• 제목/요약/키워드: sacrificial layer

검색결과 93건 처리시간 0.036초

Uniformity Improvement of Micromirror Array for Reliable Working Performance as an Optical Modulator in the Maskless Photolithography System

  • Lee, Kook-Nyung;Kim, Yong-Kweon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권2호
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    • pp.132-139
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    • 2001
  • We considered the uniformity of fabricated micromirror arrays by characterizing the fabrication process and calculating the appropriate driving voltages of micromirrors used as virtual photomask in maskless photolithography. The uniformity of the micromirror array in terms of driving voltage and optical characteristics is adversely affected by factors, such as the air gap between the bottom electrode and the mirror plate, the spring shape and the deformation of the mirror plate or torsion spring. The thickness deviation of the photoresist sacrificial layer, the misalignment between mirror plate and bottom electrode, the aluminum deposition condition used to produce the spring and the mirror plate, and initial mirror deflection were identified as key factors. Their importance lies in the fact that they are related to air gap deviations under the mirror plate, asymmetric driving voltages in left and right mirror directions, and the deformation of the Al sring or mirror plate after removal of the sacrificial layer. The plasma ashing conditions used for removing the sacrificial layer also contributed to the deformation of the mirror plate and spring. Driving voltages were calculated for the pixel operation of the micromirror array, and the non-uniform characteristics of fabricated micromirrors were taken into consideration to improve driving performance reliability.

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알루미늄 희생층을 이용한 금속 구조물의 제작 (Fabrication of metal structure using AI sacrificial layer)

  • 김정무;박재형;이상호;신동식;김용권;이윤식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1893-1895
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    • 2001
  • In this paper, novel release technique using wet etch is proposed. The results of this technique and the results of SAMs (Self-Assembled monolayers) coated after release using this technique are compared. Fabricated structure have 100 um in width and experimental length is from 100 um to 1 mm. Thickness of aluminum sacrificial layer is 2 um and structure thickness is 2.5 um. Cantilevers and bridges are fabricated with electroplated gold and silicon nitride deposited on substrate. An aluminium sacrificial layer was evaporated thermally and removed in various wet etching solutions. Detachment length of cantilever is 200 um and detachment length of bridge is 1 mm after isooctane rinsing. And the SAMs coating condition which is appropriate for gold and nitride are studied respectively.

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DLC-coated Si-tip FEA 제조에 있어서 기판 상에 경사-회전 증착된 Al 희생층을 이용한 Gate누설 전류의 감소 (Decrease of Gate Leakage Current by Employing Al Sacrificial Layer Deposited on a Tilted and Rotated Substrate in the DLC-coated Si-tip FEA Fabrication)

  • 주병권;김영조
    • 마이크로전자및패키징학회지
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    • 제7권3호
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    • pp.27-29
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    • 2000
  • Lift-off를 이용한 DLC-coated Si-tip FEA 제조에 있어서 gate 절연막의 측면에 DLC가 coating되는 것을 방지하기 위해 기판 상에 Al 희생층을 경사-회전 증착한 뒤 DLC를 coating하고, 다음으로 희생층을 식각하여 tip 이외의 DLC를 제거하는 방법을 제안하였다. 이러한 Al희생층을 이용한 lift-off공정에 의해 제조된 DLC-coated Si-tip FEA의 전류전압 특성과 전류 표동 특성을 조사하였으며, gate 누설 전류의 감소와 방출 전류의 안정성을 확인하였다.

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PSG 희생층 식각시 Al층을 보호하기 위한 새로운 HF/$NH_4F$/Glycerine 혼합 식각액 (A New HF/$NH_4F$/Glycerine Aqueous Solution for Protection of Al Layers During Sacrificial Etching of PSG Films)

  • 김성운;백승준;김임정;이승기;조동일
    • 센서학회지
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    • 제8권5호
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    • pp.414-420
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    • 1999
  • 희생층을 제거하는 기술은 표면 마이크로머시닝 공정의 핵심기술중 하나이다. 그러나 희생층을 제거하는데 널리 쓰이는 BHF 용액을 포함한 HF 수용액은 희생층 제거시 금속층으로 쓰이는 알루미늄도 같이 식각하는 것으로 알려져 있다. 기존의 문헌에서 $NH_4F$:HF:glycerine=4:1:2의 비를 갖는 혼합 용액이 알루미늄과 PSG 간의 식각 선택비가 최적조건으로 제시되었지만 이 희생층 식각액 또한 상당한 알루미능 식각률을 가지고 있다. 본 논문에서는 HF, $NH_4F$, glycerine의 농도를 광범위하게 변화시켜 희생층 제거에 필요한 최적 혼합비를 개발하였으며 그 결과 $NH_4F$:HF:glycerine=2:1:4의 혼합비에서 약 7,700정도의 PSG와 Al의 식각 선택비를 가져 기존의 최적 식각 선택비보다 차수가 약 6배정도 향상된 희생층 식각액을 얻을 수 있었다. 이 조건에서 PSG의 식각률은 희생층 제거시 충분히 빠른 값인 약 $2.1\;{\mu}m/min$을 나타내었다. 이러한 개발된 희생층 식각액은 표면 마이크로머시닝 공정에서 알루미늄 금속 공정의 추가를 용이하게 한다.

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드릴공구의 이종질화막상 DLC 희생층 적용을 통한 공구 수명 개선 연구 (A Study on the Improvement of Tool's Life by Applying DLC Sacrificial Layer on Nitride Hard Coated Drill Tools)

  • 강용진;김도현;장영준;김종국
    • 한국표면공학회지
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    • 제53권6호
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    • pp.271-279
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    • 2020
  • Non-ferrous metals, widely used in the mechanical industry, are difficult to machine, particularly by drilling and tapping. Since non-ferrous metals have a strong tendency to adhere to the cutting tool, the tool life is greatly deteriorated. Diamond-like carbon (DLC) is one of the promising candidates to improve the performance and life of cutting tool due to their low frictional property. In this study, a sacrificial DLC layer is applied on the hard nitride coated drill tool to improve the durability. The DLC coatings are fabricated by controlling the acceleration voltage of the linear ion source in the range of 0.6~1.8 kV. As a result, the optimized hardness(20 GPa) and wear resistance(1.4 x 10-8 ㎣/N·m) were obtained at the 1.4 kV. Then, the optimized DLC coating is applied as an sacrificial layer on the hard nitride coating to evaluate the performance and life of cutting tool. The Vickers hardness of the composite coatings were similar to those of the nitride coatings (AlCrN, AlTiSiN), but the friction coefficients were significantly reduced to 0.13 compared to 0.63 of nitride coatings. The drilling test were performed on S55C plate using a drilling machine at rotation speed of 2,500 rpm and penetration rate of 0.25 m/rev. The result showed that the wear width of the composite coated drills were 200 % lower than those of the AlCrN, AlTiSiN coated drills. In addition, the cutting forces of the composite coated drills were 13 and 15 % lower than that of AlCrN, AlTiSiN coated drills, respectively, as it reduced the aluminum clogging. Finally, the application of the DLC sacrificial layer prevents initial chipping through its low friction property and improves drilling quality with efficient chip removal.

MEMS 응용을 위한 SOG 막의 특성 평가 (An Estimation on Characteristics of SOG Film for MEMS Application)

  • 김형동;이성준;백승호;김철주
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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    • pp.609-611
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    • 1995
  • In this study, we experimented the properties of SOG film as sacrificials layers in surface micromachining and made $SiO_2$ films through spin, bake, cure process. When we culled SOG films once, SOG film thickness is 1000 $\sim$ 3000 ${\AA}$. Then we coaled 200-${\AA}$ SOG film on 9000 ${\AA}$-CVD oxide and then we fabricated test structure, cantilever and ring/beam structure. We estimated deformed structure by SEM. As the results, The deformation of the structure layer in the SOG-coated sacrificial layers is small compared with that or the structure layer on CVD oxide or PSG. In the future, we use multi coated SOG films, SOG film become adequate material as sacrificial layer.

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Hollow Structure에서의 희생층 평탄화 제작 공정 (The Fabrication Processes for the Planarization of Sacrificial Layers over Hollow Structures)

  • 윤용섭;배기덕;최형;전찬봉;노광춘
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제53권10호
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    • pp.546-550
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    • 2004
  • Two fabrication approaches are proposed to planarize the sacrificial layer over hollow structures. One is the photoresist filling method that makes use of photolithography, thermal curing and plasma ashing. The other is the lamination method that is applying pressure and temperature to the organic film over the hollow structures. The fabrication results are compared with those of CMP process. Trenches and cavities with various dimensions have been made for the porposed process. Upon measuring the planarization levels, they are dependent on planarization methods and the geometrical size of hollow structures. The photoresist filling method is so strongly dependent on the width and depth of trenches that we have problems to use it for large dimensional trenches. To the contrary, the flatness of sacrificial layer over the trenches was found to be almost independent of trench dimensions for the lamination method. A CMP process shows the most excellent results, but the fabrication is complicated and the access to it is not so easy. It is important to choose the proper planarization method by considering the required flatness levels, materials to be planarized, and connection between the planarization step and the previous or the following process of it.

Development of sacrificial layer wet etch process of TiNi for nano-electro-mechanical device application

  • Park, Byung Kyu;Choi, Woo Young;Cho, Eou Sik;Cho, Il Hwan
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권4호
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    • pp.410-414
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    • 2013
  • We report the wet etching of titanium nickel (TiNi) films for the production of nano-electro-mechanical (NEM) device. $SiO_2$ and $Si_3N_4$ have been selected as sacrificial layers of TiNi metal and etched with polyethylene glycol and hydrofluoric acid (HF) mixed solution. Volume percentage of HF are varied from 10% to 35% and the etch rate of the $SiO_2$, $Si_3N_4$ and TiNi are reported here. Within the various experiment results, 15% HF mixed polyethylene glycol solution show highest etch ratio between sacrificial layer and TiNi metal. Especially $Si_3N_4$ films shows high etch ratio with TiNi films. Wet etching results are measured with SEM inspection. Therefore, this experiment provides a novel method for TiNi in the nano-electro-mechanical device.

노심 용융물 제트 충돌에 의한 희생물질의 침식예측 (Prediction of sacrificial material ablation rate by corium jet impingement)

  • 서정수;김한곤
    • 에너지공학
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    • 제23권3호
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    • pp.21-26
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    • 2014
  • 유럽 원전 시장 개척을 위해 개발 중인 EU-APR1400은 중대사고 대처설비로 노외 노심용융물 보유 및 냉각을 위한 소위 Core catcher라 불리는 노외 노심용융물 냉각설비를 개발 중이며, Core catcher body를 노심용융물로부터 보호하기 위하여 노심용융물의 물성 및 상태를 변화시켜 냉각 및 보유에 유리하게 하는 희생물질을 설치한다. 중대사고 시 원자로 압력용기의 틈으로부터 노심용융물이 분출되어 희생물질에 충돌 시 열 전달량이 매우 증가하게 되므로, 이 때 노심용융물 제트의 충돌에 의한 희생물질의 침식율을 정확하게 예측하는 것은 매우 중요하다. 이 논문에서는 경계층 이론을 기반으로 한 희생물질 침식 모형을 제안하고 KAERI에서 수행한 실험결과와 비교하였다.

Fabrication of High-Resolution Pixels in Organic Light-Emitting Displays Using Laser-Inscribed Sacrificial Layer

  • Choi, Won-Suk;Kim, Min-Hoi;Na, Yu-Jin;Koo, Kyung-Mo;Lee, Sin-Doo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.755-757
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    • 2009
  • We developed a novel patterning method of organic light emitting materials using a laser-inscribed sacrificial layer for fabricating high-resolution pixels in organic light emitting displays (OLEDs). Our patterning process is capable of achieving high spatial resolution of about 10 ${\mu}m$. Moreover, it has no detrimental effect on the electrical properties of organic materials. This patterning approach is expected to be applicable for patterning and integrating a wide range of organic materials for organic electronic and optoelectronic devices.

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