• JSTS:Journal of Semiconductor Technology and Science
• /
• 제13권6호
• /
• pp.617-621
• /
• 2013

This study examined the effect of electron-beam (E-beam) irradiation on the electrical properties of n-GaN, AlGaN and AlGN/GaN structures on sapphire substrates. E-beam irradiation resulted in a significant decrease in the gate leakage current of the n-GaN, AlGaN and HEMT structure from $4.0{\times}10^{-4}A$, $6.5{\times}10^{-5}A$, $2.7{\times}10^{-8}A$ to $7.7{\times}10^{-5}A$, $7.7{\times}10^{-6}A$, $4.7{\times}10^{-9}A$, respectively, at a drain voltage of -10V. Furthermore, we also investigated the effect of E-beam irradiation on the AlGaN surface in AlGaN/GaN heterostructure high electron mobility transistors(HEMTs). The results showed that the maximum drain current density of the AlGaN/GaN HEMTs with E-beam irradiation was greatly improved, when compared to that of the AlGaN/GaN HEMTs without E-beam irradiation. These results strongly suggest that E-beam irradiation is a promising method to reduce leakage current of AlGaN/GaN HEMTs on sapphire through the neutralization the trap.

• 한국세라믹학회지
• /
• 제48권6호
• /
• pp.543-548
• /
• 2011

The inkjet printing technology has undergone remarkable development since the concept of printed electronics was first introduced. The large interest which it has sparkled is due to its many enticing features such as processing simplicity, low cost and scalability as well as its compatibility with flexible electronics. Thanks to constant improvements, inkjet printing has nowadays become a mature technology which is an effective replacement for a number of intricate and expensive conventional laboratory tools and is also on the verge of gaining industrial significance. Technological challenges which still remain open include low temperature processing, high density integration and reproducibility. This paper reviews some recent advances in the inkjet printing technology, addressing those issues. And we also discuss a number of novel approaches to performing inkjet printing.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1996년도 추계학술대회 논문집
• /
• pp.265-269
• /
• 1996

In this paper, electric field interference was analyzed in the Printed Circuit Board to restrain the elcctromagnetic wave using Boundary Element Method and Finite Element Method. First, charge density distribution was simulated using Boundary Element Method and the characteristic impedance was caculated to restrain the reflex wave, and mutual capacitance was caculated in the multi-strip line PCB. Finally, electric field was simulated in the variable patterns using Finite Element Method. As a result, the optimal structure and characteristics of strip line was obtained and the imformations about the optimal design pattern could be obtained with the analysing the feild distribution.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1999년도 추계학술대회 논문집
• /
• pp.625-628
• /
• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.192-192
• /
• 2009

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

• 펄프종이기술
• /
• 제39권2호
• /
• pp.31-37
• /
• 2007

Lithography like off-set printing is processed using the repellent properties between water and oil, so all inks for off-printing must work with dampening solution(water). The dampening water may cause the emulsification of ink by the printing pressure in the printing nip. This study aimed to investigate the effect of emulsified inks on print mottle. The cyan ink was emulsified artificially with the different IPA(isopropyl alcohol) content in this study. We evaluated the print mottle by densitometer and image analysis method. The print mottle phenomenon was directly affected by IPA content. The emulsification of inks also had an influence on flow properties of inks and it increased ink transfer rate. It, however, caused low ink density. Moreover the emulsified inks were spreaded to around dots and cause the thinning density on the non-printing area like print mottle. The trial printing showed that the emulsified inks also cause scumming on the printing result with little mistake of adjusting dampening solution and mostly decreasing dot reproduction. We could, therefore, find out the obvious effect of emulsified inks on print mottle.

• 펄프종이기술
• /
• 제44권4호
• /
• pp.77-84
• /
• 2012

The lithographic process depends on a satisfactory ink-in-water emulsion being formed during printing and the speed of wet presses makes the choice of fountain solution vitally important as the ink and fount must react quickly to form a stable emulsion. Ink and water come into contact with each other on the rolls of the press and are forced together in the roll nips. The water is not soluble in the ink since it is slightly fat. Instead, an emulsion is formed, a heterogeneous mass consisting of small water drops mixed into the ink, if the water feed is too great. This emulsification can affect the properties of an off-set ink and negatively affect the printability. So we investigated the effects of the emulsification of phenol free heat-set ink and existing heat-set ink on printed quality, such as amount of ink transfer, printed density, print-through and uniformity. We used Duke emulsification tester for the emulsification of inks, and used IGT printability tester for printed quality. The printed quality were measured by densitometer and were evaluated by the image analysis system. Compared to conventional printing ink, phenol-free ink showed better results of the printability at the emulsification.

• Composites Research
• /
• 제35권6호
• /
• pp.463-468
• /
• 2022

상용 FFF (Fused filament fabrication) 3D 프린터로 제조된 탄소 단섬유강화 나일론 복합재료 구조의 내부 채움 패턴(Infill pattern)의 높은 공극률은 프린팅 된 구조의 기계적 성능을 결정한다. 본 연구는 프린팅 된 구조의 내부 채움 패턴의 공극률을 줄여서 기계적 특성을 개선하기 위해 사각형 내부 채움 구조로 제작된 Onyx 복합 재료 시편의 열압밀 조건에 따른 시편의 기계적 성능을 실험적으로 평가하고, 가장 우수한 기계적 물성을 유도하는 열압밀 공정 조건(145℃, 4 MPa, 12 min)을 찾았다. 현미경 관찰결과 열압밀 후처리를 겪은 복합재료 시편의 내부 채움 공극률이 효과적으로 줄어듦을 확인하였다. 후처리된 시편의 기계적 성능을 확인하기 위해, 후처리를 하지 않은 대조군 시편과, 후처리 후 밀도와 치수를 동일하게 설정하여 출력한 시편과 함께 인장시험 및 3점 굽힘시험을 수행하여 기계적 물성을 비교한 결과 열압밀 후처리를 수행한 경우 기계적 물성이 효과적으로 개선되는 것을 확인하였다.

• The Journal of Advanced Prosthodontics
• /
• 제16권2호
• /
• pp.91-104
• /
• 2024

PURPOSE. The objectives of the current study were to estimate the influence of self-reinforced hollow structures with a graded density on the dimensional accuracy, weight, and mechanical properties of Co-Cr objects printed with the direct metal laser sintering (DMLS) technique. MATERIALS AND METHODS. Sixty-five dog-bone samples were manufactured to evaluate the dimensional accuracy of printing, weight, and tensile properties of DMLS printed Co-Cr. They were divided into Group 1 (control) (n = 5), Group 2, 3, and 4 with incorporated hollow structures based on (spherical, elliptical, and diamond) shapes; they were subdivided into subgroups (n = 5) according to the volumetric reduction (10%, 15%, 20% and 25%). Radiographic imaging and microscopic analysis of the fractographs were conducted to validate the created geometries; the dimensional accuracy, weight, yield tensile strength, and modulus of elasticity were calculated. The data were estimated by one-way ANOVA and Duncan's tests at P < .05. RESULTS. The accuracy test showed an insignificant difference in the x, y, z directions in all printed groups. The weight was significantly reduced proportionally to the reduced volume fraction. The yield strength and elastic modulus of the control group and Group 2 at 10% volume reduction were comparable and significantly higher than the other subgroups. CONCLUSION. The printing accuracy was not affected by the presence or type of the hollow geometry. The weight of Group 2 at 10% reduction was significantly lower than that of the control group. The yield strength and elastic modulus of the Group 2 at a 10% reduction showed means equivalent to the compact objects and were significantly higher than other subgroups.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
• /
• pp.35-40
• /
• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.