• Transactions on Electrical and Electronic Materials
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• v.12 no.6
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• pp.271-274
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• 2011

Screen-printed source and drain electrodes were used for a spin-coated and inkjet-processed zinc-tin oxide (ZTO) TFTs for the first time. Source and drain were silver nanoparticles. Channel length was patterned using screen printing technology. Different silver nanoinks and process parameters were tested to find optimal source and drain contacts Relatively good electrical properties of a screen-printed inkjet-processed oxide TFT were obtained as follows; a mobility of 1.20 $cm^2$/Vs, an on-off current ratio of $10^6$, a Vth of 5.4 V and a subthreshold swing of 1.5 V/dec.

• 한국태양에너지학회:학술대회논문집
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• 2011.04a
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• pp.293-298
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• 2011

The most widely used method to form an electrode in industrial solar cells are screen printing. Screen printing is characterized by a relatively simple and well-known production sequence with high throughput rates. However the method is difficult to implement a fine line width of high-efficiency solar cells can not be made. The open circuit voltage(Voc) and the short circuit current density(Jsc) and fill factor(FF) need to be further improved to increase the efficiency of silicon solar cells. In this study, gravure offset printing method using the multicrystalline-silicon solar cells were fabricated. Gravure off-set printing method which can print the fine line width of finger electrode can have the ability reduce the shaded area and increase the Jsc. Moreover it can make a high aspect ratio thereby series resistance is reduced and FF is increased. Approximately $50{\mu}m$ line width with $35{\mu}m$ height was achieved. The efficiency of gravure off set was 0.7% higher compare to that of scree printing method.

• Transactions on Electrical and Electronic Materials
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• v.8 no.6
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• pp.241-245
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• 2007

[ $(Ba_{0.9-x}Sr_xCa_{0.10})TiO_3$ ] (x=0.33, 0.36) powders were prepared by sol-gel method. $(Ba,Sr,Ca)TiO_3$(BSCT) thick films, undoped and doped with $MnCO_3$ and $Yb_2O_3(0.1{\sim}0.7mol%)$, were fabricated by the screen printing method on the alumina substrate. The coating and drying procedure was repeated 6-times. The Pt bottom electrode was screen printing method on the alumina substrate. These BSCT thick films were annealed at $1420^{\circ}C$ for 2 hr in atmosphere. The upper electrodes were fabricated by screen printing the Ag paste and then firing at $590^{\circ}C$ for 10 min. And then the structured and dielectric properties as a function of the doping amount of $Yb_2O_3$ were studied. As a result of the TG-DTA, exothermic peak was observed at around $670^{\circ}C$ due to the formation of the polycrystalline perovskite phase. All BSCT thick films showed XRD patterns of typical cubic peroveskite structure. The average thickness of BSCT thick films was about $70^{\mu}m$. The curie temperature and the dielectric constant decreased with increasing $Yb_2O_3$ doped content and the relative dielectric constant of the specimen, doped with 0.5 mol% $Yb_2O_3$ at BSCT(54/36/10), showed a best value of 5018 at curie temperature.

• Journal of the Korean Graphic Arts Communication Society
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• v.30 no.1
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• pp.47-58
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• 2012

The inorganic powder EL lamp was made by screen printing technique with a phosphor ink and a dielectric ink. Value of color coordinates X and Y increased under the condition of supplying driving power to the inorganic powder EL lamp and changing voltage with constant frequency. When frequency was changed under the constant voltage, value of color coordinates X and Y were decreased with increasing frequency. However, level of change of color coordinates X was different from color coordinates Y. When voltage was increased under constant frequency, changing degree of color coordinates X and Y shows similarity. But under the constant voltage with changing frequency, color coordinates X and Y were differently changed that degree of change of color coordinates Y showed five times more than that of color coordinates X. As increasing thickness of phosphor ink and dielectric ink, level of voltage and frequency, color coordinates X and Y were slightly changed. According to the thickness of phosphor ink and dielectric ink, and level of voltage and frequency, color coordinate of color light was changed. Frequency was most important element influencing on the change of color coordinate.

• Textile Coloration and Finishing
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• v.23 no.3
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• pp.169-178
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• 2011

The purpose of this study is to develop eco-printing method using natural dyes combined with chitosan treatment to impart various pattern effect on cotton fabric. It was examined whether tone-on-tone pattern effects could be produced by screen printing with chitosan paste and subsequently dip-dyed in natural dye bath. For polychromic colorants, fabrics were pre-mordanted and then screen printed with chitosan, while only chitosan printing treatment was applied for monochromic colorants. Color, dye uptake, washing, light and rubbing fastnesses of printed fabrics were measured in relation to the presence of chitosan printing. Pre-mordanting and chitosan printing treatment were applied to such polychromic colorants as madder, sappanwood, onion and cochineal. Also, printing pattern formation on fabrics was evaluated by differences in dye uptake and color. The results suggested that madder, onion and cochineal were effective on pattern formation. Regarding sappanwood, since dye uptake was increased only by pre-mordanting without chitosan printing treatment, there was little color difference and thus patterns were not clearly distinguished. Chitosan printing treatment tended to increase washing, light and rubbing fastnesses of dyed fabrics with polychromic colorants. Chitosan printing treatment was applied to monochromic colorants such as chlorophyll, gardenia and indigo and the effect of printing formation was examined according to the difference in dye uptake. Among monochromic dyes tried, chlorophyll was effective and chitosan printing improved washing and light fastnesses.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.72-77
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• 2008

This paper investgated on fabrication process and tolerance of resistance body with a uniform thickness formed by the process of cavity type on organic substrate for application of embedded resistor. To improve the tolerance of resistance value according to a position of PCB cause by conventional screen printing, we introduced the process of cavity type from organic substrate. A resistor with a desired shape and volume was precisely formed by the process of cavity using a resistor paste and screen printing. This method can increase PCB's productivity by shortening its production time because process conditions of a screen prining device can be set quickly without any affection on its position accuracy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.4
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• pp.209-216
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• 2014

The screen printed technique is one of the electrode forming technologies for crystalline silicon solar cell. It has the advantage that can raise the production efficiency due to simple process. The electrode technology is the core process because the electrode feature is given a substantial factor (for solar cell efficiency). In this paper, we tried to change conditions such as squeegee angle $55{\sim}75^{\circ}$, snap off 0.5~1.75 mm, printing pressure 0.6~0.3 MPa and 1.6~2.0 mm finger spacing. As a result, the screen printing process showed an improved performance with an increased height higher finger height. Optimization of fabrication process has achieved 17.48% efficiency at screen mesh of 1.6 mm finger spacing.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.4.1-4.1
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• 2011

Recently, circuit printing technology has been considered as a promising alternative to conventional PCB fabrication, for it can greatly reduce the manufacturing costs. Even though printed circuit has many advantages over typical subtractive technology such as fewer processes, it has some disadvantages. The major problems are low adhesion and poor resolution. Efforts to overcome these problems have been mainly focused on ink developments with a limited success. And surface treatments showed some improvements. Therefore, various plasma treatments and primer coatings on plastic substrates have been tested. Plasma treatments using hydrocarbon gases including methane and propane improved the pattern quality of the inkjet printed circuit, which are further improved upon heating of substrate. On the other hand, there is little effect on the adhesion, which is improved only by a special primer coating. The adhesion of inkjet printed circuit has been increased more than 10 times upon treatment. As for the screen printed circuits, the overall effects are less significant since there is some organic binder in the ink. Nonetheless, the treatment has strong positive effects on pattern quality and adhesion. The adhesion of 1 kgf/cm2, which is comparable with those of the conventional PCB circuits, is possible through primer coating for both screen and inkjet printed circuits. The resulting circuit also showed good thermal, mechanical and electrical properties.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.15-22
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• 1999

Generally, many equipments and a long lead time ale required to manufacture the build-up multilayer board through various processes such as etching, plating, drilling etc. Wet process is suitable for mass production, however it is not adequate for manufacturing prototype in developing stage. In this study, a silk screen printing technology is introduced to make a prototype build-up multilayer board. As for the material photo/thermal curable resin and conductive paste are used for forming dielectric and conductor. And conductive paste fills vias for interconnecting each layer, and also is used for circuit patterning by silk screen technology. Finally, the basic concept and the possibility of build-up multilayer board prototype is proposed and verified as a powerful approach, compared with the conventional processes.

• Proceedings of the Korean Printing Society Conference
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• 2001.06a
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• pp.120-126
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• 2001