Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Flexible wireless pressure sensor module

  • Shin Kyu-Ho (MEMS Lab, Samsung Advanced Institute of Technology) ;
  • Moon Chang-Ryoul (MEMS Lab, Samsung Advanced Institute of Technology) ;
  • Lee Tae-Hee (School of Mechanical Engineering, Yonsei University) ;
  • Lim Chang-Hyun (School of Mechanical Engineering, Yonsei University) ;
  • Kim Young-Jun (School of Mechanical Engineering, Yonsei University)
  • Published : 2004.11.01
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Abstract

A flexible Packaging scheme, which embedded chip packaging, has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips ($t<50{\mu}m$) are fabricated by chemical etching process to avoid possible surface damages on them. These technologies can be use for a real-time monitoring of blood pressure. Our research targets are implantable blood pressure sensor and its telemetric measurement. By winding round the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel.

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