• Title/Summary/Keyword: semiconductor and LCD

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A study of acoustic and vibration character of High volume dry vacuum pumps (대용량 건식 진공펌프의 음향.진동 특성 연구)

  • Shin, Yun-Sang;Cheung, Wan-Sup;Hong, Dong-Pyo;Lim, Jong-Yeon;Kim, Se-Hwan
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2006.05a
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    • pp.1313-1316
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    • 2006
  • Demands of high volume dry vacuum pumps on the domestic semiconductor and LCD industries are rapidly increasing as the size of wafers and LCD is increasing. This study introduces a new experimental setup for testing the reliability of vacuum pumps. The test system was designed to measure the acoustic pressure and mechanical vibration levels simultaneously. It is shown that the test system enables the analysis and evaluation of the performance of dry pumps under the different gas-load conditions. Detailed experimental result are shown to enable us to examine the characteristics and performance of dry pumps.

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A Study on Measures to Improve Smoke Control Performance in Case of Fire in a Clean room as an LCD Manufacturing Process (LCD 제조공정 클린룸의 화재시 CFD를 이용한 제연성능 개선대책에 관한 연구)

  • Son, Bong-Sei;Jang, Chan-Hee
    • Fire Science and Engineering
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    • v.26 no.5
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    • pp.41-47
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    • 2012
  • As a core process in the manufacture of state-of-the-art industrial technologies such as semiconductor and LCD, a clean room is the most important process which can affect the performance and quality of products drastically. Nevertheless, scientific research on comprehensive safety measures from a fire protection standpoint is not being carried out in Korea. This study aims to derive measures to improve smoke control systems by identifying performance and problems of smoke systems installed in clean rooms as an LCD manufacturing process and analyzing fire and evacuation simulations considering several scenarios. As a result of analysis of fires and smoke in a clean roomas an LCD manufacturing process, it is found to be necessary to stop air handling units through interlocking in case of a fire and exhaust smoke out of the room through the top of FAB in consideration of buoyancy of smoke. It is also found to be necessary to install quick response sprinkler heads and accessories to accelerate the response time, because the heat-accumulating performance of sprinkler heads decreases in this application. Despite its low density of dwelling due to the automation process, clean room is characterized by an array of complex production equipment and working environment requiring dustproof clothes, which makes it difficult to acquire evacuation safety performance. Thus, thorough control of danger factors in processes and periodic education and training are required. It is also necessary to establish a level of domestic technologies equivalent to the level of standards of advanced countries in fire protection.

Inter-loop Stocker Automated Material Handling Systems (Inter-loop Stocker 자동 물류시스템)

  • Jo, Min-Ho
    • IE interfaces
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    • v.10 no.1
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    • pp.57-65
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    • 1997
  • Less researches on AGV(Automated Guided Vehicle) path configurations have been conducted so far while more studies have been placed in determining AGV guide path directions and pick-up/drop-off station locations, and routing/dispatching/scheduling strategies. In practice plenty of concerns fall in preventing deadlock and simplifying AGV system control through an appropriate AGV path configuration. In order to meet those requirements, a new AGV path configuration, inter-loop stocker type is introduced here. The stocker serves as relaying material between loops as well as stocking material. Automated material handling systems using AGVs play an important role in semiconductor industry including TFT LCD and memory/non-memory chip. A practical example of implementing the inter-loop stocker concept successfully in the TFT LCD fab is presented in this paper.

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Flicker-reduced memory compression for a volume-zone liquid crystal display overdrive

  • Sasaki, Hisashi;Ishikawa, Tatsuyuki;Ishikawa, Yukio;Ichikawa, Kazuhiro;Saitou, Nobuhiko
    • Journal of Information Display
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    • v.12 no.2
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    • pp.77-83
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    • 2011
  • The memory compression algorithm CCC-LCP (color-count-controlled local color palette) reduces flicker in the liquid crystal display (LCD) overdrive. Its compression ratio is 1:5.4 for 10-bit images, with a 33 dB PSNR peak signal-to-noise ratio and with five times flicker reduction compared with the block truncation coding. The authors' two-alternative forced choice subjective tests proposed two new soundness properties, the 'CMP harmlessness' and 'OD non-lost (or OD liveliness)', to clarify the functional interaction between the overdrive functionality OD and the compression functionality CMP. The tests verified that CCC-LCP is practically applicable (at a 1.2H viewing distance threshold) for 42" 37-ppi WXGA TVs.

A Study on the As Low As Reasonably Practicable (ALARP)-Concept Risk Assessment of Silane in Semiconductor and LCD Process (반도체/LCD 제조공정에서의 Silane에 대한 ALARP개념의 화재 폭발 위험성평가에 관한 연구)

  • Lee, Joong-Hee;Hwang, Seong-Min;Woo, In-Sung
    • Journal of the Korea Safety Management & Science
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    • v.12 no.4
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    • pp.93-98
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    • 2010
  • 본 연구에서는, 반도체, LCD 공정에서 금속막을 증착하기 위하여 PECVD장비에 화재, 폭발 위험성과 독성을 가진 Silane가스를 사용하게 되는 장비인 gas cabinet, pipeline, VMB(Valve manifold box), MFC(mass flow controller)장비 등, 전반적인 시스템에 대하여 영국 HES의 ALARP개념을 도입하여 위험성 평가를 실시하여 문제점을 도출하고 대책을 강구 하는데 목적이 있고, 여러 가지 문제점중 절대적으로 수용 할 수 없는 Critical Risk로는 Gas Cylinder를 사용하여 Silane을 공급하고자 할 때에는 필히 Gas Cabinet을 사용하여 공급하여야 하고, Tube Trailer를 사용하여 공급하고자 할 때에는 필수적으로 Purge System을 갖추어 공급하여야 한다. 선택적으로 수용할 수 있는 High, Medium Risk로는 Gas Cylinder 또는 Tube Trailer를 사용하여 Silane을 공급하고자 할 때는 Inlet 부분에 RFO(Resticted Flow Orifice)를 설치하여 사용하고 Gas Supply Room에는 CO2소화설비를 적용하지 말고 Water Mist등 물 분무설비를 적용하여야한다.

Etching Characteristics of Micro Blaster for MEMS Applications (MEMS 공정에 적용하기 위한 마이크로 블라스터 식각 특성)

  • Cho, Chan-Seob;Bae, Ig-Soon;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.20 no.3
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    • pp.187-192
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    • 2011
  • Abrasive blaster is similar to sand blaster, and effectively removes hard and brittle materials. Exiting abrasive blaster has applied to rough working such as deburring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro abrasive blaster was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro blaster in MEMS process of glass and succeed in domestically producing complete micro blaster. Diameter of hole and width of line in this etching is 100 ${\mu}m$ ~ 1000 ${\mu}m$. Experimental results showed good performance in micro channel and hole in glass wafer. Therefore, this micro blaster could be effectively applied to the micro machining of semiconductor, micro PCR chip.

A Study on Development of Security Detection System for Infant, the Old and the Weak by using TRIZ (TRIZ를 활용한 유아 및 노약자를 위한 안전감지시스템 개발에 관한 연구)

  • Lee, Kook-Hwan;Lee, Kyeong-Won
    • Journal of the Semiconductor & Display Technology
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    • v.7 no.1
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    • pp.59-65
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    • 2008
  • There are no products, systems to manage health and detect security for infant, the old and the weak in Korea. Recently, the concerns of parents are increasing more about all of children(baby, infant, etc) because rate of birth is decreasing gradually. Also, the average span of human life is on an increasing trend according to well-being and evolution of medical treatment. Therefore, this treatise analyzed problems in managing and following-up infant, the old and the weak at present. By using TRIZ to solve problems, we devised new conceptional ideas, detail designs to manage health, detect security, cope with correspondences for them and developed the prototype and tested it. Excellent performances are proved through various field test.

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Model-based Estimation of Production Parameters of Electronics FAB Equipment (모델기반의 전자부품 FAB설비 생산기준정보 추정)

  • Kang, Dong-Hun;Kim, Min-Kyu;Choi, Byoung-Kyu;Park, Bum-Chul
    • Journal of Korean Institute of Industrial Engineers
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    • v.33 no.2
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    • pp.166-173
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    • 2007
  • In this paper, we propose a model-based approach to estimating production parameters of semiconductor FAB equipment. For FAB scheduling, for example, we need to know equipment's production parameters such as flow time, tact time, setup time, and down time. However, these data are not available, and they have to be estimated from material move data such as loading times and unloading times that are automatically collected in modern automated semiconductor FAB. The proposed estimation method may be regarded as a Bayes estimation method because we use additional information about the production parameters. Namely, it is assumed that the technical ranges of production parameters are known. The proposed estimation method has been applied to a LCD FAB, and found to be valid and useful.

분자 드래그 회전자 형상에 따른 복합분자펌프의 배기성능에 관한 실험적 연구

  • Hwang Yeong-Gyu;Gwon Myeong-Geun
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.202-205
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    • 2006
  • Recently, high vacuum pumps are widely used in the semi-conduction and liquid-crystal display ( LCD ) process. The composite-type high vacuum pumps are widely used in the various processes. In this study, the pumping performance of composite-type molecular pumps has been investigated experimentally. The experimented pumps are a compound molecular pump ( CMP ) and hybrid molecular pump ( HMP ). The CMP consists with helical-type drag pump, at lower part, and with turbomolecular pump ( TMP ), at upper part. The HMP consists with disk-type drag pump, at lower part, and with TMP, at upper part. The experiments are performed in the outlet pressure of $0.2\;{\sim}\;533\;Pa$. We have measured the ultimate pressure, compression ratio, and pumping speed

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A Dynamic Structural Design of PC type Sub-Structure for Next-Generation FAB based on Dynamic Test and Simulation (차세대 반도체 FAB의 동적 구조 설계를 위한 PC형 격자보 구조물의 동적 특성 평가)

  • 전종균;김강부;손성완;이홍기
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.4
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    • pp.51-55
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    • 2004
  • In the design stage of high precision manufacturing/inspection FAB facilities, it is necessary to investigate the allowable vibration limits of high precision equipments and to study structural dynamic characteristics of C/R and Sub-structure in order to provide structural vibration criteria to satisfy these allowable limits. The goal of this study is to investigate the dynamic characteristics of PC-Type mock-up structures designed for next generation TFT-LCD FAB through experiments and analysis procedures. Therefore, in order to provide a proper dynamic structural design for high precision manufacturing/inspection work process, these allowable limits must be satisfied.

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