• Composites Research
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• v.31 no.6
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• pp.421-428
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• 2018

In order to optimize the prepreg compression molding (PCM) process, the forming simulation is required to cope with any problems that may be raised during the process. For the improvement of simulation accuracy, the input data of material property should be measured accurately. However, most studies assume that the compressive properties of the prepreg are identical to the tensile properties without quantifying them separately. Therefore, in this study, the in - plane compressive properties of the prepreg are presented to improve the accuracy of the forming simulation. As a result, the compressive modulus of the fibers was measured to be about $10^{-2}$ times lower than the tensile modulus. Also we designed a square-cup mold with a tilting angle of $110^{\circ}$ to simulate the prepreg formability during the high temperature compression mold process. Shear angles were measured at each corner, which were compared with the simulation results. It was observed that the simulation results using the accurate compressive properties of the prepreg showed a similar trend with the experimental results. It was confirmed that the measured data of the in-plane compression property improved the accuracy of the forming simulation results.

• Design & Manufacturing
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• v.10 no.2
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• pp.12-17
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• 2016

Recently, lightweight material is attracting attention as a solution to the problem of fuel efficiency and increasing the need for development. CFRP has been attracting attention as lightweight materials for automobile because it has a high specific stiffness and specific strength compared to steel material. CFRP have a wide range of mechanical properties depending on the laminate condition. In this paper, study on the forming analysis of double-dome model was performed considering CFRP prepreg laminate condition and coefficient of friction. After forming analysis, the result has compared with wrinkling area and vertical strain of fiber to the laminated condition. And then compared with inflow of blank to the laminate condition. Through this paper, we propose the forming analysis methods of CFRP material.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.67-73
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• 2020

In this paper, we used FEM technique to perform warpage and von Mises stress analysis on PCB according to the cavity structures of embedded PCB for FCCSP and the types of prepreg material. One-half substrate model and static analysis are applied to the FEM. According to the analysis results of the warpage, as the gap between the cavity and the chip increased, warpage increased and warpage increased when prepreg material with higher modularity and thermal expansion coefficient was applied. The analysis results of the von Mises stress show that the effect of the gap between the cavity and the chip varies depending on prepreg material. In other words, when material whose coefficient of thermal expansion is significantly higher than that of core material, the stress increased as the gap between the cavity and the chip increased. When the prepreg with the coefficient of thermal expansion lower than the core material is applied, the result of stress is opposite. These results indicate that from a reliability perspective, there is a correlation between the structure of the cavity where embedded chips are loaded and prepreg material.

• Composites Research
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• v.14 no.2
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• pp.1-7
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• 2001

The studies on the formulation and curing behaviors of Kevlar/Epoxy prepreg for NOSE CONE of aircraft were presented in this paper. Dielectrometer and differential scanning calorimeter were used in order to check the curing behaviors. This prepreg showed the lowest ionic viscosity around $120^{\circ}C$, and then the ionic viscosity was gradually increased up to $200^{\circ}C$. This indicated that the curing reaction of this prepreg started at $120^{\circ}C$ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan $\delta$ values were also measured and discussed. The loss factor behaviors of Kevlar/Epoxy prepreg, which is related to the fluidity of matrix, were fecund to be similar with that of ionic viscosity. The thermal reaction properties of this prepreg were also studied by differential scanning calorimeter.

• Polymer(Korea)
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• v.24 no.3
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• pp.350-357
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• 2000

Curing behaviors of glass/epoxy prepreg for printed circuit boards (PCB) were studied by using dielectrometer and differential scanning calorimeter. This prepreg was showed the lowest ionic viscosity at about 115$^{\circ}C$, and then the ionic viscosity was gradully increased up to 15$0^{\circ}C$. This indicated that the curing reaction of this prepreg started at 115$^{\circ}C$ and the molecular weight was increased by the accelerated thermal cross-linking reaction. The loss factor and tan $\delta$ values were also measured and discussed. The dielectric behaviors of this prepreg system were also measured according to the cure cycle for PCB. This material was found to be thermally stable up to about 30$0^{\circ}C$ and then was showed an abrupt decomposition beyond this temperature.

• Composites Research
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• v.34 no.5
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• pp.269-276
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• 2021

PCM (Prepreg Compression Molding) process is a high-speed molding technology that can manufacture high-quality CFRP (Carbon Fiber Reinforced Plastic) parts. Compared to the autoclave process, it generates less waste and can significantly reduce cycle time, so various studies are being conducted in the aerospace and automobile industries. In this study, in order to improve the quality of the PCM process, a molding method was developed to increase the compression pressure of the press step by step according to the curing behavior of the prepreg. It was confirmed that this multi-stage compression molding technology is a good means to produce high-quality CFRP products and shorten cycle times. And, the laminated prepreg at room temperature was immediately put into the mold and preheated and molded at the same time, so that it could be molded without a separate preheating process. In addition, as a result of applying the same process conditions optimized for flat plate molding to three-dimensional shapes, a product similar to a flat plate in appearance could be made without the process of establishing process conditions.

• Composites Research
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• v.35 no.3
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• pp.182-187
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• 2022

In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.

• Composites Research
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• v.19 no.2
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• pp.20-27
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• 2006

The hybrid composite materials with non-woven tissue (NWT) was developed to improve the mechanical properties of conventional FRP composite materials. The hybrid prepreg with NWT consists of FRP prepreg and NWT prepreg. The NWT prepreg consists of NWT and polymer resin. The NWT has short fibers, discretely distributed with in-plane random orientation fibers. The purposes of this study of hybrid prepreg with NWT are (i) to increase the interlaminar properties(the fracture toughness and strength), (ii) to improve the mechanical properties and reliability, while maintaining a low cost, (iii) to introduce a tough and strong interlayer at critical positions to be required of strength in the laminate. To accomplish the above purposes, a production technique to decrease voids in NWT layers was proposed in this paper. The interlaminar failure characteristics of laminated composite materials was tremendously improved by hybrid concept with NWT.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.806-811
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• 2013

In this study, to prevent the nonhomogeneity of fiber orientation during the molding of GFRP composites, GFRP prepreg was fabricated using roving fiber and polypropylene resin. Analyses on the degree of impregnation, tensile strength, and microstructure were conducted on the fabricated prepregs. A lower pulling speed, higher resin temperature, and longer die length showed a greater degree of impregnation of the prepreg. The scanning electron microscope (SEM) micrograph showed, a homogeneous fiber orientation. As a result, fundamental techniques for improved productivity were suggested for the manufacturing field.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.10a
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• pp.105-110
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• 2001

Autoclave curing using the vacuum bagging method is widely used for the manufacture of advanced composite prepreg airframe structures. Due to increasing use of advanced composites, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the damaged areas be removed, such as skin and/or honeycomb core, by utilizing the proper method and then repairing the area by laying up prepreg (and core) then curing under vacuum using the vacuum bagging materials. It shall be cured either in an oven or autoclave per the original specification requirements. Delamination can be observed in the sound areas during and/or after a couple times exposure to the elevated curing temperature due to the repeated repair condition. This study was conducted for checking the degree of degradation of properties of the cured parts and delamination between skin prepreg and honeycomb core. Specimens with glass honeycomb sandwich construction and glass/epoxy prepreg were prepared. The specimens were cured 1 to 5 times at $260^{circ}F$ in an autoclave and each additionally exposed 50, 100 and 150 hours in the $260^{circ}F$ oven. Each specimen was tested for tensile strength, compressive strength, flatwise tensile strength and interlaminar shear strength. To monitor the characteristics of the resin itself, the cured resin was tested using DMA and DSC. As a results, the decrease of Tg value were observed in the specific specimen which is exposed over 50 hrs at $260^{circ}F$. This means the change or degradative of resin properties is also related to the decrease of flatwise tensile properties. Accordingly, minimal exposure on the curing temperature is recommended for parts in order to prevent the delation and maintain the better condition.