Journal of the Korea Convergence Society (한국융합학회논문지)

Korea Convergence Society (한국융합학회)
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A Study on Scratch Detection of Semiconductor Package using Mask Image

마스크 이미지를 이용한 반도체 패키지 스크래치 검출 연구

  • Lee, Tae-Hi (Dept. of Computer Engineering, Kongju National University) ;
  • Park, Koo-Rack (Dept. of Computer Science & Engineering, Kongju National University) ;
  • Kim, Dong-Hyun (Dept. of Computer Engineering, Kongju National University)
  • 이태희 (공주대학교 컴퓨터공학과) ;
  • 박구락 (공주대학교 컴퓨터공학부) ;
  • 김동현 (공주대학교 컴퓨터공학과)
  • Received : 2017.10.01
  • Accepted : 2017.11.20
  • Published : 2017.11.28
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Abstract

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

반도체는 산업 기술의 발전을 주도하고 있는 첨단기술로서 전자제품의 소형, 경량화 달성으로 전자산업 시장을 끌어가고 있는 상황이다. 특히 반도체 생산 공정은 정밀하고 복잡한 공정으로 이루어져 있어 효과적인 생산이 필요하며, 최근 불량 검출을 위하여 컴퓨터와 카메라를 융합한 비전 시스템이 활용되고 있고, 특수한 공정에 의하여 가공된 미세 패턴의 형상을 측정하기 위한 시스템의 수요가 급속하게 증대되고 있다. 본 논문에서는 반도체 패키지의 스크래치 결함을 검출하기 위하여 마스크 이미지를 이용한 비전 알고리즘을 제안한다. 제안 시스템을 통하여 반도체 패키지 생산 공정에 적용하면 생산관리를 원활하게 할 수 있고, 빠른 패키지의 불량 판정으로 생산의 효율성이 높아질 것으로 기대된다.

Keywords

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