• Elastomers and Composites
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• v.34 no.2
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• pp.156-176
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• 1999

Rubber chemicals such as accelerators, antidegradants, vulcanizing agents, processing agents and retarders are very important to the production and protection of tires and rubber goods. The use of accelerators and antidegradants are evaluated in various tire components. This paper will focus on how to vulcanize tires economically and maintain the physical properties of each tire component without severe degradation due to oxygen, heat and ozone. Also, new non-nitrosoamine accelerators and non-staining antiozonants will be discussed. Lastly, the future requirements of antidegradants and accelerators in the tire industry will be reviewed. Tires have been vulcanized with Sulfenamides as primary accelerators and either Guamdine's or Thiurams as secondary accelerators to achieve proper properties at service conditions. However, interior components such as the carcass can be vulcanized with Thiazoles as a primary accelerator to cure faster than the external components. Using the combination of Sulfenamide with secondary accelerators in a tire tread compound and the combination of a Thiazole and Guanidine in a carcass compound will be presented with performance data. Uniroyal Chemical and another Rubber Chemical Manufacturer have developed, "Tetrabenzyl Thiuram Disulfide," (TBzTD) as a non-Nitrosoamine accelerator, which could replace Nitrosoamine generating Thiurams. This new accelerator has been evaluated in a tread compound as a secondary accelerator. Also, Flexsys has developed N-t-butyl-2-benzothiazole Sulfenamide (TBSI) as a non-Nitrosoamine accelerator which could replace 2-(Morpholinothio) -benzothiazole (MBS), a scorch delayed Sulfendamide accelerator. TBSI has been evaluated in a Natural Rubber (NR) belt skim compound vs. MBS. An optimum low rolling resistant cure system has been developed in a NR tread with Dithiomorpholine (DTDM). Also, future requirements for developing accelerators will be discussed such as the replacement of DTDM and other stable crosslink systems. Antidegradants are divided into two different types for use in tire compounds. Internal tire compounds such as apex, carcass, liner, wire breaker, cushion, base tread and bead compounds are protected by antioxidants against degradation from oxygen and heat due to mechanical shear. The external components such as sidewall, chafer and cap tread com-pounds are protected from ozone by antiozonants and waxes. Various kinds of staining and non-staining antioxidants have been evaluated in a tire carcass compound. Also, various para-phenylene diamine antiozonants have been evaluated in a tire sidewall compound to achieve the improved lifetime of the tire. New non-staining antiozonants such as 2, 4, 6-tris-(N-1, 4-dimethylpentyl-p-phenylene diamine) 1, 3, 5 Trizine (D-37) and un-saturated Acetal (AFS) will be discussed in the tire sidewall to achieve better appearance. The future requirements of antidegradants will be presented to improve tire performance such as durability, better appearance and longer lasting tires.

• Proceedings of the Korean Fiber Society Conference
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• 2002.04a
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• pp.367-370
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• 2002

PET, 나일론 등과 같이 타이어코드용으로 사용되는 섬유는 타이어 내에서 계속적인 신장, 굽힘 및 압축변형을 받기 때문에 이들로 인하여 내피로성이 아주 중요한 의미를 가진다. 일반적으로 타이어는 Tread, Bead, Carcass, Sidewall, Belt 등으로 구성되어 있는데, 여기에서 타이어 코드용 섬유는 타이어의 뼈대를 이루는 것으로 타이어의 성능과 수명을 좌우하는 아주 중요한 소재인 것이다[1-2]. (중략)

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.2
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• pp.58-62
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• 2005

A trench MOS barrier Schottky (TMBS) rectifier is proposed which utilizes the upper half of the trench sidewall as an active area. The proposed structure improves the forward voltage drop by 20$\%$ in comparison with the conventional one without degradation in breakdown voltage. An analytical model for the field distribution is given and compared with two-dimensional numerical simulations.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.3
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• pp.478-485
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• 1987

Optimization of the sub-micron N-channel MOSFET with the LDD(Lightly Doped Drain)structure has been investigated. LDD devices with various length of n-region, n-dose and n-implantation species were fabricated for this purpose. It will be shown that LDD devices have lower substrate current by an order of magnitude and higher breakdown voltage than the conventional devices with comparable channel length. Optimized LDD structure has been found when the sidewall thickness is 2500\ulcorner and n-region is phosphorus implantd with the dose of 1.0E13/cm\ulcorner It has been found that transconductance degradation is less than 20%.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1550-1552
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• 2003

고밀도의 트렌치 전력 MOSFET를 제작하는 데 있어서 새로운 소자의 구조와 공정을 제시하고 이차원 소자 및 공정 시뮬레이터를 이용하여 검증했다. 트렌치 게이트 MOSFET의 온-저항을 낮추기 위해 셀 피치가 서브-마이크론으로 발전할 경우 문제가 되는 소오스 영역을 확보하고자 p-base의 음 접촉을 위한 P+ 영역과 N+ 소오스 등이 트렌치의 측벽에 형성되고, 트렌치 게이트는 그 아래에 매몰된 구조를 제안했다. 시뮬레이션 결과는 항복전압이 45 V이고, 온-저항이 12.9m${\Omega}{\cdot}mm^2$로 향상된 trade-off 특성을 보였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.57-58
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• 2007

본 연구에서는 실리콘 식각 공정 중 하나인 BOSCH 공정 이후 문제가 되는 scallops를 후처리 공정인 RCA 클리닝 공정, KOH와 IPA를 이용한 습식식각 공정을 이용하여 제거하는 방법을 개발하였다. 또한 Via-Hole 에칭 공정이후 전기적 절연을 위해 측벽에 증착된 TEOS 표면에 대하여 분석하였다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.20-25
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• 1998

Cu removal rates for various SiO$_2$ trench pitch sizes and densities and AFM images of surface profiles after global planarization using Cu CMP technology are investigated. In the experimental results, Cu removal rates are increasing as the pattern densities and pattern pitches are getting high and low, respectively, and then decreasing after local planarization. The rms roughness after global planarization are about 120$\AA$. AFM images with a 50% pattern density for 1${\mu}{\textrm}{m}$ and 2${\mu}{\textrm}{m}$ pitches show that thicknesses of 120~330$\AA$ Cu interconnects have been peeled off and oxide erosion of Cu/Sio$_2$ sidewall is observed. However, AFM images with a 50% pattern density for 10${\mu}{\textrm}{m}$ and 15${\mu}{\textrm}{m}$ pitches show that 260~340$\AA$ thick Cu interconnects have been trenched at the boundaries of Cu/Sio$_2$ sidewall.

• Progress in Medical Physics
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• v.29 no.1
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• pp.42-46
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• 2018

The purpose of this study was to perform a survey of the radiation shielding design goals (P) and workload (W) based on the radiation safety reports concerned with structural shielding design for the IMRT treatment technique in Tomotherapy vaults. The values of the P and W factors as well as of a verified concrete thickness of the ceiling, bottom, sidewalls (sidewall-1 and sidewall-2), and door have been obtained from radiation safety reports for a total of 16 out of 20 vaults. The recommended and most widely used report for P values was the NCRP No. 151 report, which stated that the P factor in controlled and uncontrolled areas was 0.1 and 0.02 mSv/week, respectively. The range of the W factor was 600~14,720 Gy/week. The absorbed dose delivered per patient was 2~3 Gy. The maximum number of patients treated per day was 10~70. The quality assurance (QA) dose was 100~1,000 Gy/week. Fifteen values of the IMRT factor (F) were mostly used but a maximum of 20 values was also used. The concrete thickness for primary structures including the ceiling, bottom, sidewalls, and door was sufficient for radiation shielding. The P and W factors affect the calculation of the structural shielding design, and several parameters, such as the absorbed dose, patients, QA dose, days and F factor can be varied according to the type of shielding structure. To ensure the safety of the radiation shielding, it is necessary to use the NCRP No. 151 report for the standard recommendation values.

• Journal of Korean Tunnelling and Underground Space Association
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• v.4 no.3
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• pp.185-193
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• 2002

In this paper, deformation behavior of shallow subway tunnel excavated in weathered soil and reinforcement effects of longitudinal support measures are investigated via three dimensional FDM analysis. Two excavation methods, half-face excavation and full-face excavation, are considered in simulation to study the influences of excavation methods on tunnel deformation behavior. In addition, the reinforcing effects of RPUM and fiberglass pipe are compared. Face extrusion, covergence, preconvergence, and sidewall displacement are investigated to analyze tunnel deformation behavior, and surface settlement is used to analyze the effects of excavation methods and longitudinal supports measures. The simulation results show that half-face excavation induces larger convergence, preconvergence, sidewall displacement, surface settlement than full-face excavation, while full-face excavation induces larger extrusion than half-face excavation. In addition, under same excavation method, all displacements are larger when RPUM is only used for longitudinal support than when RPUM is jointly used with fiberglass pipes.

• Journal of Korean Tunnelling and Underground Space Association
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• v.6 no.3
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• pp.247-258
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• 2004

Two 3-dimensional data processing techniques to predict the fractured zone ahead of a tunnel face by the tunnel seismic survey were proposed so that the geometric formation of the fractured zone could be estimated. The first 3-dimensional data processing technique was developed based on the principle of ellipsoid, The input data needed for the 3D migration can be obtained from the 2-dimensional tunnel seismic prediction (TSP) test where the TSP test should be performed in each sidewall of a tunnel. The second 3-dimensional migration technique that was developed based on the concept of wave travel plane was proposed. This technique can be applied when the TSP is operated with sources in one sidewall of a tunnel while the receivers are installed in both sidewalls. New migration technique was applied to an in-situ tunnelling site. The 3-dimensional migration was performed using measured TSP data and its results were compared with the geological investigation results that were monitored during tunnel construction. This comparison revealed that the proposed migration technique could reconstruct the discontinuity planes reasonably well.