• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.189-192
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• 2001

Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP nprocess, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.691-694
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• 1996

Two models of scratch testers developed recently are applied to the adhesion measurement of thin coatings. In both models the critical load is determined from the frictional irregularity when coated surface is broken in the scratching process. One model is effective for coatings thicker than 1m and the other for thin coatings down to $0.1\mu\textrm{m}$. The mechanism and the measurement principle of these testers are described. High sensitivity and good reproducibility of the measurement are attained primarily by the employment of new detection devices. These testers are even more useful for the quality control and the inspection of commercial products of coatings because only a small area of specimen is required for the test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.189-192
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• 2001

Recently, STI process is getting attention as a necessary technology for making high density of semiconductor by devices isolation method. However, it does have various problems caused by CMP process, such as torn oxide defects, nitride residues on oxide, damages of si active region, contaminations due to post-CMP cleaning, difficulty of accurate end point detection in CMP process, etc. In this work, the various defects induced by CMP process was introduced and the above mentioned Problems of CMP process was examined in detail. Finally, the guideline of future CMP process was presented to reduce the effects of these defects.

• Journal of the Korean Society of Safety
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• v.27 no.3
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• pp.20-27
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• 2012

Mechanical seals are one of main components of high speed centrifugal pumps. So, it is very important to detect the faults (scratch, notch, indentation, wear) of mechanical seals since the damage of seal can cause a critical failures or accidents of machinery system. In the past, many researchers mainly performed to detect the seal fault using the time signals measured from sensors. Recently, studies are focused on the development of on-line real time monitoring system. But study on the feature parameters used for fault detection of mechanical seals has a little been performed. In this paper, we showed feature parameters extracted from accelerated and acoustic signals by using the discrete wavelet transform (DWT), alpha coefficient, statistical parameters. And also verified the possibility for fault detection of mechanical seal.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.6
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• pp.3376-3382
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• 2014

The system developed inspects automatically defects existing on an inner surface of anodically treated aluminum cylinder-tubes. This system consists of automatic inspection software, and electronic endoscope and a conveyor moving device. By applying the optimal brightness conditions to searching for various defects on the inner surface of cylinder tube, the recognition rate of major defects, such as scratch, oxide and weld line reached 99%. If the present visual inspection process is replaced with the automatic defects inspection system, the physical fatigue of the operator could be reduced and the productivity could be increased. The automatic inspection system developed could also improve the quality of the products.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.43-48
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• 2017

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.1
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• pp.120-124
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• 2010

This paper presents a method that can automatically detect variety of degradations (i.e., scratches and blotches) in old film archive. The proposed method consists of candidate detection and verification. Degradations are first identified by finding the local extreme of a frame in spatiotemporal domains, thereby using edge detector and SROD detector. Then, to remove some false alarms occurred in the first stages, the verification is performed using the texture and shape properties of scratches and blotches. The textural properties of scratches and blotches are learned using neural networks (NNs) and their shapes are represented using morphological filters. The experiments were performed on several old films, then the results demonstrated the effectiveness of the proposed method, where it has a precision of 81% and a recall of 79%.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.4
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• pp.406-414
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• 1997

A real-time inspection system is developed using line scan cameras. Several improved algorithms are proposed for real-time detection of defects in this automated inspection system. The major improved algorithms include the preprocessing, the threshold decision, and the clustering algorithms. The preprocessing algorithms are for exact binarization and the threshold decision algorithm is for fast detection of defects in 1-D binary images. The clustering algorithm is also developed for fast classifying of the defects. The system is applied to PCBs(Printed Circuit Boards) inspection. The typical defects in PCBs are pits, dent, wrinkle, scratch, and black spots. The results show that most defects are detected and classified successfully.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.10
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.2
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• pp.308-314
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• 2006

A line scan camera is applied to enhance COG(Chip On Glass) inspection accuracy to be measured a few micro unit. The foreign substance detection among various faulty factors has been the most difficult technology in the faulty automatic inspection step since COG pattern is very miniature and complexity. In this paper, we proposed two step area segmentation template matching method to increase matching speed. Futhermore to detect foreign substance(such as dust, scratch) with a few micro unit, the new method using gradient mask and AND operation was proposed. The proposed 2 step template matching method increased 0.3 - 0.4 second matching speed compared with conventional correlation coefficient. Also, the proposed foreign substance applied masks enhanced $5-8\%$ faulty detection rate compared with conventional no mask application method.