Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Inkjet Printing Process to Fabricate Non-sintered Low Loss Density for 3D Integration Technology

잉크젯 프린팅 공정을 이용한 3D Integration 집적 기술의 무소결 고충진 유전체막 제조

  • Jang, Hun-Woo (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Ji-Hoon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Koo, Eun-Hae (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Kim, Hyo-Tae (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Yoon, Young-Joon (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology) ;
  • Hwang, Hae-Jin (Department of Ceramics, Inha University) ;
  • Kim, Jong-Hee (Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology)
  • Published : 2009.06.18
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Abstract

We have successfully demonstrated the inkjet printing process to fabricate $Al_2O_3$ thick films without a high temperature sintering process. A single solvent system had a coffee ring pattern after printing of $Al_2O_3$ dot, line and area. In order to fabricate the smooth surface of $Al_2O_3$ thick film, we have introduced a co-solvent system which has nano-sized $Al_2O_3$ powders in the mixture of Ethylene glycol monomethyl ester and Di propylene glycol methyl ether. This co-solvent system approached a uniform and dense deposition of $Al_2O_3$ powders on the substrate. The packing density of inkjet-printed $Al_2O_3$ films is more than 70% which is very high compared to the value obtained from the films synthesized by other conventional methods such as casting processes. The characterization of the inkjet-printed $Al_2O_3$ films has been implemented to investigate its thickness and roughness. Also the dielectric loss of the films has been measured to understand the feasibility of its application to 3D integration package substrate.

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