• 대한두개안면성형외과학회지
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• 제10권1호
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• pp.29-32
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• 2009

Purpose: Alloplastic implants, such as $Silastic^{(R)}$, $Supramid^{(R)}$, Porous polyethylene, $Teflon^{(R)}$ have been used to prevent reherniation of orbital tissue and are known to be inert for many years, though complications are infrequently reported many years after their insertion. Complications associated with implants are infrequent, but infection, orbital hemorrhage, implant extrusion, motility restriction, migration of implant causing dacryocystitis, cystic formation have been described. The latter was known as a rare late complication of blow-out fracture repair. Methods: We report the case of a discovery of a intraorbital hemorrhagic cyst which developed after silicon implant insertion. This patient developed diplopia, unilateral proptosis, exophthalmos, vertical dystopia, ectropion 10 years after repair of blow-out fracture. In this case, orbital CT scan revealed intraorbital cyst surrounding the orbital implant. At surgery, a fibrous capsule surrounded the silicon implant and was filled with mucin pools. Results: Proptosis, diplopia, exophthalmos, ectropion, vertical dystopia were resolved after surgical removal of the cyst and implant. Conclusion: This case illustrate that it is important for us to be aware of the complication of cyst formation around the silicon implants.

• 한국재료학회지
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• 제15권3호
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• pp.177-182
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• 2005

Large amounts of the waste SiC sludge containing small amounts of Si and organic lubricant were produced during the wire cutting process of the single silicon crystal ingots. The waste SiC sludge was purified by the washing process and the purified SiC powders were used to fabricate continuously porous $SiC-Si_3N_4$ composites using a fibrous monolithic process, in which carbon, $6wt\%\;Y_2O_3-2\;wt\%\;A1_2O_3$ and ethylene vinyl acetate were added as a pore-forming agent, sintering additives, and binder, respectively. In the burning-out process, carbon was fully removed and continuously porous $SiC-Si_3N_4$ composites were successfully fabricated. The green bodies containing SiC, Si particles and sintering additives were nitrided at $1410^{\circ}C$ in a flowing $N_2+10\%\;H_2$ gas mixture. Continuously porous composites were combined with SiC, ${\alpha}Si_3N_4,\;\beta-Si_3N_4$ and a few $\%$ of Fe phases. The pore size of the 2nd and the 3rd passed $SiC-Si_3N_4$ composites was $260\;{\mu}m$ and $35\;{\mu}m$ in diameter, respectively.

• 한국세라믹학회지
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• 제31권12호
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• pp.1588-1598
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• 1994

The SiC/MoSi2 composite materials were fabricated by infiltrating the mixture of molybdenum disilicide and metal silicon(MoSi2+Si=100) to a porous compact of silicon carbide and graphite under the vacuum atmosphere of 10-1 torr. The specimen were oxidized in dry air under 1 atm at 130$0^{\circ}C$~150$0^{\circ}C$ for 240 hours. The oxidation behavior was evaluated by the weight gain and loss per unit area of the oxidized samples. Also, SEM and XRD analysis of the oxidized surface of the samples were carried out. With increasing the MoSi2 content and oxidation temperature, the passive oxidation was found. The trend of weight gain of all samples was followed the parabolic rate law with the formation of a protective layer of cristobalite on the surface.

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.143-147
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• 2004

Surface defects and bulk defects on SOI wafers are studied. Two new metrologies have been proposed to characterize surface and bulk defects in epitaxial layer transfer (ELTRAN) wafers. They included the following: i) laser scattering particle counter and coordinated atomic force microscopy (AFM) and Cu-decoration for defect isolation and ii) cross-sectional transmission electron microscope (TEM) foil preparation using focused ion beam (FIB) and TEM investigation for defect morphology observation. The size of defect is 7.29 urn by AFM analysis, the density of defect is 0.36 /cm$^2$ at as-direct surface oxide defect (DSOD), 2.52 /cm$^2$ at ox-DSOD. A hole was formed locally without either the silicon or the buried oxide layer (Square Defect) in surface defect. Most of surface defects in ELTRAN wafers originate from particle on the porous silicon.

• Bulletin of the Korean Chemical Society
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• 제33권1호
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• pp.83-89
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• 2012

Due to the potential importance and usefulness, usage of highly ordered nanoporous anodized aluminum oxide can be broadened in industry, when highly ordered anodized aluminum oxide can be placed on a substrate with controlled thickness. Here we report a facile route to highly ordered nanoporous alumina with the thickness of hundreds-of-nanometer on a silicon wafer substrate. Hexagonally or tetragonally ordered nanoporous alumina could be prepared by way of thermal imprinting, dry etching, and anodization. Adoption of reusable polymer soft molds enabled the control of the thickness of the highly ordered porous alumina. It also increased reproducibility of imprinting process and reduced the expense for mold production and pattern generation. As nanoporous alumina templates are mechanically and thermally stable, we expect that the simple and costeffective fabrication through our method would be highly applicable in electronics industry.

• 한국결정성장학회지
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• 제18권1호
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• pp.38-44
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• 2008

c-축 배향을 갖는 MFI 제올라이트 필름$(<35{\mu}m)$을 종자결정 성장법을 이용하여 실리카라이트-1 종자결정이 도포된 알루미나와 실리콘 지지체 위에 성장시켰다. 지지체 표변에서 성장된 필름은 전자현미경과 X- 회절 분석을 이용하여 조사하였다. 지지체 표면의 거친 정도에 따른 필름의 성장에 미치는 영향에 대해서 조사하였으며 c- 축 배향을 갖는 필름과 종자결정 성장법에서 나타나는 특징적인 돔 형태의 결함구조의 생성과 반응기구에 대해서 설명하였다. 지지체 표면의 거친 정도가 c- 축 배향에 중요한 역할을 하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.977-980
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• 2004

본 논문에서는 저가 고효율 태양전지를 제작하기 위하여 p형 다결정 실리콘 기판을 사용하여 수산화 칼륨(KOH)이 포함된 용액에 Saw damage 과정 후 불산이 함유된 용액에 전기화학적 양극산화 과정으로 실리콘 웨이퍼 표면에 요철을 형성하여 다공성 실리콘을 형성 하였다. 본 논문은 전기화학적 에칭방법으로 기존의 진공장비로 제작된 반사방지막의 반사율만큼 감소된 다공성 실리콘 반사방지막을 형성하였다. 전자빔 증착기(e-beam evaporator)로 단층으로 형성된 $TiO_2$의 반사방지막은 400-1000 nm의 파장 범위에서 4.1 %의 평균 반사율을 가졌으며, 양극산화과정으로 형성된 다공성 실리콘은 400-1000 nm의 파장의 범위에서 4.4 %의 평균 반사율을 가졌다. 본 연구는 태양전지의 반사방지막 형성을 기존의 제작 방법보다 간단하고 저렴한 방법으로 접근하여 태양전지의 변환효율을 상승하는데 목적을 두었다.

• 한국세라믹학회지
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• 제48권5호
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• pp.360-367
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• 2011

Macroporous silicon carbide (SiC) ceramics were fabricated by powder processing and polymer processing using carbon-filled polysiloxane as a precursor. The effects of the starting SiC polytype, template type, and template content on porosity and flexural strength of macroporous SiC ceramics were investigated. The ${\beta}$-SiC powder as a starting material or a filler led to higher porosity than ${\alpha}$-SiC powder, owing to the impingement of growing ${\alpha}$-SiC grains, which were transformed from ${\beta}$-SiC during sintering. Typical flexural strength of powder-processed macroporous SiC ceramics fabricated from ${\alpha}$-SiC starting powder and polymer microbeads was 127 MPa at 29% porosity. In contrast, that of polymer-processed macroporous SiC ceramics fabricated from carbon-filled polysiloxane, ${\beta}$-SiC fillers, and hollow microspheres was 116MPa at 29% porosity. The combination of ${\alpha}$-SiC starting powder and a fairly large amount (10 wt%) of $Al_2O_3-Y_2O_3$ additives led to macroporous SiC ceramics with excellent flexural strength.

• 한국결정성장학회지
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• 제5권3호
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• pp.284-290
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• 1995

다공성 실리콘의 기공은 n형 실리콘의 경우 기판에 수직으로 성장하여 이는 큰 곡률을 가지는 기공 끝 부분에서의높은 전기장에 의한 tunneling 기구로 설명된다. 본연구에서는 불산 수용액에서 전기화학적인 방법으로 다공성 실리콘을 제조할 때 n형 단결정 실리콘 기판과 전해질 용액의 계면에서의 전압 분포를 Poisson식에 의하여 수치적으로 계산하였다. 이 전압 분포로 기공 벽에서의 전기장 세기 및 전류 세기를 구하여 기공이 기판에 수직으로 성장하는 것을 설명하였다. 기공 사이의 거리는 고갈층의 두께에 의하여 결정되며, 고갈층의 두깨를 계산하여 그 원인에 대해서도 고찰하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1075-1080
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• 2003

Design and fabrication process of a full inorganic electroluminescent microdislay based on aluminum / nanostructured porous silicon reverse biased light emitting Schottky diodes are discussing. Being of a solid state construction. this micro-display is cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of a LED-array and driving circuitry onto a Si-chip will be also discussed.