• Korean Journal of Materials Research
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• v.22 no.4
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• pp.211-214
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• 2012

Optimal conditions for HA plasma spray-coating on Ti6Al4V alloy were investigated in order to obtain enhanced bone-bonding ability with Ti6Al4V alloy. The properties of plasma spray coated film were analyzed by SEM, XRD, surface roughness measurement, and adhesion strength test because the film's transformed phase and crystallinity were known to be influential to bone-bonding ability withTi6Al4V alloy. The films were formed by a plasma spray coating technique with various combinations of plasma power, spray distance, and auxiliary He gas pressure. The film properties were analyzed in order to determine the optimal spray coating parameters with which we will able to achieve enhanced bone-bonding ability with Ti6Al4V alloy. The most influential coating parameter was found to be the plasma spray distance to the specimen from the spray gun nozzle. Additionally, it was observed that a relatively higher film crystallinity can be obtained with lower auxiliary gas pressure. Moderate adhesion strength can be achievable at minimal plasma power. That is, adhesion strength is minimally dependent on the plasma power. The combination of shorter spray distance, lower auxiliary gas pressure, and moderate spray power can be recommended as the optimal spray conditions. In this study, optimal plasma spray coated films were formed with spray distance of 70 mm, plasma current of 800 A, and auxiliary gas pressure of 60 psi.

• Korean Chemical Engineering Research
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• v.53 no.6
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• pp.802-807
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• 2015

In this study, we synthesized a new biocatalyst consisting of glucose oxidase (GOx), polyethyleneimine (PEI) and carbon nanotube (CNT) with addition of terephthalaldehyde (TPA) (TPA/GOx/PEI/CNT) for fabrication of glucose sensor that shows improved sensing ability and stability compared with that using other biocatalysts. Main bonding of the new TPA/GOx/PEI/CNT catalyst is formed by Aldol condensation reaction of functional end groups between GOx/PEI and TPA. Such formed bonding structure promotes oxidation reaction of glucose. Catalytic activity of TPA/GOx/PEI/CNT is evaluated quantitatively by electrochemical measurements. As a result of that, large sensitivity value of $41{\mu}Acm^{-2}mM^{-1}$ is gained. Regarding biosensor stability of TPA/GOx/PEI/CNT catalyst, covalent bonding formed between GOx/PEI and TPA prevents GOx molecules from becoming leaching-out and contributes improvement in biosensor stability. With estimation of the biosensor stability, it is found that the TPA/GOx/PEI/CNT catalyst keeps 94.6% of its initial activity even after three weeks.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.2
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• pp.154-163
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• 2013

Adhesive bonding and plastic welding have been widely used to join two plastic materials together. The goal of this paper is to determine a proper joining technology of a pair of flat panel (FP) photobioreactor (PBR) case. The material of the FP PBR case is polycarbonate (PC) plate. Two types of adhesion, including acryl adhesive and two-part epoxy adhesive, as well as two types of plastic welding technology, including ultrasonic welding and thermal welding, are employed for joining of PC plates. In order to influence of the adhesion and welding conditions on the joining characteristics of the PC plates in operational conditions of the FP PBR case, the morphology in the vicinity of the joined region as well as the water and pressure resistance characteristic are investigated. In addition, the variation of the bonding strength of the joined region and deformation behaviors in the vicinity of the joined region according to the adhesion and welding conditions is examined via the lap-shear test. From the results of basic experiments, proper joining technologies are chosen. Using the chosen joining technologies, the FP PBR case are fabricated to perform full-scale durability experiment. The results of the full-scale durability experiment have been shown that the chosen joining technologies can be applicable to fabricate the FP PBR case.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.2
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• pp.336-354
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• 1998

Traditionally, many kinds of mechanical bonding techniques were used for bonding resins to the surface of the metal alloys. If there is a seperation between resin and metal junction by stress accumulation and temperature change of oral cavity, the cracks or crazing may occur, accompanied by failure of resin bonding to metal. This study was designed to compare the shear bond strength of the type IV gold alloy and Cr-Co alloy surfaces treated with various methods and thermocycling. Universal Instron (Model 1000) and scanning electron microscope (JEOL, Japan) was used to record the shear bond strength of 5 groups. Forty specimens were made for each group ; group 1 was treated with sandblasting only, group 2 was coated with V-primer after sandblasting, group 3 was coated with Metal primer, group 4 wase coated with MR Bond and group 5 was coated with silane. After treated with various methods, thermocycling was done for half of the each group. The surfaces of failed pattern were observed with SEM. The results were as follows : 1. Shear bond strength of the group 1 was lower than that of another groups in type IV gold alloys and bond strength of the group 1, 2 were lower than that of group 3, 4, 5 in Cr-Co alloys. 2. Shear bond strength of the gold alloy with resin was higher than that of Cr-Co alloy when specimens were coated with V-primer. 3. Shear bond strength of the Co-Cr alloys with resin was higher than that of gold alloys when specimens were coated with Metal primer. 4. The bond strength of all specimens did not decreased significantly after thermocycling. 5. Adhesive failures were found in group 1 and Cr-Co alloy in group 2, but adhesive and cohesive failures were found in another groups.

• Journal of the korean academy of Pediatric Dentistry
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• v.32 no.2
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• pp.191-199
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• 2005

This study was experienced in order to obtain the shear bond strength of orthodontic bracket adhesives under the blood contamination that can be occurred during the procedure of bracket bonding under window opening surgery. As a result of this study, shear bond strength of all glass ionomer groups were lower than resin cement groups. However, the strength of uncontaminated and post-contaminated group of glass ionomer was strong enough to perform an orthodontic forced eruption. This study revealed that during a window opening surgery, glass ionomer without etching procedure is available in order to bond a bracket if surface of teeth is not pre-contaminated by blood before the adhesive application. Both simple procedure and less adhesives remnant after bonding failure could make light-cured glass ionomer cement the ultimate choice for racket bonding.

• Restorative Dentistry and Endodontics
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• v.27 no.3
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• pp.257-269
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• 2002

Objective : The purpose of this study was to evaluate the resin infiltration into dentin of one-bottle adhesive systems and self-etching primer bonded to Class V cavities using confocal laser scanning microscope(CLSM). Material and Methods : Forty Class V cavities were prepared from freshly extracted caries-free Human teeth. These teeth were divided into two groups based on the presence of cervical abrasion: Group I, cervical abrasion : Group II, wedge-shaped cavity preparation. Resin-dentin interfaces were produced with two one-bottle dentin bonding systems-ONE COAT BOND(OCB; Coltene$^R$) and Syntac$^R$SPrint$^{TM}$(SS; VIVADENT)-, one self-etching priming system-CLEARFIL$^{TM}$ SE BOND (SB : KURARAY)- and one multi-step dentin bonding system-Scotchbond$^{TM}$Multi-Purpose (SBMP, 3M Dental Products)-as control according to manufacturers' instructions. Cavities were restored with Spectrum$^{R}$(Dentsply). Specimens were immersed in saline for 24 hours and sectioned longitudinally with a low-speed diamond disc. The resin-dentin interfaces were microscopically observed using CLSM. The quality of resin-infiltrated dentin layers were evaluated by five dentists using 0~4 scale. Results : Confocal laser scanning microscopal investigations using primer labeled with rhodamine B showed that the penetration of the primer occurred along the cavity margins. Statistical analysis using one-way ANOVA followed by Duncan's Multiple Range test revealed that the primer penetration of the group 2(wedge-shaped cavity preparation) was more effective than group 1(cervical abrasion) and that of the gingival interfaces was more effective than the occlusal interfaces. In the one-bottle dentin bonding systems, the resin penetration score of OCB was compatible to SBMP, but those of SS and self-etching priming system, SB were lower than SBMP.

• Restorative Dentistry and Endodontics
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• v.33 no.5
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• pp.419-427
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• 2008

This study analyzed the influence of dental adhesive/primer on the bond strength between indirect resin composite and the resin cement. Seventy disc specimens of indirect resin composite (Tescera Dentin, Bisco) were fabricated. And bonding area of all specimens were sandblasted and silane treated for one minute. The resin cements were used with or without application of adhesive/primer to bonding area of indirect resin restoration, Variolink-II (Ivoclar-Vivadent) : Exite DSC, Panavia-F (Kuraray) : ED-Primer, RelyX Unicorn (3M ESPE) Single- Bond, Duolink (Risco) : One-step, Mulitlink (Ivoclar-Vivadent) : Multilinh Primer. Shear bond strength was measured by Instron universal testing machine. Adhesive application improved shear bond strength (p<0.05) But Variolink II and Panavia-F showed no statistically significant difference according to the adhesive application. With the above results, when resin inlay is luted by resin cement it seems that application of dental adhesive/primer is necessary in order to improve the bond strength.

• The korean journal of orthodontics
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• v.44 no.5
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• pp.236-245
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• 2014

Objective: To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Methods: Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with preadjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Results: Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Conclusions: Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.