• Korean Journal of Metals and Materials
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• v.47 no.7
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• pp.447-453
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• 2009

Isotropic conductive adhesives (ICAs) have been used or considered as an interconnect material for radio frequency identification (RFID) inlays or other flip chip assemblies due to the advantages of having a low temperature and high-speed bonding. In this work, the curing properties of commercial ICAs for the RFID tag application and the signal transmission in conductive lines that contained the ICA joints were evaluated as a function of the degree of cure at 900 MHz frequency range. The ICAs showed adequate signal transmission only after the curing process passed over the critical time. It was also found that the insertion loss of signal was more dependent on the contact states of Ag fillers in the bondline in preference to the electrical resistance of the ICA itself.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.4
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• pp.579-589
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• 2007

The objective of this study was to compare the shear bond strengths of five adhesive systems to the enamel and dentin of primary and permanent teeth. Fifty noncarious primary and fifty permanent teeth were collected and stored in an 0.1% thymol solution at room temperature after extraction. The tested adhesives were: Adper Scotchbond Multi-purpose Plus Adhesive (SM) Adper Single bond 2 (SB), Clearfil SE Bond (SE), Adper Prompt L-Pop (PL), GBond (GB). For the shear bonding test, the labial and lingual surfaces of primary and permanent teeth were used. To obtain a flat surface, the labial and lingual surfaces of the teeth were sanded on $SiO_2$ with number 600 grit and then divided into 20 groups of 10 surfaces each. All samples were theromocycled in water $5^{\circ}C$ and $55^{\circ}C$ for 1000 cycles. The results were as follows: 1. For primary enamel, shear bond strengths of SM and SB were significantly higher than that of SE and also SM, SB, and PL were higher than GB(p<0.05). 2. For primary dentin, there were no significant differences among the shear bond strengths of any other bonding systems except difference between SE and GB. 3. For permanent enamel, SB showed significantly higher mean shear bond strength than those of any other bonding systems(p<0.05). 4. For permanent dentin, SM showed significantly higher mean shear bond strength than that of PL and GB(p<0.05). 5. Between the primary enamel and dentin, there were significant differences in SM, SB, and GB, whereas there was statistically significant difference in PL between the permanent enamel and dentin(p<0.05). 6. Between the primary and permanent teeth on enamel, there were no significant differences among all bonding systems, whereas there were statistically significant differences in SM and SB between the primary and permanent teeth on dentin(p<0.05).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.426-430
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• 2008

Hot shear-welding is a process of bonding two plates together by using shearing stress in a controlled manner. This study dealt with the hot shear-welding process of two aluminum plates. These two plates were piles up in the shear-welding mold. Due to the shearing stress, these two plates were cut off longitudinally, and meantime they were welded together. During this process the control of the surplus material flow is very important, and it can be realized by designing the overlapping length and the shape of the cavity. The commercial software Deform-3D was employed to predict the effect of these two factors. The overlapping length and the shape of the cavity that presents the optimum design was then developed to get a good shear-welding process.

• Journal of Photoscience
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• v.9 no.2
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• pp.264-266
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• 2002

The absorption wavelength of the protonated retinal Schiff base can be controlled by the surrounding environment. An external anion is related to fine adjustment of the absorption wavelength. The addition of anion to retinochrome solution caused blue shift in spectra. The increase of the shift was dependent on the ion concentration. The large shift value was obtained as 20 nm at the saturated concentration of nitrate. The shift intensity for the nitrate addition exceeded that of chloride. Seemingly, it depends on the ionic strength or lyotropic character of the anion. However, neither of sulphate nor gluconate ion showed remarkable blue shift. These phenomena were accounted for with (1) delocalization of the positive charge in the conjugated polyene system, (2) ionic bonding strength between the counter ion (glutamate) and the proton, and/or (3) interaction of the added anion with the proton on Schiff base.

• The Journal of Korean Academy of Prosthodontics
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• v.31 no.4
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• pp.506-514
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• 1993

The purpose of this study was to evaluate the effect of porcelain laminate thickness on polymerization of resin cement. G-Cera resin bonding system(G-C int., Japan) was used in this study and Heliolux II (Vivadent, Austria) was used for polymerization of resin cement. The thickness of porcelain laminates used in this study were 0.5mm, 1.0mm and 1.5mm and the degree of polymerization of resin cement was measured by microhardness theater(Matsuzawa, Model MXT-70, Japan). The obtained results were as follows : 1. The surface hardness of resin cements increaing the thickness of poreclain laminate was decreased. 2. The surface hardness of resin cements increasing the curing time was decreased.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.295-295
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• 2006

In present study, poly(acrylic acid) (PAA) and hydrophobically modified poly(ethylene oxide) (HM-PEO) multilayers based on the hydrogen bonding between the component polymer pair have been prepared by the LbL deposition method. Dip assembled HM-PEO/PAA multilayers yield unique film morphologies in comparison with PEO/PAA multilayers due to the micellar formation of HM-PEO owing to the hydrophobic attraction between alkyl chains end-capped with the PEO chains. Individual HM-PEO micelles were connected through the bridging PEO chains to form temporary networks on multilayer surface and induced peculiar surface morphology on HM-PEO/PAA multilayers above the critical number of bilayers.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.379-380
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• 2008

This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

• Applied Microscopy
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• v.45 no.2
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• pp.89-94
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• 2015

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.2023-2025
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• 2002

We have fabricated a novel vertical trench-Hall device sensitive to the magnetic field parallel to the sensor chip surface. The vertical trench-Hall device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 350 V/AT is measured.

• Carbon letters
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• v.1 no.2
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• pp.87-90
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• 2000

Porous carbon from charcoal filled polypropylene composites were prepared and their mechanical properties were evaluated. In preparing the composites, crosslinking agent (sodium benzonate) were used in order to improve the bonding force between matrix and fillers. In this study, the effects of charcoal powder and sodium benzonate concentration on the mechanical properties and interface phenomena on the composites were evaluated. The mechanical properties of composites increased progressively with the decrease of filler loading. In the case of addition of the crosslinking agent into the composite, the mechanical properties were increased and showed maximum value at the 3 wt% concentration of sodium benzonate. According to the result of the TGA, the weight loss of composite according to crosslinking agent was not observed and initial thermal degradation temperature of composite reinforced charcoal was located at $390^{\circ}C$.