• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.513-516
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• 1987

Hydrogenated amorphous silicon (a-Si:H) films have been deposited, for thye first time, by a remote plasma chemical vapor deposition. The hydrogen radical play a important role to control the deposition rate, The bonded hydrogen content to silicon is independent of hydrogen partial pressure in the plasma. Optical gap of deposited a-Si:H lies between 1.7eV and 1.8eV and all samples have sharp absorption edge. B-doped a-Si:H films by a RPECVD has a high doping efficiency compared with plasma CVD. The Fermi level of 100ppm B-doped film lies at 0.5eV above valence band edge.

• Proceedings of the KIPE Conference
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• 2013.07a
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• pp.51-52
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• 2013

본 논문에서는 박막형 태양전지 및 LCD 제조공정에서 증착 공정 후 챔버 내부에 쌓이는 Si(실리콘)을 화학적으로 세정하기 위한 F(불소) RADICAL을 공급하는 원격 고밀도 플라즈마를 발생시키기 위한 고출력 Generator에 대해 소개하고자 한다. 개발되어진 Generator는 입력 직류전원을 공유하여 7kW급 단일 Power Amp Module의 상호결합 및 전력분담에 대한 편차 극복을 위한 기술과 고조파 저감비가 우수한 대전력 필터를 구현하였고, 크기 및 부피의 축소를 위하여 필터의 Q Factor의 극대화 기술이 적용되어졌다. 개발된 400kHz 30kW Generator는 NF3 60리터의 대용량 Remote Plasma Source의 리액터를 구동시킬 수 있으며, 38kW급 DC Link, 7kW급 Power Amp module, LC 필터, Controller로 구성되어 진다. 개발된 장치는 실제 플라즈마 공정에서 시험 평가한 결과를 통해 검증할 수 있었다.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.594-597
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• 2005

The barrier characteristics of ZrN films deposited by remote plasma enhanced atomic layer deposition(PEALD) using TDEAZ and $N_2$ remote plasma have been investigated under various deposition conditions such as temperatures, plasma power and processing pressures. ZrN films showed generally improved properties as the processing temperature, pressure and plasma power increased. The optimized processing temperature, plasma power and pressure were $300^{\circ}C$, 200 Watt and 1 torr. respectively ZrN films deposited at the optimized processing conditions showed the carbon contents and resistivity of $6at.\%$ and $400{\mu}{\Omega}cm$ respectively.

• Korean Journal of Materials Research
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• v.6 no.8
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• pp.817-824
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• 1996

Removal of Cu impurities on Si substrates using remote H-plasma was investigated. Si substrates were intentionally contaminated by 1ppm ${CuCI}_{2}$, standard chemical solution. To determine the optimal process condition, remote H-plasma cleaning was conducted varying the parameters of rf power, cleaning time and remoteness(the distance between the center of plasma and the surface of Si substrate). After remote H-plasma cleaning was conducted, Si surfaces were analysed by TXRF(total x-ray reflection fluorescence) and AFM(atomic force microscope). The concentration of Cu impurity was reduced by more than a factor of 10 and its RMS roughness was improved by more than 30% after remote H-plasma cleaning. TXRF analysis results show that remote H-plasma cleaning is effective in eliminating Cu impurity on Si surface when it is performed under the optimal process condition. AFM analysis results also verifies that remote H-plasma cleaning makes no damage to the Si surface. The deposition mechanism of Cu impurity may be explained by the redox potential(oxidation-reduction reaction potential) theory. Based on the XPS analysis results we could draw a conclusion that Cu impurities on the Si substrate are removed together with the oxide by a "lift-off" mechanism when the chemical oxide( which forms when Cu ions are adsorbed on the Si surface) is etched off by reactive hydrogen atoms.gen atoms.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.78-79
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• 2007

In this study, chemical dry characteristics of silicon nitride layers were investigated in the $F_2/N_2/Ar$ remote plasma. A toroidal-type remote plasma source was used for the generation of remote plasmas. The effects of additive $N_2$ gas on the etch rates of various silicon nitride layers deposited using different deposition techniques and precursors were investigated by varying the various process parameters, such as the $F_2$ flow rate, the addition $N_2$ flow rate and the substrate temperature. The etch rates of the various silicon nitride layers at the room temperature were initially increased and then decreased with the $N_2$ flow increased, which indicates an existence of the maximum etch rates. The etch rates of the silicon oxide layers were also significantly increased with the substrate temperature increased. In the present experiments the $F_2$ gas flow, addition $N_2$ flow rate and the substrate temperature were found to be the critical parameters in determining the etch rate of the silicon nitride layers

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.76-77
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• 1996

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.82-83
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• 2007

DBD type을 이용한 remote plasma에서 발생된 대기압 플라즈마를 이용하여, PR에 대한 식각 실험을 진행하였다. 과거 습식 화학적 공정에서 오던 기술적 제한의 극복과 진공 플라즈마 가지는 단점을 극복하기 위해 대기압 플라즈마를 이용한 건식 세정에 관한 연구를 진행하였고, 이 때 Gas는 $N_2/O_2$+$SF_6$ 의 조합으로 사용하였으며, 각 gas의 유량에 다른 remote 플라즈마의 전기적, 광학적 특성에 대해 관찰하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.13-14
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• 2008

$Al_2O_3$ thin films were deposited on GaN (0001) by remote plasma atomic layer deposition (RPALD) technique using trimethylaluminum (TMA) precursor and oxygen radicals in the temperature range of 25 ~ $500^{\circ}C$. Growth rate per cycle was varied with substrate temperature from 1.8 $\breve{A}$/ cycle at $25^{\circ}C$ to 0.8 $\breve{A}$/cycle at $500^{\circ}C$. The chemical structure of the $Al_2O_3$ thin films was studied using X-ray photo electron spectroscopy (XPS). Excellent electrical properties of $Al_2O_3$/GaN MIS capacitor were grown at $300^{\circ}C$ process temperature.

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.1-6
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• 1995

Polycrystalline Si films have been used in many applications such as thin film transistors(TFT), image sensors and LSI applications. In this research deposition of Si films at low temperatures with remote plasma enhanced CVD from Si2H6-SiF4-H2 on SiO2 was studied and their crystallinity was investigated. It was condluded that growth of crystalline Si films was favorable with (1) low Si2H6 flow rates, (2) moderate plasma power, (3) moderate SiF4 flow rates, (4) moderate substrate temperature, and (5) suitable method of surface cleaning.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.408-413
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• 2008

In this work, the use of LPRTO (low pressure rapid thermal oxidation) and remote plasma oxidation was evaluated for the preparation of ultra thin silicon oxide layer with less than 5 nm. The silicon oxide thickness grown by LPRTO was rapidly increased and saturated. The maximum thickness could be controlled at about 5 nm. As RF power and oxygen flow rate at a remote plasma oxidation increased, the behavior of oxide growth was almost the same as that of LPRTO. The oxide thickness of 4 nm was the maximum obtained by a remote plasma oxidation in this work. The quality of silicon oxide grown by LPRTO was comparable to the thermally grown conventional oxide.