• Title/Summary/Keyword: precision measurement

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Sub-sampling Technique to Improve the Measurement Speed of White Light Scanning Interferometry (백색광 주사 간섭계의 측정 속도 개선을 위한 서브 샘플링 기법 연구)

  • Chyun, In-Bum;Joo, Ki-Nam
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.11
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    • pp.999-1006
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    • 2014
  • In this investigation, we explain the sub-sampling technique of white light scanning interferometry (WLSI) to improve the measurement speed. In addition to the previous work using Fourier domain analysis, several methods to extract the height from the correlogram of WLSI are described with the sub-sampling technique. Especially, Fourier-inverse Fourier transformation method adopting sub-sampling technique is proposed and the phase compensation technique is verified with simulation and experiments. The main advantage of sub-sampling is to speed up the measurements of WLSI but the precision such as repeatability is slightly poor. In case of measuring the sample which has high height step or difference, the proposed technique can be widely used to reduce the measurement time.

The Measurement Method of Small Deformation by using Holographic Interferometry (홀로그래픽 산섭법을 이용한 미소변형 측정법)

  • 강영준;문상준;최장섭
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.10a
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    • pp.273-278
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    • 1993
  • Conventional measurement methods for non-destructive testing(NDT) in nuclear power plants other industrial plants have been performed as the methods of contact with objects to be inspect, but those methods have been taken relatively much time to be inspected. Holographic interferometry which is a non-contact optical measurement method using a coherent light can overcome these demerit, and also has an advantage that the quantitative measurement of small deformation for large areas can be accomplished at a time with high precision. In this paper the comparisons of the experimental results from holographic interferometry with those form the finite element method(FEM) and the analytical solutions of elastic equation are discussed.

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Design of Precision Position Measuring System using Laser Interferometry (광간섭법을 이용한 정밀 위치측정 시스템 설계)

  • 김진상;정성종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.145-149
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    • 1997
  • A laser mesurement system, a modified Michelson interferometer,which can accurately measure high speed length and position of servomechanisms by detecting a phase shift in the measurement beam using an optical interference was developed. A frequency stabilized laser source and a 20 fold frequency interpolation and digitizing circuit were applied to the system. The refractive index of the ambient air was calibrated through the Edlen's formula. The system achieved a resolution of .lambda./40,16nm, a maximum allowable measurement speed of 600 mm/sec, and a length measurement range of 1500mm. Performance of the system was evaluated on the machining center in short and long length measurements

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Calibration of SAW Based Capacitive Sensor Using Lumped Component and High Precision Gap Measurement (집중 소자를 이용한 표면 탄성파 장치 기반의 용량 성 센서 보정 및 이를 이용한 초정밀 간극 측정)

  • Kim, Jae-Geun;Ko, Byung-Han;Park, Young-Pil;Park, No-Cheol
    • Transactions of the Society of Information Storage Systems
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    • v.8 no.1
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    • pp.16-21
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    • 2012
  • SAW device is widely used as filters, sensors, actuators in various technologies. And capacitive sensor is tremendously used to measure pressure, gap, etc. The application of SAW device as signal conditioner of capacitive sensor reduces noise level and enables high precision measurement. The response increase of SAW based capacitive sensor is produced just before the two capacitive electrode contacts by the existence of parasitic resistance of capacitive electrode. In this paper, we analyze the effects of parasitic resistance and propose the calibrating method using lumped component and execute the high precision gap measurement using calibrated system. And xx nm resolution and yy ${\mu}m$ stroke was attained.

Stress Measurement of films using surface micromachined test structures (표면 미세 가공된 구조체를 이용한 박막의 응력 측정)

  • 이창승;정회환;노광수;이종현;유형준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.721-725
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    • 1996
  • The microfabricated test structures were used in order to evaluate the stress characteristics in films. The test structures were fabricated using surface micromachining technique, including HF vapor phase etching as an effective release method. The fabricated structures were micro strain gauge, cantilever-type vernier gauge and bridge for stress measurement, and cantilever for stress gradient measurement. The strain was measures by observing the deformation of the structures occurred after release etching and the amount of deformation can be detected by micro vernier gauge, which has gauge resolution of 0.2${\mu}{\textrm}{m}$. The detection principles and the degree of precision for the measured strain were also discussed. The characteristics of residual stress in LPCVD polysilicon films were studied using these test structures. The stress gradient due to the stress variation through the film thickness was calculated by measuring the deflection at the cantilever free end.

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A Study on the out-diameter measuring machine by the LVDT sensors (LVDT 센서를 이용한 외경 측정 방안에 대한 연구)

  • Hwang J.H.;Roh J.H.;Park Ki-Hong
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.291-292
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    • 2006
  • Currently A demand of high precision workpiece is increasing in industry. At present, roundness measuring machine using Air bearing, coordinate measuring machine that are used from measurement station. but these machines will not be able to apply to In-line process. because of like these machine's price are very expensive and measurement time is long. also, the complexity of conventional roundness measurement method based on fourier transform, it makes difficult to development analysis program. This work present new architecture of a Out-diameter measuring system fur analysis of roundness of product. In this system, the influence of table motion errors is minimize by using two LVDT sensor and knife edge contact tip. We are produce a test machine and make an experimenter on Out-diameter of test bearing. The measurement result compared with roundness measuring machine.

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Effects of the Tool Path on the Geometric Characteristics of Milled Surface (가공경로가 밀링가공면의 기하학적 특성에 미치는 영향)

  • Park, Moon-Jin;Kim, Kang
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.6
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    • pp.58-63
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    • 1998
  • There are lots of factors that are related to the geometric characteristics of machined surface. Among them, the tool path and milling mode (up cut milling or down cut milling) are the easiest controllable machining conditions. Thus, the first objective of this research is to study the effects of them on the milled surface that is generated by an end milling tool. To get precision parts, not only the machining process but also the measurement of geometric tolerance is important. But, this measurement requires a lot of time, because the infinite surface points must be measured in the ideal case. So, the second objective is to propose a simple flatness measurement method that can be available instead of the 3-D geometric tolerance measurement method, using a scale factor and characterized points. Finally, it is also shown that the possibility of flatness improvement by shifting the consecutive fine cutting tool path as compared with the last rough cutting tool path.

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A study on the development of the integrated error measurement and calibration system for a chip mounter (칩마운터를 위한 통합 오차 측정 및 평가 시스템 개발에 관한 연구)

  • 이동준;문준희;박희재;정상호
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.366-370
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    • 2002
  • A kinematic ball bar measurement system can analyze the various errors of a machine tool easily and rapidly in a procedure and can measure many types of equipment such as chip mounter, PCB router, precision stage, etc. In this paper, the thermally induced errors are loused among various errors of a chip mounter because it affects the accuracy of the machine very much. Linear regression technique is adapted for the thermal error modeling. While the measurement and calibration of a chip mounter is difficult in general, this developed system is not only easy to apply for it but also improves the accuracy by 4 times or more.

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Four Degree-of-Freedom Geometric Error Measurement System with Common-Path Compensation for Laser Beam Drift

  • Qibo, Feng;Bin, Zhang;Cuifang, Kuang
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.4
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    • pp.26-31
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    • 2008
  • A precision four-degree-of-freedom measurement system has been developed for simultaneous measurement of four motion errors of a linear stage, which include straightness and angular errors, The system employs a retro-reflector to detect the straightness errors and a plane mirror to detect the angular errors. A common-path compensation method for laser beam drift is put forward, and the experimental results show that the influences of beam drift on four motion errors can be reduced simultaneously. In comparison with the API 5D laser measuring system, the accuracy for straightness measurement is about ${\pm}1.5{\mu}m$ within the measuring range of ${\pm}650{\mu}m$, and the accuracy for pitch and yaw measurements is about ${\pm}1.5$ arc-seconds within the range of ${\pm}600$ arc-seconds.

Basic Examination on 3D Measuring System Using Pulse-Compression

  • Fujimoto Ikumatsu;Ando Shigeru
    • International Journal of Precision Engineering and Manufacturing
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    • v.6 no.4
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    • pp.60-66
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    • 2005
  • In this paper, we propose the basic measurement method of a 3D digitizer using a CCD camera in detail. In the localization measurement with a CCD camera, the effect of the background light and the sensitivity consideration are always problems in realizing a high precision. In this research, a new measurement principle is proposed in which the pulse compression technique known in radar is used to eliminate the effect of background light even under a low intensity light source, and the coordinate values on the CCD camera image plane are determined accurately. From the quantitative evaluation of the S/N ratio improvement and the fundamental experiment, it is verified that a substantial improvement in the S/N ratio is realized for both the background noise and the pixel noise and that a resolution of less than the pixel is sufficiently possible.