• Journal of Institute of Control, Robotics and Systems
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• v.6 no.8
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• pp.710-718
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• 2000

In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.1-6
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• 2019

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

• Journal of the Korean Society for Heat Treatment
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• v.34 no.6
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• pp.281-286
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• 2021

Arc ion plating (AIP), laser cladding, and nitriding are methods that can prevent mold damage or repair and create cracks and breakages on the die surface. The dissolution and soldering behavior of coated SKD61 by using arc ion plating, laser cladding, and nitriding was investigated. The structure of the coating was investigated as a function of deposition conditions by X-ray diffraction and the crystallographic orientation was determined using the texture factor. The TiAlN film deposited with AIP showed excellent corrosion resistance in the molten aluminum alloy at 680℃. In this paper, we have detailed the corrosion and mass loss phenomena associated with these steel-cast metal interactions.

• 한국초전도학회:학술대회논문집
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• v.16
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• pp.70-70
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• 2006

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1531_1532
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• 2009

This paper presents a method of self-arranging solderballs by using surface energy difference. After evaporating Au which has high surface energy on Si substrates, Teflon passivation layer which has low surface energy was patterned by lift-off process. Droplets formed only on the hydrophilic Au solderball lands by the surface energy difference, not the hydrophobic Teflon surface. Scattered solderballs sticked by themselves to the wetted solderball lands on the tilted substrate. After setting preheating of $200^{\circ}C$ and soldering of $245^{\circ}C$ hot plates, the solderballs were soldered on the solderball lands and two substrates were soldered together completely. After measuring the mechanical shear strength of the soldered substrates with solderballs of $3{\times}3$, $4{\times}4$ and $5{\times}5$ arrays. the calculated shear strength per one solderball was 1.1~2.4kgf as high as the previous report.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.21-27
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• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.

• The Journal of Advanced Prosthodontics
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• v.6 no.1
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• pp.39-45
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• 2014

PURPOSE. The aim of the present study was to evaluate the accuracy of three techniques for correction of cast implant bars. MATERIALS AND METHODS. Thirty cast implant bars were fabricated on a metal master model. All cast implant bars were sectioned at 5 mm from the left gold cylinder using a disk of 0.3 mm thickness, and then each group of ten specimens was corrected by gas-air torch soldering, laser welding, and additional casting technique. Three dimensional evaluation including horizontal, vertical, and twisting measurements was based on measurement and comparison of (1) gap distances of the right abutment replica-gold cylinder interface at buccal, distal, lingual side, (2) changes of bar length, and (3) axis angle changes of the right gold cylinders at the step of the post-correction measurements on the three groups with a contact and non-contact coordinate measuring machine. One-way analysis of variance (ANOVA) and paired t-test were performed at the significance level of 5%. RESULTS. Gap distances of the cast implant bars after correction procedure showed no statistically significant difference among groups. Changes in bar length between pre-casting and post-correction measurement were statistically significance among groups. Axis angle changes of the right gold cylinders were not statistically significance among groups. CONCLUSION. There was no statistical significance among three techniques in horizontal, vertical and axial errors. But, gas-air torch soldering technique showed the most consistent and accurate trend in the correction of implant bar error. However, Laser welding technique, showed a large mean and standard deviation in vertical and twisting measurement and might be technique-sensitive method.

• Progress in Superconductivity and Cryogenics
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• v.16 no.2
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• pp.29-32
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• 2014

The critical current, $I_c$ of HTS superconducting tapes can be measured by transport or contactless method. Practically, the transport method using the four-probe method is the most common. In this study, a simple test procedure by clipping the voltage lead taps have been introduced instead of soldering which reduces time and effort and thereby achieving a much faster measurement of $I_c$. When using a pair of iron clips, $I_c$ value decreased as compared with the measured one by standard method using soldered voltage taps and varies with the width of the clipped specimen part. However, when using a pure Cu clip, both by clipping and by soldering voltage taps give a comparable result and $I_c$ measured are equal and close to the samples specification. As a result, material to be used as voltage clip should be considered and should not influence the potential voltage between the leads during $I_c$ measurement. Furthermore, the simulation result of magnetic flux during $I_c$ measurement test showed that the decrease of $I_c$ observed in the experiment is due to the magnetic flux density, $B_y$ produced at the clipped part of the sample by the operating current with iron clips attached to the sample.