An Empirical Formulation for Predicting the Thickness of Multilayer PCB
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Kim, Nam-Hoon
(Department of Mechanical Engineering, Hanbat National University)
Han, Gwan-Hee (Department of Mechanical Engineering, Hanbat National University) Lee, Min-Su (Korea Packaging Integration Association) Kim, Hyun-Ho (Korea Packaging Integration Association) Shin, Kwang-Bok (Department of Mechanical Engineering, Hanbat National University) |
1 | Kim, C.G., and Lee, S.S., "Ultra-High-Speed PCB Design Methods," Institute of Korean Electrical and Electronics Engineers, Vol. 22, No. 3, 2018, pp. 882-885. |
2 | Jiru, M., Guozheng, L., and Lei, Z., "Study on Epoxy Matrix Modified with Poly(2,6-dimethyl-1,4-phenylene ether) for Application to Copper Clad Laminate," Composites Science and Technology, Vol. 62, No. 6, 2002, pp. 783-789. DOI |
3 | Kim, C.G., and Lee, S.S., "Ultra-High-Speed PCB Design Methods", Journal of IKEEE, Vol. 22, No. 3, 2018, pp. 882-885. DOI |
4 | Cho, S.H., Jung, H.I., and Bae, O.C., "Numerical Analysis on the Design Variables and Thickness Deviation Effects on Warpage of Substrate for FCCSP," Journal of the Microelectronics & Packaging Society, Vol. 19, No. 3, 2012, pp. 57-62. DOI |
5 | Oh, S.H., Kim, J.G., Park, K.H., Im, C.W., and Kang, K.I., "A PCB Material Selection, Test and EMI Simulation for 10Gbps High Speed IO Data Processing Board," KSAS 2010 Conference, 2010, pp. 903-906. |
6 | Lee, S.H., and Kim, S.K., "Optimal Design of Dummy Patterns for Minimizing PCB Warpage," Transactions of the KSME, A, Vol. 33, No. 6, 2009, pp. 577-583. DOI |
7 | Cho, S.H., Jang, J.Y., Kim, J.C., Kang, S.W., Sung, I., and Bae, K.Y., "A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL," Journal of the Microelectronics and Packaging Society, Vol. 22, No. 4, 2015, pp. 37-46. DOI |
8 | Kim, S.M., Ku, T.W., Song, W.J., and Kang, B.S., "Experimental Study on the Improvement of Flexural Strength in Slim Multi-Layer Printed Circuit Boards," Proceedings of the KSME Conference, 2007, pp. 321-325. |
9 | Yoon, I.S., "Warpage Improvement of PCB with Material Properties Variation of Core," Journal of the Microelectronics & Packaging Society, Vol. 13, No. 2, 2006, pp. 1-7. |
10 | Yoon, D.H., Cho, M.G., and Lin, C.H., "Implementation of Multi-layer PCB Design Simulator for Controlled Impedance," Journal of the Institute of Electronics and Information Engineers, Vol. 48, No. 12, 2011, pp. 73-81. |
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