Browse > Article
http://dx.doi.org/10.3807/KJOP.2013.24.6.342

Heat Conduction Analysis of Metal Hybrid Die Adhesive Structure for High Power LED Package  

Yim, Hae-Dong (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Choi, Bong-Man (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Lee, Dong-Jin (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Lee, Seung-Gol (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Park, Se-Geun (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
O, Beom-Hoan (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Publication Information
Korean Journal of Optics and Photonics / v.24, no.6, 2013 , pp. 342-346 More about this Journal
Abstract
We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.
Keywords
Light emitting diode (LED); Die bonding; Thermal bypass metal; Metal-silicone network;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Z.-T. Li, Q.-H. Wang, Y. Tang, C. Li, X.-R. Ding, and Z.-H. He, "Light extraction improvement for LED COB devices by introducing a patterned leadframe substrate configuration," IEEE Electron. Dev. Lett. 60, 1397-1403 (2013).   DOI   ScienceOn
2 R.-H. Horng, K.-C. Shen, Y.-W. Kuo, and D.-S. Wuu, "GaN light emitting diodes with wing-type imbedded contacts," Opt. Express 21, A1-A6 (2013).   DOI
3 C. Tsou and Y.-S. Huang, "Silicon-based packaging platform for light-emitting diode," IEEE Transactions on Advanced Packaging 29, 607-614 (2006).   DOI   ScienceOn
4 L. Yin, L. Yang, W. Yang, Y. Guo, K. Mac, S. Li, and J. Zhang, "Thermal design and analysis of multi-chip LED module with ceramic substrate," Solid-State Electronics 54, 1520-1524 (2010).   DOI   ScienceOn
5 T. Kunimune, M. Kuramoto, S. Ogawa, M. Nogi, and K. Suganuma, "Low-temperature pressure-less silver direct bonding," IEEE Trans. Compon. Packag. Manuf. Technol. 3, 363-369 (2013).   DOI   ScienceOn
6 H.-H. Kim, S.-H. Choi, S.-H. Shin, Y.-K. Lee, S.-M. Choi, and S. Yi, "Thermal transient characteristics of die attach in high power LED PKG," Microelectronics Reliability 48, 445-454 (2008).   DOI   ScienceOn
7 B. Yan, J. Pyng You, N. T. Tran, Y. He, and F. G. Shi, "Influence of die attach layer on thermal performance of high power light emitting diodes," IEEE Transactions on Components and Packaging Technologies 33, 722-727 (2010).   DOI   ScienceOn
8 T.-y. Chung, J.-H. Jhang, J.-S. Chen, Y.-C. Lo, G.-H. Ho, M.-L. Wu, and C.-C. Sun, "A study of large area die bonding materials and their corresponding mechanical and thermal properties," Microelectronics Reliability 52, 872-877 (2012).   DOI   ScienceOn