• International Journal of Fuzzy Logic and Intelligent Systems
• /
• v.5 no.2
• /
• pp.140-144
• /
• 2005

We investigate the P-generating functions, L-generating functions, and A-generating function, respectively induced by product t-norms, Lukasiewicz t-norms and additive semi-groups. Furthermore, we investigate the relations among them.

• 한국정보컨버전스학회:학술대회논문집
• /
• 2008.06a
• /
• pp.93-97
• /
• 2008

In this letter, a novel wavelet-based semi-fragile watermarking scheme is presented which exploiting the time-frequency feature of chaotic map. We also analyze the robustness to mild modification and fragility to malicious attack of our scheme. Its application includes tamper detection, image verification and copyright protection of multimedia content. Simulation results show the scheme can detect and localize malicious attacks with high peak signal-to-noise ratio(PSNR), while tolerating certain degree of JPEG compression and channel additive white Gaussian noise(AWGN)

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2006.11a
• /
• pp.166-168
• /
• 2006

$Si_3N_4/SiC$ composite ceramics was sintered in order to investigate their bending strength behavior after crack healing. $Y_2O_$ and $TiO_2$ power was added as sintering additives to enhance it's sintering property. A three-point bending specimen was cut out from sintered plates. About $100\;{\mu}m$ semi-circular surface cracks were made on the center of the tension surface of the three-point bending specimen using Vickers indenter. After the crack-healing processing from $500^{\circ}C$ to $1300^{\circ}C$, for 1 h, in air, the bending strength behavior of these crack-healed specimen coated with $SiO_2$ colloidal were determined systematically at room temperature. $Si_3N_4/SiC$ ceramics using additive powder ($Y_2O_3+TiO_2$) was superior to that of additive powder $Y_2O_3$. The additive powder $TiO_2$ exerted influence at growth of $Si_3N_4$. The optimum crack healing conditions coated $SiO_2$ colloidal were $1000^{\circ}C$ at $Si_3N_4/SiC$ using additive powder ($Y_2O_3+TiO_2$), and $1300^{\circ}C$ at $Si_3N_4/SiC$ using additive powder $Y_2O_3$.

• Journal of Power System Engineering
• /
• v.19 no.1
• /
• pp.45-49
• /
• 2015

This study focuses on the crack-healing behavior and bending strength of SiC ceramics with sintering additives of $SiO_2$colloid. Optimized crack-healing condition was found to be 1hr at an atmosphere of 1373 K. The maximum crack size that can be healed at the optimized condition was a semi-elliptical surface crack of $450{\mu}m$ in diameter. After heat treatment at the optimum temperature in air, the crack morphology almost entirely disappeared and the strength recovered to the value of the smooth specimens at room temperature for the investigated crack sizes up to $450{\mu}m$. The crack with width $1.4{\mu}m$ can be completely heal the surface crack.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.3
• /
• pp.289-296
• /
• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.45-54
• /
• 2020

Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

• The Korean Journal of Applied Statistics
• /
• v.30 no.4
• /
• pp.539-553
• /
• 2017

We propose a multi-state model to analyze semi-competing risks data with interval-censored or missing intermediate events. This model is an extension of the three states of the illness-death model: healthy, disease, and dead. The 'diseased' state can be considered as the intermediate event. Two more states are added into the illness-death model to incorporate the missing events, which are caused by a loss of follow-up before the end of a study. One of them is a state of the lost-to-follow-up (LTF), and the other is an unobservable state that represents an intermediate event experienced after the occurrence of LTF. Given covariates, we employ the Lin and Ying additive hazards model with log-normal frailty and construct a conditional likelihood to estimate transition intensities between states in the multi-state model. A marginalization of the full likelihood is completed using adaptive importance sampling, and the optimal solution of the regression parameters is achieved through an iterative quasi-Newton algorithm. Simulation studies are performed to investigate the finite-sample performance of the proposed estimation method in terms of empirical coverage probability of true regression parameters. Our proposed method is also illustrated with a dataset adapted from Helmer et al. (2001).

• The Journal of the Korea Contents Association
• /
• v.5 no.5
• /
• pp.140-144
• /
• 2005

In this paper, an almost everywhere convergence theorem for seminormed fuzzy co-integrals is showed provided that the fuzzy measure is null-additive.

• Proceedings of the Korea Air Pollution Research Association Conference
• /
• 2001.11a
• /
• pp.293-294
• /
• 2001

자동차 엔진을 구성하는 소재 가공시에 냉각, 절삭용구와 가공표면의 용접현장(welding), 고온에서의 마모방지와 잔열로 인한 비틀림(distortion) 방지 등을 목적으로 사용되는 수용성(soluble) MWFs (Metalworking Fluids)의 기능에 필요한 구성물질인 기유(base oil)와 첨가제(additive)가 건강상 장해를 유발한다고 알려지고 있다(김신범, 1997). 하지만 수용성 MWFs를 사용하여 소재를 가공하는 산업현장에서는 MWFs 미스트 발생제어를 공정 상부에 외부식 후드를 국소적으로 설치하는 것이 일반적인 방법이다(Fig.2). (중략)

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.15 no.1
• /
• pp.51-59
• /
• 2004

We design multilevel coding(MLC) with a semi bit-interleaved coded modulation(BICM) scheme based on low density parity check(LDPC) codes. Different from traditional designs, we joint the MLC and BICM together by using the Gray mapping, which can transmit the multimedia data over several equivalent channels with different code rates. To get a good performance from signal-to-noise ratio(SNR) very close to the capacity of the additive white Gaussian noise(AWGN) channel, random regular LDPC code and a simple semi-algebra LDPC(SA-LDPC) code are discussed in MLC with parallel independent decoding(PID). Finally, the numerical results demonstrate that the proposed scheme could achieve both power and bandwidth efficiency for multimedia communication system.