• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.12
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• pp.92-99
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• 2021

The ever-growing demand for enhanced competitiveness of engineered systems require designing in quality strategies that can efficiently incorporate multiple design attributes into a system. In a robust design, there must be consideration for any uncontrollable factors that should not be disregarded in the design process. Studies on multi-attribute design challenges usually assume mutual utility independence amongst the design attributes. However, mutual utility independence does not exist in every design situation. In this study, a new robust design methodology that has two utility-dependent attributes are presented. The proposed method was then compared with a traditional robust design that utilizes a wave soldering process design. The results of this case study indicate that the proposed method yields a better solution than the traditional method.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.157-161
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• 2007

There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Proceedings of the Korean Society for Quality Management Conference
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• 2004.04a
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• pp.302-306
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• 2004

When we include environment side safety, environmental material's reliability technology and study for the application method, the evidence supporting the investment of R&D person and financial. Clearly, the most important task in electrical and electronics company's product soldering process the probability of heavy metals exclude is to identify the mechanisms by which they may take place. Therefore, this study emphasis on the application environmental material classification and reliability technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.12S
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• pp.1292-1298
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• 2003

In this paper, dc reactor lot the inductive high-Tc superconducting fault current limiter (SFCL) was optimally designed by finite element method(FEM). The Prototype high-Tc do reactor was manufactured and compared to the results of design. This dc reactor consists of 4∼stacked double pancake coils which are wounded with Bi-2223 wire coated with SUS315L. Kapton tape is used for the insulation of turn to turn and layer to layer. Each pancake is connected in series by soldering Finally, optimal design and manufacture method lot the dc reactor is suggested in this paper. Through the comparison of result of optimal design and experimental result of prototype high-Tc superconducting dc reactor, reliance on the design of the high-Tc dc reactor tot the 1.2 kV/80 A SFCL is proved.

• Smart Structures and Systems
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• v.21 no.2
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• pp.151-161
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• 2018

A new type of cascade sandwiched piezoelectric ultrasonic transducer is presented and studied. The cascade transducer is composed of two traditional longitudinally sandwiched piezoelectric transducers, which are connected together in series mechanically and in parallel electrically. Based on the analytical method, the electromechanical equivalent circuit of the cascade transducer is derived and the resonance/anti-resonance frequency equations are obtained. The impedance characteristics and the vibrational modes of the transducer are analyzed. By means of numerical method, the dependency of the resonance/anti-resonance frequency and the effective electromechanical coupling coefficient on the geometrical dimensions of the cascade transducer are studied and some interesting conclusions are obtained. Two prototypes of the cascade transducers are designed and made; the resonance/anti-resonance frequency is measured. It is shown that the analytical resonance/anti-resonance frequencies are in good agreement with the experimental results. It is expected that this kind of cascade transducer can be used in large power and high intensity ultrasonic applications, such as ultrasonic liquid processing, ultrasonic metal machining and ultrasonic welding and soldering.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.1
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• pp.22-31
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• 2008

The operating window method is a novel approach in quality improvement. But it has not received deserved attention in academic research. If a critical factor for competing failure modes can be identified, the probability of failure can be reduced by widening the operating window of this factor. Traditional SN ratio for the operating window advocated by Taguchi has a critical shortcoming, which has been derived under the assumption that failure rates are determined by the operating window factor only. A new metric for robustness is given for the operating window method, which has relaxed the restrictive assumption of Taguchi's SN ratio. And procedures for determining optimal conditions based on the new metric is presented. The effectiveness of the proposed approach over the traditional practice is tested with the aid of a wave soldering process.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.130-135
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• 2013

This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

• Current Photovoltaic Research
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• v.11 no.2
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• pp.44-48
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• 2023

In heterojunction technology (HJT) solar cells, low-temperature curing paste is used because the passivation layer deteriorates at high temperatures of 200℃ or higher. However, manufacturing HJT photovoltaic (PV) modules is challenging due to the weak peel strength between busbar electrodes and cells after soldering process. For this issue, the electrode thicknesses of the busbars of the HJT solar cell were analyzed, and the peel strengths between electrodes and wires were measured after soldering using an infrared (IR) lamp. As a result, the electrodes printed by the screen printing method had a difference in thickness due to screen mask. Also, as the thickness of the electrode increased, the peel strength of the wire increased.

• 제어로봇시스템학회:학술대회논문집
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• 1999.10a
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• pp.65-68
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• 1999

In this study, an off-line automatic teaching method using vision information for robotic assembly task is proposed. Many of industrial robots are still taught and programmed by a teaching pendant. The robot is guided by a human operator to the desired application locations. These motions are recorded and are later edited, within the robotic language using in the robot controller, and played back repetitively to perform the robot task. This conventional teaching method is time-consuming and somewhat dangerous. In the proposed method, the operator teaches the desired locations on the image acquired through CCD camera mounted on the robot hand. The robotic language program is automatically generated and transferred to the robot controller. This teaching process is implemented through an off-line programming(OLP) software. The OLP is developed for the robotic assembly system used in this study. In order to transform the location on image coordinates into robot coordinates, a calibration process is established. The proposed teaching method is implemented and evaluated on the assembly system for soldering electronic parts on a circuit board. A six-axis articulated robot executes assembly task according to the off-line automatic teaching.