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http://dx.doi.org/10.3740/MRSK.2017.27.8.397

Accuracy Improvement of Screen Printed Ag Paste Patterns on Anodized Al for Electroless Ni Plating  

Lee, Youn-Seoung (Department of Information and Communication Engineering, Hanbat National University)
Rha, Sa-Kyun (Department of Advanced Materials Engineering, Hanbat National University)
Publication Information
Korean Journal of Materials Research / v.27, no.8, 2017 , pp. 397-402 More about this Journal
Abstract
We used an etching process to control the line-width of screen printed Ag paste patterns. Ag paste was printed on anodized Al substrate to produce a high power LED. In general, Ag paste spreads or diffuses on anodized Al substrate in the process of screen printing; therefore, the line-width of the printed Ag paste pattern increases in contrast with the ideal line-width of the pattern. Smudges of Ag paste on anodized Al substrate were removed by neutral etching process without surface damage of the anodized Al substrate. Accordingly, the line-width of the printed Ag paste pattern was controlled as close as possible to the ideal line-width. When the etched Ag paste pattern was used as a seed layer for electroless Ni plating, the line width of the plated Ni film was similar to the line-width of the etched Ag paste pattern. Finally, in pattern formation by Ag paste screen printing, we found that the accuracy of the line-width of the pattern can be effectively improved by using an etching process before electroless Ni plating.
Keywords
screen print; Ag paste; line-width; anodized Al substrate; etching;
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1 S. K. Rha, H. C. Kim and Y. S. Lee, J. Nanosci. Nanotech., 14, 8615 (2014).   DOI
2 S. K. Rha, Y. R. Cho, J. S. Yoon and Y. S. Lee, J. Nanosci. Nanotech., 13, 6307 (2013).   DOI
3 S. K. Rha and Y. S. Lee, J. Nanosci. Nanotech., 15, 2422 (2015).   DOI
4 K. M. Kim, S. H. Shin, Y. K. Lee, S. M. Choi and Y. S. Kwon, Electron. Lett., 44, 24 (2008).   DOI
5 S. Liu and X. Luo, LED Packaging for Lighting Applications; Design, Manufactureing and Testing (Chemical Industry Press, Singapore) p. 160 (2011).
6 J. H. Lee, Y. H. Kim, U. C. Jung and W. S. Chung, Mater. Chem. Phys., 141, 680 (2013).   DOI
7 Daniel Inns, Energy Procedia, 98, 23 (2016).   DOI
8 M. R. Somalu, A. Muchtar, W. Ramli, W. Daud and N. P. Brandon, Renew. Sustain. Energy Rev., 75, 426 (2017).   DOI
9 A. Khanna, P. K. Basu, A. Filipovic, V. Shanmugam, C. Schmiga, A. G. Aberle and T. Mueller, Sol. Energy Mater. Sol. Cells, 132, 589 (2015).   DOI
10 B. G. Park, K. H. Jung and S. B. Jung, J. Alloys Compd., 699, 1186 (2017).   DOI
11 A. Bouyelfane, A. Zerga, Mater. Sci. Semicond. Process., 26, 312 (2014).   DOI
12 Z. Chu, J. Peng, and W. Jin, Sens. Actuators, B: Chemical, 243, 919 (2017).   DOI
13 U. Mannl, C. V. D. Berg, B. Magunje, M. Harting, D. T. Britton, S. Jones, M. J. V. Staden, and M. R. Scriba, Nanotechnology, 25, 094004 (2014).   DOI
14 R. Faddoul, N. R. Bruas and A. Blayo, Mater. Sci. Eng. B, 177, 1053 (2012).   DOI
15 K. Park, D. Seo and J. Lee, Colloids Surf. A: Physicochem. Eng. Aspects, 313-314, 351 (2008).   DOI
16 S. G. Park, Y. S. Lee and S. K. Rha, J. Korean Phys. Soc., 69, 164 (2016).   DOI