• 제목/요약/키워드: side lobe rejection

검색결과 7건 처리시간 0.025초

Design and Fabrication of Reflective Array Type Wideband SAW Dispersive Delay Line

  • Choi Jun-Ho;Yang Jong-Won;Nah Sun-Phil;Jang Won
    • Journal of electromagnetic engineering and science
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    • 제6권2호
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    • pp.110-116
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    • 2006
  • A reflective array type surface acoustic wave(SAW) dispersive delay line(DDL) with high time-bandwidth at the V/UHF-band is designed and fabricated for compressive receiver applications. This type of the SAW DDL has the properties of the relative bandwidth of 20 %, the time delay of 49.89 usec, the insertion loss of 38.5 dB and the side lobe rejection of 39 dB. In comparison with a commercial SAW DDL, the insertion loss, amplitude ripple and side lobe rejection are improved by $1.5dB{\pm}0.6dB$ and 4 dB respectively. Using the fabricated SAW DDL, the prototype of the compressive receiver is developed. It is composed of RF converter, fast tunable LO, chirp LO, A/D converter, signal processing unit and control unit. This prototype system shows a fine frequency resolution of below 30 kHz with high scan rate.

A Switched VCO-based CMOS UWB Transmitter for 3-5 GHz Radar and Communication Systems

  • Choi, Woon-Sung;Park, Myung-Chul;Oh, Hyuk-Jun;Eo, Yun-Seong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제17권3호
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    • pp.326-332
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    • 2017
  • A switched VCO-based UWB transmitter for 3-5 GHz is implemented using $0.18{\mu}m$ CMOS technology. Using RF switch and timing control of DPGs, the uniform RF power and low power consumption are possible regardless of carrier frequency. And gate control of RF switch enables the undesired side lobe rejection sufficiently. The measured pulse width is tunable from 0.5 to 2 ns. The measured energy efficiency per pulse is 4.08% and the power consumption is 0.6 mW at 10 Mbps without the buffer amplifier.

Applications of a Chirping and Tapering Technique on Photonic Band-Gap(PBG) Structures for Bandwidth Improvement

  • Tong Ming-Sze;Kim Hyeong-Seok;Chang Tae-Gyu
    • Journal of electromagnetic engineering and science
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    • 제5권1호
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    • pp.43-47
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    • 2005
  • Microwave or optical photonic band-gap(PBG) structures are conventionally realized by cascading distributive elements in a periodic pattern. However, the frequency bandwidth obtained through such plainly periodic arrangement is typically narrow, corporate with a relatively high rejection side-lobe band. To alleviate such problems, a design involving a chirping and tapering technique is hence introduced and employed. The design has been applied in both a planar stratified dielectric medium as well as a strip-line transmission line structure, and results are validated when compared with the corresponding conventional PBG structure.

2단계 증착 방법에 의한 ZnO 박막의 c-축 배향성 및 비저항 향상에 관한 연구 (A study on the improvement of c-axis preferred orientation and electrical resistivity of ZnO thin films by two-step deposition method)

  • 이혜정;이명호;이진복;서수형;박진석
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1340-1342
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    • 2001
  • ZnO thin films are Prepared on Si(111) substrate by RF magnetron sputtering. Two-step deposition method is proposed to obtain ZnO thin films with high c-axis (002) TC value and electrical resistivity. This method consists of the following two-step deposition procedures: 1st-deposition for 10$\sim$30 min without oxygen at 100W and 2nd-deposition with oxygen added in the range of $O_2/(Ar+O_2)$ = 10 $\sim$ 50%. SAW filters with IDT/ZnO/Si(111) configuration are also fabricated. From the frequency response characteristics, the insertion loss and the side-lobe rejection are estimated.

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다양한 증착변수에 따른 AIN 박막의 물성 및 SAW 소자의 특성 분석 (Effects of Deposition Conditions on Properties of AIN Films and Characteristics of AIN-SAW Devices)

  • 정준필;이명호;이진복;박진석
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제52권8호
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    • pp.319-324
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    • 2003
  • AIN thin films are deposited on Si (100) and $SiO_2$/Si substrates by using an RF magnetron sputtering method and by changing the conditions of deposition variables, such as RF power, $N_2$/Ar flow ratio, and substrate temperature ($T_sub$). For all the deposited AIN films, XRD Peak patterns are monitored to examine the effect of deposition condition on the crystal orientation. Highly (002)-oriented AIN films are obtained at following nominal deposition conditions; RF Power : 350W, $N_2$/Ar ratio = 10/20, T$_{sub}$ : $250^{\circ}C$, and working pressure = 5mTorr, respectively. AIN-based SAW devices are fabricated using a lift-off method by varying the thickness of AIN layer. Insertion losses and side-lobe rejection levels of fabricated SAW devices are extracted from their frequency response characteristics, which are also compared in terms of AIN thickness and substrate. Relationships between the film properties of AIN films and the frequency responses of SAW devices are discussed. It is concluded from the experimental results that the (002)-preferred orientation as well as the surface roughness of AIN film may play a crucial role of determining the device performances of AIN-SAW devices.s.

SiO$_2$ 완충층이 ZnO 박막의 물성 및 IDT/ZnO/SiO$_2$/Si 다층막 구조 표면탄성파 소자의 특성에 미치는 영향 (Effects of SiO$_2$ Buffer Layer on Properties of ZnO thin films and Characteristics of SAW Devices with a Multilayered Configuration of IDT/ZnO/SiO$_2$/Si)

  • 이진복;이명호;박진석
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권9호
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    • pp.417-422
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    • 2002
  • ZnO thin films were deposited on various substrates, such as Si-(111), SiO$_2$(5000 $\AA$ by thermal CVD)/Si-(100), and SiO$_2$(2000 $\AA$ by RF sputtering)/Si-(100). The (002)-orientation, surface morphology and roughness, and electrical resistivity of deposited films were measured and compared in terms of substrate. Surface acoustic wave(SAW) filters with a multilayered configuration of IDT/ZnO/SiO$_2$/Si were also fabricated and the IDT was obtained using a lift-off method. From the frequency-response characteristics of fabricated devices, the insertion loss and side-lobe rejection were estimated. The experimental results showed that the (002)-oriented growth nature of ZnO films, which played a crucial role of determining the characteristic of SAW device, was strong1y dependent upon the SiO$_2$buffer.

위상 배열 안테나를 위한 C-대역 CMOS 양방향 T/R 칩셋 (A C-Band CMOS Bi-Directional T/R Chipset for Phased Array Antenna)

  • 한장훈;김정근
    • 한국전자파학회논문지
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    • 제28권7호
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    • pp.571-575
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    • 2017
  • 논문은 $0.13{\mu}m$ TSMC CMOS 공정을 이용한 위상 배열 안테나의 C-대역 양방향 T/R 칩셋에 관한 연구이다. 위상 배열 안테나의 필수 부품인 T/R 칩셋은 6 비트 위상변위기, 6 비트 가변 감쇄기, 양방향 증폭기로 구성하였다. 위상 변위기의 경우 정밀한 빔 조향을 위해서 $5.625^{\circ}$의 간격으로 최대 $354^{\circ}$까지 제어가 가능하며, 측엽 레벨을 제어하기 위한 가변 감쇄기는 0.5 dB 간격으로 최대 31.5 dB까지 감쇄가 가능하다. 또한, 1.2 V의 안정적인 전원공급을 위한 LDO(Low Drop Output) 레귤레이터와 디지털 회로의 제어가 간편하도록 SPI(Serial Peripheral Interface)를 집적화 하였으며, 칩 크기는 패드를 포함하여 $2.5{\times}1.5mm^2$이다.