Heat Conduction Analysis of Metal Hybrid Die Adhesive Structure for High Power LED Package |
Yim, Hae-Dong
(School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Choi, Bong-Man (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) Lee, Dong-Jin (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) Lee, Seung-Gol (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) Park, Se-Geun (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) O, Beom-Hoan (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR)) |
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