Browse > Article
http://dx.doi.org/10.6117/kmeps.2015.22.4.105

Analyses on Airbag Sensor Signals by Different Packaging  

Kim, Yeong K. (Dept. Convergence Engineering and Managements, Inha University)
Kang, Hyun Jin (Dept. of Mechanical Engineering, Inha University)
Kim, Joon Ki (Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.22, no.4, 2015 , pp. 105-109 More about this Journal
Abstract
In this study, a new airbag sensor packaging technique of directly attachment by adhesive to the automobile frame is introduced. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module attached mechanically by bolts with plastic housing and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analysis was also performed to investigate the signal characteristics created by the sensors. The preliminary results showed that the pattern of the MEMS sensor signal was strongly dependent on the structural behavior of the frame where the sensors were installed, which indicated the complexity of the packaging design for proper airbag deployments.
Keywords
Airbag sensor; Module packaging; MEMS sensor;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 S. Barbat, X. Li and P. Prasad, "Bumper and Grille Airbags Concept for Enhanced Vehicle Compatability in Side Impact: Phase 2", Traffic Injury Prevention, 20, S30 (2013).
2 N. Yoganandan, F. A. Pintar, J. Zhang and T. A. Gennarelli, "Lateral impact injuries with side airbag deployments-A descriptive study", Accident Analysis and Prevention, 39, 22 (2007).   DOI
3 Yeong K. Kim and Dosoon Hwang "Experimental assessment of PBGA packaging reliability under strong random vibrations", J. Microelectron. Packag. Soc., 20(3), 59 (2013).   DOI
4 Yeong K. Kim and Do Soon Hwang, "PBGA packaging reliability assessments under random vibrations for space application", Microelectronics Reliability, 55, 172 (2015).   DOI
5 H. Qi, M. Osterman and M. Pecht, "Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications", IEEE Transactions on Components and Packaging Technologies, 30, 242 (2007).   DOI
6 A. M. Veprik, "Vibration Protection of Critical Components of Electronic Equipment in Harsh Environmental Conditions", Journal of Sound and Vibration, 259, 161 (2003).   DOI
7 R. A. Amy, G. S. Aglietti and G. Richardson, "Reliability analysis of electronic equipment subjected to shock and vibration - A review", Shock and Vibration, 16, 45 (2009).   DOI
8 R. Kronderfer and Yeong. K. Kim, "Packaging Effect on MEMS Pressure Sensor Performance", IEEE Transactions on Components and Packaging Technology, 30(2), 285 (2007).   DOI
9 N. G. Pai, S. A. Tetzlaff and D. P. Hess, "Dynamic Analyses of a Mechanical Airbag System Sensor", Journal of Sound and Vibration, 217, 283 (1998).   DOI
10 R. J. Pryputniewicz, "Current Trends and Future Directions in MEMS", Experimental Mechanics, 52, 289 (2012).   DOI
11 J. D. Turner and L. Austin, "Sensors for automotive telematics", Meas. Sci. Technol., 11, R58 (2000).   DOI