• 한국의류학회지
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• 제39권3호
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• pp.457-467
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• 2015

The demand for coverall-type protective clothing are increasing in many industrial fields; however, it is impossible to evaluate the wearers' apparel fit because there is no commercialized pattern in the market. This study produces a manual for the process of acquiring patterns by separating PPE products into pieces to provide information on acquiring patterns. The analysis was on coverall-type non woven protective clothing in the domestic market, and 4 panels examined the validity, reliability, and efficiency of various possible methods on each step of process. Five steps were conducted to acquire patterns removing wrinkles, marking seams lines, separating seams, and pattern completing. The process of converting these into pattern files was designed through three procedures of digitizing, editing, and exporting and detailed stages. Fitting tests were undertaken, real patterns by actual modeling and pattern files by virtual modeling; all showed similar forms with outfits wearing ready-made protective coveralls. This study sought the most efficient and objective method of virtual modeling and proposed it as a manual. It is expected for the pattern reverse-designing manual through products analysis presented in this study that would be a helpful addition of information to the pattern tracing of pattern-less clothing products.

• 한국재료학회지
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• 제27권8호
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• pp.397-402
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• 2017

We used an etching process to control the line-width of screen printed Ag paste patterns. Ag paste was printed on anodized Al substrate to produce a high power LED. In general, Ag paste spreads or diffuses on anodized Al substrate in the process of screen printing; therefore, the line-width of the printed Ag paste pattern increases in contrast with the ideal line-width of the pattern. Smudges of Ag paste on anodized Al substrate were removed by neutral etching process without surface damage of the anodized Al substrate. Accordingly, the line-width of the printed Ag paste pattern was controlled as close as possible to the ideal line-width. When the etched Ag paste pattern was used as a seed layer for electroless Ni plating, the line width of the plated Ni film was similar to the line-width of the etched Ag paste pattern. Finally, in pattern formation by Ag paste screen printing, we found that the accuracy of the line-width of the pattern can be effectively improved by using an etching process before electroless Ni plating.

• 정보처리학회논문지D
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• 제13D권7호
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• pp.947-958
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• 2006

컴포넌트 확장성 및 재사용성을 향상시키기 위해서는 분석단계에서부터 가변적인 것들을 규칙기반으로 분석해서 컴포넌트로 식별할 필요가 있다. 본 논문에서는 시스템 외부 이벤트에 대해 트랜잭션 처리를 규칙기반으로 처리해야 하는 도메인 상에서 객체 기반의 중요 개념을 규칙기반으로 효과적으로 추출해 UML Components 개발 프로세스 상에서 가변적인 컴포넌트를 개발할 수 있는 규칙 기반 분석 패턴을 제시한다. 업무 지식이나 경험이 다른 많은 분석가들이 서브 시스템 많은 규칙 기반의 가변적인 복잡한 비즈니스 업무 분석 시 제안한 분석 패턴을 사용할 경우 분석 산출물의 일관성이나 가독성을 좋게 하며 또한 UML Components 방법론상에서 효과적으로 가변적인 비즈니스 컴포넌트들을 식별할 수 있다. 이러한 분석 패턴의 타당성을 증명하기 위해 본 논문에서는 가변적인 규칙기반으로 업무를 처리하는 은행 수신과 수출입 업무 도메인에 적용한 결과 패턴에서 제시한 중요 개념을 기반으로 거의 유사한 비즈니스 개념 모델을 도출할 수 있었으며 또한 이들 중요 개념을 기반으로 UML Components 개발 프로세스 상에서 가변적인 비즈니스 컴포넌트를 효과적으로 식별할 수 있었다.

• 한국CDE학회논문집
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• 제3권4호
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• pp.223-235
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• 1998

A dedicated CAM(Computer-Aided Manufacturing) system has been developed, which generated tool-path to machine Styrofoam stamping die-patterns in Chrysler Corporation. A previous process to build die-patterns was to "stick build" the pattern, in which stock is cut & glued together, and then the NC machining of part-surface shape completes building a Styrofoam die-pattern. The current process utilizes the developed CAM system, and almost removes the manual work, consequently reduces the overall lead time. The paper presents the overall system structures, tool-path generation, and some features of Styrofoam pattern machining.

• Design & Manufacturing
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• 제11권3호
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• pp.1-7
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• 2017

The fabrication process of micro pattern structure with high precision and high aspect ratio using powder injection molding (PIM) is developed. In the PIM process, the metal powder is mixed with the binder systems and the mixture is injected into the metal mold. The injection molded green parts are debinded and sintered to reach final shape and properties. In this method, the optimization of physical properties such as fluidity and strength of the binder system is essential for perfect filling the high aspect ratio micro-pattern. For this purpose, the correlation between the properties of the binder system and feedstock and ${\mu}-PIM$ process was investigated, and a binder system with low viscosity at low temperature(about $110^{\circ}C$) and high strength after cooling was investigated and applied. Employing this process, high precision parts with line type micro pattern structure which has pattern size $160{\mu}m$ and aspect ratio more than 2 can be manufactured.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 제35회 춘계학술대회
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• pp.272-278
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• 2002

Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. In this paper, the effect of pattern density, trench width and selectivity of slurry on dishing in STI CMP process was investigated by using specially designed isolation pattern. As trench width increased, the dishing tends to increase. At $20{\mu}m$ pattern size, the dishing was decreased with increasing pattern density Low selectivity slurry shows less dishing at over $160{\mu}m$ trench width, whereas high selectivity slurry shows less dishing at below $160{\mu}m$ trench width.

• 한국정보과학회논문지:소프트웨어및응용
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• 제32권5호
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• pp.346-356
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• 2005

디자인 패턴은 지난 10년 이상 소프트웨어 공학 영역에서 활발하게 연구되어 여러 유형의 디자인 패턴이 정의되었다. 그러나 이들 패턴은 자료구조와 알고리즘에 비해 소프트웨어 개발 과정에 빈번하게 사용되지 못하고 있다. 더욱이 CBD96, RUP, MaRMI III 같은 CBD 방법론들은 분석, 설계, 개발 과정중에 디자인 패턴을 선정하고 적용하는 방법이 언급되어 있지 않다. 본 논문에서는 GoF, J2EE 패턴 카타로그에 제시된 디자인 패턴을 중심으로 응용 소프트웨어를 개발하기 위해 분석, 설계, 개발 단계에 적용되는 디자인 패턴을 효과적으로 선정하는 프로세스를 제시한다. 제시된 프로세스를 항공업무 어플리케이션 개발 과정에 적용하여 패턴 기반 소프트웨어를 개발해 나가는 효과적인 방법을 보이고 RUP와의 차이점 및 유용함을 제시한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.14-17
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• 2000

The rise throughput and the stability in fabrication of device can be obtained by applying of CMP process to STI structure in 0.18um semiconductor device. To employ in STI CMP, the reverse moat process has been added thus the process became complex and the defects were seriously increased. Removal rates of each thin films in STi CMP was not equal hence the devices must to be effected, that is, the damage was occured in the device dimension in the case of excessive CMP process and the nitride film was remained on the device dimension in the case of insufficient CMP process than these defects affect the device characteristics. We studied the current sensing method in STI-CMP with the reverse moat pattern.

• 한국기계가공학회지
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• 제13권4호
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• pp.21-27
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• 2014

The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1085-1088
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• 2001

The process of styrofoam pattern that has been used for material of press die pattern depends chiefly on handwork. Laser manufacturing system developed to increase precision and efficiency of process that is also able to convert the design easily. Applying the RP(rapid prototyping) concept reversely, the unnecessary part of section is vapored away by heat source of laser beam after converting 3-D CAD model into cross-sectional shape information. Laser beam is line-scanned in plane specimens to measure the depth and width of cut, surface roughness, cross-sectional shape as converting laser power, scanning speed, cutting gas pressure. With these basic data, plane surface, inclined surface, hole, outer contour trimming process is experimented and optimum condition are obtained. In plane and inclined surface experiments, 15W laser power and 50mm/s scanning speed make superior processing property and 30W, 10mm/s make processing efficiency increase in trimming process. With these results, simple patterns were manufactured and the possibility of applying laser manufacturing system to styrofoam pattern was convinced.