• Title/Summary/Keyword: pre-fabrication

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Fabrication of SiCOI Structures Using SDB and Etch-back Technology for MEMS Applications (SDB와 etch-back 기술에 의한 MEMS용 SiCOI 구조 제조)

  • Jung, Su-Yong;Woo, Hyung-Soon;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07b
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    • pp.830-833
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    • 2003
  • This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

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A 2.5Gbps High speed driver for a next generation connector (차세대 연결망용 2-SGbps급 고속 드라이버)

  • 남기현;김수원
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.53-56
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    • 2001
  • With the ever increasing clock frequency and integration level of CMOS circuits, I/O(input/output) and interconnect issues are becoming a growing concern. In this thesis, we propose the 2.5Gbps high speed input driver This driver consists of four different blocks, which are the high speed serializer , PECL(pseudo emitter coupled logic) Line Driver, PLL(phase lock loop) and pre-emphasis signal generator. The proposed pre-emphasis block will compensate the high frequency components of the 2.5Gbps data signal. Using the pre-emphasis block, we can obtain 2.5Gbps data signal with differential peak to peak voltage about 900 m $V_{p.p}$ This driver structure is on fabrication in 2.5v/10.25um 1poly, 5metal CMOS process.

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Development of High Precision Actuator for Micro Press System by Inchworm Motor (인치웜모터를 이용한 마이크로 프레스용 고정밀 구동기의 개발)

  • Choi, Jong-Pil;Nam, Kwang-Sun;Lee, Hye-Jin;Lee, Nak-Gue;Kim, Byeong-Hee
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.18 no.2
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    • pp.137-143
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    • 2009
  • This paper presents the fabrication of inchworm motor for high precision actuator system of large displacement and high force. The inchworm motor consists of a extend actuator that provides displacement of tool guide and two clamping actuators which provide the holding force. In order to avoid the PZT fracture, design of pre-load housing was conducted by flexure hinge structure, because PZT actuator has low tensile and shear. To design the pre-load housing and optimize the clamping mechanism, the static and dynamic analysis were conducted by finite element method. From these results, a prototype of the inchworm motor was fabricated and dynamic characteristic with respect to the various frequency was tested. The maximum velocity of the inchworm motor was $41.1{\mu}m/s$ at 16Hz.

Development of High Load/Large Displacement Actuator for Micro-press (마이크로 프레스용 고하중/대변위 액츄에이터 개발)

  • KIM B. H.;NAM K. S.;CHOI J. P.;KIM H. Y.;LEE N. K.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.458-461
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    • 2005
  • In this paper, a new type of inchworm motion actuator is developed in fabrication of actuators for micro-press machine. This is consisted of three piezoelectric actuators, one is for moving the tool guide and the other are for clamping the guide. The inchworm motor provides both high load and large displacement in small size actuator. PZT has compressive strength and often fails under tensile stress and pulling. Thus, in order to prevent failure, we have designed pre-load housing and accomplished FEM analysis. The pre-load housing was used for determining the optimal design condition by comparing the von-mises stresses with the change of hinge stiffness. Also, in order to predict the performance of the motor under certain conditions, the system model was simulated using MATLAB. This is open loop control actuator and driven by the period of input voltage.

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Control of Wettability Using Regularly Ordered Two-Dimensional Polymeric Wavy Substrates

  • Yi, Dong Kee
    • Nano
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    • v.13 no.10
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    • pp.1850120.1-1850120.9
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    • 2018
  • Two-dimensional poly(dimethylsiloxane) (PDMS) films with wavy patterns were studied in order to investigate reversible and irreversible wetting effects. Pre-strained, surface oxidized layers of PDMS were used to form relieved wavy geometries, on which hydrophobic functionalization was carried out in order to produce irreversible wetting effects. Wavy-patterned PDMS films showed time-dependent reversible wetting effects. The degree of surface wettability could be tuned by the choice of wavy groove geometries. And the groove geometries were controlled via $O_2$ plasma treatment and mechanical pre-straining. The pre-strained, buckled PDMS films were applied to the fabrication of hydrophobic polystyrene nano-patterns using colloidal self-assembly, where the colloids were arrayed in two-dimensional way. The wavy polystyrene films were found to be more hydrophobic relative to flat polystyrene films. The grooving methodology used in this study could be applied to enhancing the hydrophobicity of other types of polymeric thin films, eliminating the need for chemical treatment.

Preparation of Hydrophobic Coating Layers Using Organic-Inorganic Hybrid Compounds Through Particle-to-Binder Process (유-무기 하이브리드 화합물과 Particle-Binder 공정을 이용한 소수성 코팅막 제조)

  • Hwang, Seung-Hee;Kim, Hyo-Won;Kim, Juyoung
    • Journal of Adhesion and Interface
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    • v.21 no.4
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    • pp.143-155
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    • 2020
  • Hydrophobic Organic-Inorganic (O-I) hybrid materials prepared by sol-gel process have been widely used at functional coating fields such as coatings for anti-corrosion, anti-icing, self-cleaning, anti-reflection. The key point for fabricating hydrophobic surface is to optimize the surface energy and roughness of the coating films. There are typical processes to control the surface energy and roughness which are 'In situ fabricating', 'Pre-fluorinating/Post-roughening', 'Pre-roughening/ Post-fluorinating'. In this study, particle-binder process was used for in-situ fabrication of hydrophobic coating films. Various O-I hybrid compounds prepared using several kinds of alkoxysilane compounds were used as a binder for silica nanoparticles at particle-binder process. To study effect of fluorine content and weight ratio of particle : binder on the hydrophobicity and surface morphology, Hydrophobic coating films were prepared onto glass substrate at various content of fluorine content of O-I hybrid binder and weight ratio of particle : binder. The coating films prepared using O-I hybrid binder (GPTi-HF10) having 10 wt% of fluorine content showed the highes water contact angle (107.52±1.6°). The coating films prepared at 1:3 weight ratio of GPTi-HF10 : silica nanoparticle exhibited the highest water contact angle (130.84±1.99°).

A Study on Outsourcing Application of M.E.P. System for Manufacturing Process Improvement of the Modular Construction Method (모듈러건축 공법의 공장제작과정 개선을 위한 M.E.P.시스템 외주제작 적용에 관한 연구)

  • Choi, Jun-Sok;Lee, Jae-Soo
    • Journal of the Korea Institute of Building Construction
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    • v.18 no.3
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    • pp.277-283
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    • 2018
  • This study is conducted to improve the manufacturing process of the modular construction method, which is a pre-fabricated construction method recognized for its advantage on the shortening of construction time. This study first identified the factors that result in shortening of pre-fabrication processes in the current module-processing factory. In addition, those identified factors were further considered for installing the M.E.P. system that is being outsourced on the main module in the production line. A manufacturing process of the construction modules, which considers installation of a M.E.P. system most suitable for shortening the time on the outsourcing of modular construction, is introduced throughout the research. Furthermore, this study suggests the factors in need of improvement during design phase of modular construction and improvement measures to consider the quality of unit modules by focusing on the module parts that are most exposed to defects.

Nanoplasmonics: Enabling Platform for Integrated Photonics and Sensing

  • Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.75-75
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    • 2015
  • Strong interactions between electromagnetic radiation and electrons at metallic interfaces or in metallic nanostructures lead to resonant oscillations called surface plasmon resonance with fascinating properties: light confinement in subwavelength dimensions and enhancement of optical near fields, just to name a few [1,2]. By utilizing the properties enabled by geometry dependent localization of surface plasmons, metal photonics or plasmonics offers a promise of enabling novel photonic components and systems for integrated photonics or sensing applications [3-5]. The versatility of the nanoplasmonic platform is described in this talk on three folds: our findings on an enhanced ultracompact photodetector based on nanoridge plasmonics for photonic integrated circuit applications [3], a colorimetric sensing of miRNA based on a nanoplasmonic core-satellite assembly for label-free and on-chip sensing applications [4], and a controlled fabrication of plasmonic nanostructures on a flexible substrate based on a transfer printing process for ultra-sensitive and noise free flexible bio-sensing applications [5]. For integrated photonics, nanoplasmonics offers interesting opportunities providing the material and dimensional compatibility with ultra-small silicon electronics and the integrative functionality using hybrid photonic and electronic nanostructures. For sensing applications, remarkable changes in scattering colors stemming from a plasmonic coupling effect of gold nanoplasmonic particles have been utilized to demonstrate a detection of microRNAs at the femtomolar level with selectivity. As top-down or bottom-up fabrication of such nanoscale structures is limited to more conventional substrates, we have approached the controlled fabrication of highly ordered nanostructures using a transfer printing of pre-functionalized nanodisks on flexible substrates for more enabling applications of nanoplasmonics.

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Decomposition-based Process Planning far Layered Manufacturing of Functionally Gradient Materials (기능성 경사복합재의 적층조형을 위한 분해기반 공정계획)

  • Shin K.H.;Kim S.H.
    • Korean Journal of Computational Design and Engineering
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    • v.11 no.3
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    • pp.223-233
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    • 2006
  • Layered manufacturing(LM) is emerging as a new technology that enables the fabrication of three dimensional heterogeneous objects such as Multi-materials and Functionally Gradient Materials (FGMs). Among various types of heterogeneous objects, more attention has recently paid on the fabrication of FGMs because of their potentials in engineering applications. The necessary steps for LM fabrication of FGMs include representation and process planning of material information inside an FGM. This paper introduces a new process planning algorithm that takes into account the processing of material information. The detailed tasks are discretization (i.e., decomposition-based approximation of volume fraction), orientation (build direction selection), and adaptive slicing of heterogeneous objects. In particular, this paper focuses on the discretization process that converts all of the material information inside an FGM into material features like geometric features. It is thus possible to choose an optimal build direction among various pre-selected ones by approximately estimating build time. This is because total build time depends on the complexity of features. This discretization process also allows adaptive slicing of heterogeneous objects to minimize surface finish and material composition error. In addition, tool path planning can be simplified into fill pattern generation. Specific examples are shown to illustrate the overall procedure.

Fabrication and Performance Evaluation of Thin Film RTD Temperature Sensor Array on a Curved Glass Surface (곡면 유리 표면 위에서 박막 측온저항체 온도센서 어레이 제작 및 성능 평가)

  • Ahn, Chul-Hee;Kim, Hyoung-Hoon;Park, Sang-Hu;Son, Chang-Min;Go, Jeung-Sang
    • Journal of the Korean Society of Visualization
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    • v.9 no.2
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    • pp.34-39
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    • 2011
  • This paper presents a novel direct fabrication method of the thin metal film RTD temperature sensor array on an arbitrary curved surface by using MEMS technology to measure a distributed temperature field up to $300^{\circ}C$ without disturbing a fluid flow. In order to overcome the difficulty in the three dimensional photography of sensor patterning, the UV pre-irradiated photosensitive dry film resist technology has been developed newly. This method was applied to the fabrication of the temperature sensor array on a glass tube, which is arranged parallel and transverse to a main flow. Gold was used as a temperature sensing material. The resistance change was measured in a thermally controlled oven by increasing the environmental temperature. The linear increase in resistance change and a constant slope were obtained. Also, the sensitivity of each RTD temperature sensor was evaluated.