61.3 mg N element was assimilated by 1.0 g dry biomass on average, which indicated that the nitrite transformation is a process of consuming nitrite as nitrogen source by Chlorella. The results demonstrated that the Chlorella suspension was able to assimilate nitrite efficiently, which implied the feasibility of using flue gas for mass production of Chlorella without preliminary removal of NO_X.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.23-27
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• 2006

Semiconductor industry has been dramatically developed with the information era of 21C, and the trend now is to consider that the technology of management system of the computer utility that has a high efficiency is important. This study investigated the intelligent decision system for residual gas purge process to effectively remove the residual gas in the tube after replacing the cylinder that is used for the gas cabinet or BSGS(Bulk Specialty Gas Supply System) of the semiconductor process. It was suggest from this study that it is possible to decide the type, frequency and volume of purge gas using various toxic gases which is necessary for each process. Also, this result will be utilized for operating the system, increasing the efficiency of management and saving energy.

• Journal of the Korean Institute of Gas
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• v.15 no.3
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• pp.74-78
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• 2011

$BF_3$ gas has been used for semiconductor manufacturing process and applied in plasma etching, chemical vapor deposition, chamber cleaning processes etc,. $BF_3$ provides Boron and acts as a p-type doping in electrode in semiconductor. In this study, we investigate thermaldecomposition of alkali-boron complexes and suggest a simple way to produce $BF_3$ from $NaBF_4$ and $KBF_4$.

• KSTLE International Journal
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• v.3 no.1
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• pp.30-37
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• 2002

There have been significant improvements in base oil quality in order to satisfy recent market needs. In particular requirements of passenger car motor oils have been leading the trend. Now, high quality base oils such as VHVI base oils and PAOs are to be formulated in order to meet the tight volatility specifications. The severe hydrocracking, hydro-isomerized dewaxing and hydro-finishing process with noble-metal based catalysts (named UCO lube process) developed by SK corporation has been introduced as one of economic hydroprocessing routes to produce high quality VHVI base oils and food grade white mineral oils from fuels hydrocracker residue. Product quality of UCO lube process is similar to PAO in. general performances and therefore provides satisfactory performance far all straightforward applications in general lubricants. However, when applied to specialty lubricants like transformer oils, spray oils and coning oils, severely hydrocracked base oils are known to have various compatibility problems with gas or surfactants formulated in them. These problems are related to the difference in their composition; inherent high paraffin contents and lack of dissolving ability, Fortunately, it was found that excellent specialty lubricants could be made by carefully selecting and formulating adequate additives and/or aromatic compounds. Moreover, these specialties with high quality VHVI base oils ofter various advantages over conventional base oil based products.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.1309-1314
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• 2008

I.G.G is abbreviation for Inert Gas Generator, High temperature in Cargo Tank it desulfurize, exhausted and froze the gas that combined brimstone element and soot, then supply Inert gas by blower, and mack tank inside incombustible range this is equipment that nip in the bud the explosion. The blower for suppling inactivated gas has big impeller with heavy weight to achieve the high pressure, it causes a delay for first operation time and too much load is delivered to motor, total destruction by fire of motor is happening frequently. On this research, we will reduce the size & weight of impeller and install it with several stage, it makes an effect for reducing the first operation time. We also intend to contribute to efficient IGG blower design by research a flowing & pressure specialty from the diameter of impeller, number of blade, and size of casing.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.446-450
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• 2012

I.G.G is abbreviation for inert gas generator high temperature in cargo tank it desulfurize, exhaust and froze the gas that combined brimstone element and soot, then supply inert gas by blower and mack tank inside incombustible range this is equipment that nip in the bud the explosion. The blower for suppling inactivated gas has big impeller with heavy weight to achieve the high pressure, it causes a delay for first operation time and too much load is delivered to motor, total destruction by fire of motor is happen frequently. On this research, we will reduce the size and weight of impeller and install it with several stage, it makes an effect for reducing the first operation time. We also intend to contribute to efficient I.G.G. blower design by research a flow rate and pressure specialty from the diameter of impeller number of blades and size of casing.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.375-380
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• 2009

Gas & Oil plant construction projects are increasing recently all over oil-producing countries. An EPC (Engineering, Procurement and Construction) company, which participates in the plant projects, should possess pertinent engineering licenses and EPC management skills to create high added-value. Nonetheless, there exist various risks involved in the EPC life cycle process due to such characteristics of construction projects as long duration of construction time and complicated processes along with the procured goods or services subjected to various logistics. The objective of this paper is to analyze the overall EPC life cycle for proper process and to examine various information and document. Additionally, the principal data for the analysis of the EPC process are derived from personal interviews with experts and specialty contractors of the plant projects. The results of this study would be widely used as a guide for efficient and effective management of overseas gas plant projects.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.4
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• pp.805-810
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• 2011

This paper deals with the method and algorithm used to find fault locations in gas insulated transmission line. The method uses UHF sensors and digital oscilloscope to detect discharge signals emitted to the outside through insulating spacer in the event of breakdown inside GIL. UHF sensors are the external type and installed at outside of insulating spacers of GIL. And we used wavelet signal processing to analyze the discharge signals and confirm the exact fault location findings in the GIL test line. This method can overcome demerit of TDR(Time Domain Reflectometer) method having been applied to detect fault location for conventional underground transmission lines, and Ground Fault Sensors used in conventional GIS systems. TDR method requires high level of specialty and experience in analyzing the measured signals. Ground fault sensors are installed inside GIL and can be destroyed by high transient voltage. This paper's method can simplify the fault location process and minimize the damage of sensors. In addition, this method can estimate the fault location only by the time difference when discharge signals are arrived to detecting sensors at the ends of GIL sections without reasons of breakdown. To test the performance of our method, we installed sensors at the ends of test line of GIL(84m) and sensed discharge signals occurred in GIL, energized with AC voltage generator up to 700kV.