• 한국자동차공학회논문집
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• 제24권1호
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• pp.16-23
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• 2016

The EWB(electronic wedge brake) is one in which the braking force is developed in a wedge and caliper system and applied to a disk and wedge mechanism. The advantage of the wedge structure is that it produces self-reinforcing effect and hence, utilizes minimal motor power, resulting in reduced gear and current. The extent of use of clamping force sensors and protection from failure of the EWB system directly depends on the level of vehicle mass production. This study investigated the mathematical equations, simulation modeling, and failsafe control algorithm for the clamping force sensor of the EWB and validated the simulations. As this EWB system modeling can be applied to motor inductance, resistance, screw inertia, stiffness, and wedge mass and angle, this study could improve the accuracy of simulation of the EWB. The simulation results demonstrated the braking force, motor speed, and current of the EWB system when the driver desired to the step and pulse the brake force inputs. Moreover, this paper demonstrated that the proposed failsafe control algorithm accurately detects faults in the clamping force sensor, if any.

• Journal of Electrical Engineering and Technology
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• 제9권5호
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• pp.1623-1631
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• 2014

Eccentricity faults more or less exist in all rotating electrical machines. This paper establishes a more precise model of dynamic eccentricity (DE) in electrical machines named as curved dynamic eccentricity. It is a kind of axial unequal eccentricity which has not been investigated in detail so far but occurs in large electrical machines. The inductances of a large three-phase squirrel-cage induction machine (SCIM) under different levels of curved DE conditions are evaluated using winding function approach (WFA). These inductances include the stator self and mutual inductances, rotor self and mutual inductances, and mutual inductances between stator phases and rotor loops. A comparison is made between the calculation results under curved DE and the corresponding pure DE conditions. It indicates that the eccentricity condition will be more terrible than the monitored eccentricity based on the conventional pure DE model.

• 한국전자파학회논문지
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• 제21권6호
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• pp.564-572
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• 2010

본 논문에서는 자기 공명 방식의 무선 전력 전송 시스템에서 공진 코일의 배열에 따른 특성을 제시한다. 공진 코일에는 헬리컬 구조를 사용하였다. 공진 코일을 설계하기 위해 헬리컬 코일의 인덕턴스와 커패시턴스를 구하였다. 유한 요소법을 이용하여 설계된 공진 코일을 시뮬레이션 하였고, 송수전 공진 코일 간의 다양한 배열에 대한 특성을 해석하였다. 검증을 위하여 시제품을 제작하였고, 수직 및 평행 배열일 때의 효율을 측정하였다. 측정 결과, 평행 배열일 때는 50 %의 전달 효율을 얻을 수 있는 구간이 코일 지름의 2배 이내였고, 수직 배열일때는 코일 지름의 1.5배 이내였다. 제작한 시제품은 평행 배열된 송수전 공진 코일이 40 cm 간격일 때 최대 84.25 %의 효율을 보였다.

• 한국초전도ㆍ저온공학회논문지
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• 제6권2호
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• pp.20-24
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• 2004

Bi-2223 wire, the first-generation high temperature superconducting (HTS) wire, was successfully commercialized and various electrical machinery and equipment are actively being developed in many countries. Because its critical current is too small to realize the lossless conducting part of electric power system with a HTS wire, multi-HTS paths are used to enlarge the critical current of HTS system. Though the resistance generated in HTS wire by transport current is very small, the difference of it in multi-path is the additional reason which causes the non-uniform current sharing in multi-HTS path except the well known reason, the difference of inductance between each path. In this paper, experimental research on current sharing of multi-strand and multi-stacked HTS wire was implemented. The whole critical current of multi-HTS paths is not equal to sum of critical current of each path because of non-uniform current sharing occurred in this paths. It was verified experimentally that Bi-2223 wires have different resistance generated by same transport current even if they was manufactured in same progress of work. Current sharing phenomenon was affected by difference of resistance and self and mutual inductance.

• 한국진공학회지
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• 제19권1호
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• pp.72-80
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• 2010

KSTAR ICRF 시스템에서 안테나 전류띠 간 커플링에 의한 전류띠의 전압, 전류 분포 변화와 전류띠 간 전력 전달에 의한 공명현상 그리고 전송선상의 이상 전압 분포 등을 예측하거나 분석하는 것은 그것의 안정적이고 신뢰성 있는 운전을 위해 매우 중요하다. 본 연구에서는 이러한 전류띠 간 커플링에 의한 현상들을 이해하기 위해 ICRF 안테나에서 측정한 S-parameter를 커플링이 고려된 8포트 전송선회로 모델에 적용하여 전류띠의 전송선 회로 모델을 완성하였다. 완성된 전송선 회로모델의 자체유도계수, 상호유도계수, 전기용량성 등은 전류띠의 유한한 길이로 인하여 2D 모델의 값보다 작은 것으로 나타났다. 커플링이 고려된 전류띠의 전송선 회로모델은 공명루프와 결합되어 있는 KSTAR ICRF 시스템의 운전에 활용될 것이다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권7호
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• pp.339-343
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• 2006

In this study, the variations of the important characteristics of solenoid-type RF chip inductors utilizing a low-loss A1203 core material on inductor dimensions were investigated systematically. Four dimensions of the chip inductors fabricated in this work were $1.0\times0.5\times0.5mm^3,\;1.5\times1.0\times0.7mm^3,\;2.1\times1.5\times1.0mm^3,\;and\;2.4\times2.0\times1.4mm^3$ and copper (Cu) wire with $40{\mu}m$ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors as a function of inductor dimensions were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 6 have the inductance (L) of 12 to 82 nH and exhibit the self-resonant frequency (SRE) of 3.6 to 1.2 GHz. The SRF of inductors decreases with increasing the inductor size while the L increases with the inductor size. The smallest inductors of $1.0\times0.5\times0.5mm^3$ exhibited the L of 12 nH, SRF of 3.6 GHz, and the quality factor of 67 near the frequency of 1.1 GHz. The calculated data predicted the high-frequency data of the L, and Q of the developed inductors well.

• 대한전자공학회논문지SD
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• 제41권10호
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• pp.31-39
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• 2004

이 논문은 파워 잡음 특성이 칩(chip)의 코아 동작에 따라 DDR DRAM용 모듈(Module)과 패키지(package)의 종류의 영향을 받는 다는 것을 보여주고 있다. 이를 분석하기 위해 상용 TSOP-based DIMM 과 FBGA-based DIMM에서 FBGA와 TSOP 패키지형 DRAM 칩을 가지고 임피던스 모양과 파워 잡음을 분석하였다. 일반적인 상식과 달리, FBGA 패키지의 잡음 격리 특성이 TSOP 패키지의 잡음 격리 특성보다 전달되는 잡음에 더 약하고 민감하다는 것이 발견되었다. 또한 자체 및 전달 잡음 특성을 조절하는데 있어서는 모듈상의 디커풀링 커패시터(decoupling capacitors)들 위치가 패키지 자체의 리드선 인덕턴스(lead inductance)보다 더 중요하다는 것을 또한 시뮬레이션 결과들은 보여준다. 따라서 잡음 억제나 잡음 전달로부터 격리의 목표설정 값을 만족시키는 것은 패키지 형태 뿐 아니라 모듈 전체를 고려한 파워 분배 시스템의 설계를 통해서만 얻어질수 있다.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제51권1호
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• pp.23-33
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• 2002

A hysteresis control is widely used to control output current of inverter. A hysteresis bandwidth is affected by system parameters such as source voltage, device on/off time, load inductance and resistance. The frequency limiter is used to protect switching devices overload. In the conventional hysteresis controller, a lock-out circuit with D-latch and timer is used to device protection circuit. But switching delay time and harmonic components are appeared in output current. In this paper the performance of lock-out circuit is tested, and new circuit for switching device fault protection is proposed ad it's performance is simulated.

• Journal of Advanced Marine Engineering and Technology
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• 제31권2호
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• pp.190-196
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• 2007

This paper presents the 3D finite element analysis of the Contact-less Power Supply(CPS) with linear servo motor. The primary, secondary self and leakage inductances of the contact-less power supply and the capacitances of a resonant circuit are calculated by the finite element analysis using current source. The voltage source is used to do accurate analysis of the characteristics of the contact-less power supply. The CPS with the linear servo motor is proposed. The characteristics analysis of the contact-less power supply considering the linear servo motor is done.

• 전자공학회논문지A
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• 제33A권7호
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• pp.92-98
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• 1996

parallel bonding wires separaated with a screeing bonding wire are proposed and characterized in order to redue mutual coupling and parasitics of high-speed and high-density device packaging. The mehtod of moments (MoM) with the incorporation of the ohmic loss has been used in a wide range of frequencies. From the calculated results, we have found that the screening bonding wire effectively reduces inductive and capacitive crostalk levels more than 3dB. the parasitic self inductance is also reduced more than 12% by the screening effect. Therefore, for a general VLSi package, the packaging density can be increased more than 30% using the screening bonding wire. This screeing bonding wire and the analysis can be effectively used to reduce crosstalk and increase packaging density of high density devices.