• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.114-118
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• 2006

In this paper, the effect of base and collector structures on DC, small signal characteristics of SiGe HBTs fabricated by RPCVD was investigated. The structure of SiGe HBTs was designed into four types as follows: SiGe HBT structures which are standard, apply extrinsic-base SEG selective epitaxial growth (SEG), apply selective collector implantation (SCI), and apply both extrinsic-base SEG and SCI. We verified the devices could be applied to the fabrication of RFIC chip through a fully integrated 2.4 GHz down-conversion mixer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.151-154
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• 2002

AP/RPCVD를 이용하여 $650^{\circ}C$의 저온에서 실리콘-게르마늄의 선택적 단결정 성장 (Selective Epitaxy Growth: SEG) 을 수행하였다. 본 실험에서는 $SiH_4$, $GeH_4$ 그리고 HCl 가스를 사용하여 잠입시간 동안 실리콘-게르마늄막을 성장시키고 연속해서 HCI 가스만을 주입하여 산화막 위에 형성되어진 작은 결정입자들을 식각하는 공정을 반복적으로 수행하였다. HCl 의 식각에 의해 한 주기의 잠입기 후에도 다시 잠입기가 존재함을 확인하였고, 이 성장법을 통하여 한 주기의 잠업시간 동안 증착할 수 있는 두께 이상으로 실리콘-게르마늄막의 선택적 성장이 가능하였다. 이는 저온 선택적 실리콘-게르마늄 성장 시 RPCVD에서 보이는 낮은 선택성과 $SiH_4$의 짧은 장입시간으로 인해 원하는 두께까지 확보하기 힘든 단점을 극복한 것이다. 선택성을 향상시키기 위해 실리콘-게르마늄 증착중 주입된 HCI의 유량에 따라 잠입시간과 증착속도에 영향을 주었으며, 연속공정을 위한 식각공정은 20sccm의 HCI을 20초간 주입하여 선택성을 유지하였다. 또한 보론 불순물의 첨가가 선택적으로 성장되는 박막의 결정성에 미치는 영향도 분석되었다.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1288-1290
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• 1998

Three most dominant reactions are adsorption, movement, and desorption of $SiCl_2$ on silicon surface. $SiCl_2$ plays a key role in these dominant reactions. In this paper, surface reactions of $SiH_2Cl_2-H_2-HCl$ system are investigated and few dominant reactions were identified. An equation for Si net growth rate is derived from the analysis of these reactions and it is compared with experimental results of Bolem and Classen.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1999.06a
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• pp.115-127
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• 1999

The charged clusters or particles, which contain hundreds to thousands of atoms or even more, are suggested to form in the gas phase in the thin film processes such as CVD, thermal evaporation, laser ablation, and flame deposition. All of these processes are also used in the gas phase synthesis of the nanoparticles. Ion-induced or photo-induced nucleation is the main mechanism for the formation of these nanoclusters or nanoparticles inthe gas phase. Charged clusters can make a dense film because of its self-organizing characteristics while neutral ones make a porous skeletal structure because of its Brownian coagulation. The charged cluster model can successfully explain the unusual phenomenon of simultaneous deposition and etching taking place in diamond and silicon CVD processes. It also provides a new interpretation on the selective deposition on a conducting material in the CVDd process. The epitaxial sticking of the charged clusters on the growing surface is gettign difficult as the cluster size increases, resulting in the nanostructure such as cauliflowr or granular structures.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.9 no.3
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• pp.289-294
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• 1999

The charged clusters or particles, which contain hundreds to thousands of atoms or even more, are suggested to from in the gas phase in the thin film processes such as CVD, thermal evaporation, laser ablation, and flame deposition. All of these processes are also phase synthesis of the nanoparticels. Ion-induced or photo-induced nucleation is the main mechanism for the formation of these nanoclusters or nanoparticles in the gas phase. Charge clusters can make a dense film because of its self-organizing characteristics while neutral ones make a porous skeletal structure because of its Brownian coagulation. The charged cluster model can successfully explain the unusual phenomenon of simultaneous deposition and etching taking place in diamond and silicon CVD processes. It also provides a new interpretation on the selective deposition on a conducting material in the CVD process. The epitaxial sticking of the charged clusters on the growing surface is getting difficult as the cluster size increases, resulting in the nanostructure such as cauliflower or granular structures.

• ETRI Journal
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• v.25 no.4
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• pp.247-252
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• 2003

This paper presents results from experiments on laser-annealed SiGe-selective epitaxial growth (LA-SiGe-SEG). The SiGe-SEG technology is attractive for devices that require a low band gap and high mobility. However, it is difficult to make such devices because the SiGe and the highly doped region in the SiGe layer limit the thermal budget. This results in leakage and transient enhanced diffusion. To solve these problems, we grew in situ doped SiGe SEG film and annealed it on an XMR5121 high power XeCl excimer laser system. We successfully demonstrated this LA-SiGe-SEG technique with highly doped Ge and an ultra shallow junction on p-type Si (100). Analyzing the doping profiles of phosphorus, Ge compositions, surface morphology, and electric characteristics, we confirmed that the LA-SiGe-SEG technology is suitable for fabricating high-speed, low-power devices.

• Transactions on Electrical and Electronic Materials
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• v.1 no.4
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• pp.1-6
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• 2000

The mechanical strength of silicon carbide dose nor permit the use of diffusion as a means to achieve selective doping as required by most electronic devices. While epitaxial layers may be doped during growth, ion implantation is needed to define such regions as drain and source wells, junction isolation regions, and so on. Ion activation without an annealing cap results in serious crystal damage as these activation processes must be carried out at temperatures on the order of 1600$^{\circ}C$. Ion implanted silicon carbide that is annealed in either a vacuum or argon environment usually results in a surface morphology that is highly irregular due to the out diffusion of Si atoms. We have developed and report a successful process of using silicon overpressure, provided by silane in a CAD reactor during the anneal, to prevent the destruction of the silicon carbide surface, This process has proved to be robust and has resulted in ion activation at a annealing temperature of 1600$^{\circ}C$ without degradation of the crystal surface as determined by AFM and RBS. In addition XPS was used to look at the surface and near surface chemical states for annealing temperatures of up to 1700$^{\circ}C$. The surface and near surface regions to approximately 6 nm in depth was observed to contain no free silicon or other impurities thus indicating that the process developed results in an atomically clean SiC surface and near surface region within the detection limits of the instrument(${\pm}$1 at %).

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.238-238
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• 2016

백색 발광다이오드(LED)는 기존 조명(백열등, 형광등)에 비하여 월등히 에너지를 절약할 수 있어 이미 상업적, 정책적으로 교체가 진행 중이다. 현재의 백색 LED를 만들기 위해서는 필연적으로 형광체를 사용해야 한다. 그러나 이 형광체에 의한 (a)Stocks 에너지변환에 의한 효율감소, (b)높은 공정비용, (c) 열적 안정성 저하를 피할 수 없다. 우리는 유기금속화학증착(MOCVD)과 선택적성장(selective-area epitaxial growth)방법을 이용하여 형광체를 쓰지 않고 3차원 구조체를 이용하여 백색 LED를 제작하여 전기구동하였고 전류의 세기를 변화하여도 지속적으로 동일한 백색광을 유지함을 보였다. 광학적 분석(cathodoluminescence)과 구조적 분석(scanning electron microscope, transmission electron microscope)을 진행하여 구조를 살피고 백색 발광의 원인을 분석하였다. 또한, 고배율 대물렌즈를 사용한 공간분해 광학적 분석실험(photoluminescence와 electroluminescence 데이터를 비교)으로부터 국소적 운반자의 주입효율을 분석하는 방법을 고안하여 실험하였다.[1] 향후 이 방법은 3차원 구조체 LED뿐 아니라 2차원 LED에도 응용하여 LED의 주입효율을 분석하는데 유용하게 사용될 수 있을 것이라 기대된다.

• Journal of the Korean Vacuum Society
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• v.3 no.4
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• pp.466-481
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• 1994

차세대 집적회로 제조공정에 있어 핵심기술인 선택적 단결정 실리콘 성장공정에 대한 이동현상, 열역학, 미시적 전산모사를 수행하여 다각적인 분석과 이해를 시도하였다. 첫째, 실리콘 단결정 성장 공 정에 가장 많이 사용되는 배럴 반응기를 대상으로 유한 요소법을 이용하여 이동현상적 이론연구를 수행 하였다. 반응기내의 기체속도 분포, SiH2Cl2 농도분포를 각각 구하였으며 압력, 기판온도, 총유량 HCl 유 량변화 등의주요공정변수가 증착율과 균일도 지수에 미치는 영햐을 고찰하였다. 이러한 연구를 통하여 저온, 저압, 총유량이 많고 첨가되는 HCl 유량이 작은 경우가 균일도 확보를 위하여 적합한 조업조건임 을 알수 있었다. 둘째 Si-H-Cl 계에 대한 열역학적 기체의 Cl/H비가 낮은 경우가 선택적 실리콘 증착 에 적합함을 알수 있었다. 셋째, Monte Carlo법을 이용한 선택적 실리콘 미세박막 성장패턴에 관한 이 론 연구를 수행하여 종횡비, 재방출, 표면확산에 따른 박막증착 패턴의 변화를 고찰하였으며 표면확산이 선택도 상실 현상의 중요한 원인이 될 수 있음을 발견하였다. 또한 최상의 선택도 확보를위해서는 낮은 부착계수와 낮은 표면확산계수를 유지해야 됨을 알수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.823-829
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• 2004

In this paper, non-self-aligned SiGe HBTs with ${f}_\tau$ and${f}_max $above 50 GHz have been fabricated using an RPCVD(Reduced Pressure Chemical Vapor Deposition) system for wireless applications. In the proposed structure, in-situ boron doped selective epitaxial growth(BDSEG) and TiSi$_2$ were used for the base electrode to reduce base resistance and in-situ phosphorus doped polysilicon was used for the emitter electrode to reduce emitter resistance. SiGe base profiles and collector design methodology to increase ${f}_\tau$ and${f}_max $ are discussed in detail. Two SiGe HBTs with the collector-emitter breakdown voltages ${BV}_CEO$ of 3 V and 6 V were fabricated using SIC(selective ion-implanted collector) implantation. Fabricated SiGe HBTs have a current gain of 265 ∼ 285 and Early voltage of 102 ∼ 120 V, respectively. For the $1\times{8}_\mu{m}^2$ emitter, a SiGe HBT with ${BV}_CEO$= 6 V shows a cut-off frequency, ${f}_\tau$of 24.3 GHz and a maximum oscillation frequency, ${f}_max $of 47.6 GHz at $I_c$of 3.7 mA and$V_CE$ of 4 V. A SiGe HBT with ${BV}_CEO$ = 3 V shows ${f}_\tau$of 50.8 GHz and ${f}_max $ of 52.2 GHz at $I_c$ of 14.7 mA and $V_CE$ of 2 V.