A Study on the Hermetic Method for Packaging of Implantable Medical Device
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Park, Jae-Soon
(Department of Electronics and Control Engineering, Hanbat National University)
Kim, Sung-Il (Department of Electronics and Control Engineering, Hanbat National University) Kim, Eung-Bo (Department of Electronics and Control Engineering, Hanbat National University) Kang, Young-Hwan (Department of Electronics and Control Engineering, Hanbat National University) Cho, Sung-Hwan (Department of Electronics and Control Engineering, Hanbat National University) Joung, Yeun-Ho (Department of Electronics and Control Engineering, Hanbat National University) |
1 | S. I. Kim, Ph. D. Development of Implantable Pressure Sensor Using MEMS Process and Quartz Wafer Direct Bonding, p. 2-5, Hanbat National University, Daejeon (2015). |
2 | M. A. Fonseca, Polymer/Ceramic Wireless MEMS Pressure Sensors for Harsh Environment, p. 6-12, Georgia Institute of Technology, Atlanta (2007). |
3 | Siemens, MSDS (ProC global), http://175.126.111.63:8080/msds/hemostasis/ProC_Global.pdf (2009). |
4 | J. T. Kim, S. I. Kim, and Y. H. Joung, J. Korean Inst. Electr. Electron. Mater. Eng., 26, 669 (2013). [DOI: http://dx.doi.org/10.4313/JKEM.2013.26.9.669] DOI |
5 | S. J. Myung, T. H. Lee, K. C. Huh, S. C. Choi, and C. I. Sohn, Korean J. Gastroenterol., 55, 316 (2010). [DOI: https://doi.org/10.4166/kjg.2010.55.5.316] DOI |
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