• 한국전기전자재료학회논문지
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• 제33권5호
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• pp.350-354
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• 2020

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.105-109
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• 2015

이 연구에서는 자동차용 에어백 작동에 쓰이는 가속 센서에 대해, 그 실장 방법에 따른 신호 전달 차이를 해석하였다. 실장 방법은 기존에 쓰이는 하우징을 사용한 모듈 형태와, 센서를 직접 자동차의 구조물에 접합재를 사용하여 부착하는 두 가지 방법을 고려하였다. 신호 전달을 분석하기 위하여, 충격 실험 장비가 구축되었고, ㄷ자형 알루미늄 채널을 이용하여 그 표면에 기존의 모듈 채결 방법과 센서를 직접 부착하는 방법을 사용하여 시편을 제작하여, 충돌 실험 후 측정된 파형을 비교하여 그 차이를 분석하였다. 또한 유한요소법을 이용하여 충격 실험을 모사하였고, 계산 결과를 실험 데이터와 비교하였다. 그 결과, 기존의 모듈형태의 부착 방법보다, 이 연구에서 제시된 접착제에 의해 직접 부착된 센서가 측정한 신호가 상대적으로 잡음없이 깨끗하고 강한 것을 알 수 있었으며, 또한 에어백 센서와 같은 MEMS 센서는 부착 방법에 따라 주변의 간섭 효과에 의해 그 성능이 크게 변하는 것을 알 수 있었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.517-518
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• 2008

Highly integrated ISFETs require the monolithic implementation of ISFETs, CMOS electronics, and additional sensors on the same chip This paper presents novel packaging type of CMOS ISFET pH sensor using standard CMOS FET chip and extended sensing membrane which is separated from CMOS FET. This proposed packaging type will make it easy to fabricate CMOS ISFET pH sensors

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• 센서학회지
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• 제25권3호
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• pp.173-177
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• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• 월간포장계
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• 통권190호
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• pp.69-73
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• 2009

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.3-4
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• 2004

A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips ($t<50{\mu}m$) are fabricated by chemical etching process to avoid possible surface damages on them. These technologies can be use for a real-time monitoring of blood pressure. Our research targets are implantable blood pressure sensor and its telemetric measurement. By winding round the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국전기전자재료학회논문지
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• 제30권7호
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• pp.407-412
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• 2017

This paper introduces a biocompatible packaging system for implantable medical device having a hermetic sealing, such that a perfect physical and chemical isolation between electronic medical system and human body (including tissue, body fluids, etc.) is obtained. The hermetic packaging includes an electronic MEMS pressure sensor, power charging system, and bluetooth communication system to wirelessly measure variation of capacitance. The packaging was acquired by Quartz direct bonding and $CO_2$ laser welding, with a size of width $ 6cm{\times}length\;10cm{\times}lheight\;3cm$. Hermetic sealing of the packaged system was tested by changing the pressure in a hermetic chamber using a precision pressure controller, from atmospheric to 900 mmHg. We found that the packaged system retained the same count or capacitance values with sensor 1 - 25,500, sensor 2 - 26,000, and sensor 3 - 20,800, at atmospheric as well as 900 mmHg pressure for 5 hours. This result shows that the packaging method has perfect hermetic sealing in any environment of the human body pressure.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.9-9
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• 2000

Accurate counting and packaging pills is one of the most fundamental works of the pharmaceutical industry. But it is so labor consuming and very hard to be automated. As the pharmaceutical industry is growing bigger, the need of counting and packaging automation is increasing to obtain effective mass production. Precise and quick sensing is required in the counting and processing of quickly dropping pills to improve the productivity. There are many trials for this automation and automatic machine. But the performance of the existing counting machine varies with the size, shape and the dispersion degree of pills In this research, authors design the counting and packing machine of medicinal pills that is more accurate and highly trustworthy After getting analog signal from optical sensor, pill passage is discriminated from chosen characteristic feature using microprocessor.