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http://dx.doi.org/10.14775/ksmpe.2014.13.4.021

Numerical Analysis of Micro-pattern Filling with Gas Dissolution by Injection Molding Process  

Park, Sung Ho (Department of Mechanical & Aerospace Engineering, Seoul National University)
Yoo, Hyeong Min (Department of Mechanical & Aerospace Engineering, Seoul National University)
Lee, Woo Il (Department of Mechanical & Aerospace Engineering, Seoul National University)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.13, no.4, 2014 , pp. 21-27 More about this Journal
Abstract
The injection molding process has several advantages enabling it to produce large quantities of molded plastic products using a repetitive process. In recent years, it has been necessary to develop an injection molding process with micro/nano-sized patterns for application to the semiconductor industry and to the bio/nano manufacturing industry. In this study, we apply gas pressure to the inside of a mold and consider the gas dissolution phenomenon for a resin filling into a micro pattern with a line structure. Using numerical analysis, we calculate the filling ratio with respect to time for various internal gas pressures and various aspect ratios of the micro-patterns.
Keywords
Micro Pattern; Injection Molding Process; Gas Dissolution; Numerical Analysis;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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