• Polymer(Korea)
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• v.34 no.5
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• pp.480-484
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• 2010

A series of poly(amic acid)s(PAAs) was prepared by reacting 4,4'-(4,4'-isopropylidenediphenoxy) bis(phthalic anhydride)(BPADA) as the anhydride monomer and 2,2'-bis(trifluoromethyl) benzidine (TFB), bis(3-aminophenyl)sulfone (APS), 4,4'-methylenebis-(2-methylcyclohexylamine) (MMCA), or bis[4-(3-aminophenoxy) phenyl] sulfone (BAPS) as the amine monomer with 5 mol% melamine in N,N-dimethylacetamide (DMAc). Colorless and transparent polyimide (PI) films were obtained by casting the PAAs at various heat treatment temperatures. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA), and their optical transparency were measured by spectrophotometry. The coefficient of thermal expansion (CTE) and yellow index (YI) values of all samples were in the range of $48.53-64.24ppm/^{\circ}C$ and < 3.0, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1497-1502
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• 2012

To manufacture a robot hand that essentially mimics the functions of a human hand, it is necessary to develop flexible actuators and sensors. In this study, we propose the design, manufacture, and performance verification of flexible actuators and sensors based on Electro Active Polymer (EAP). EAP is fabricated as a type of film, and it moves with changes in the voltage because of contraction and expansion in the polymer film. Furthermore, if a force is applied to an EAP film, its thickness and effective area change, and therefore, the capacitance also changes. By using this mechanism, we produce capacitive actuators and sensors. In this study, we propose an EAP-based capacitive sensor and evaluate its use as a robot hand sensor.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Polymer(Korea)
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• v.35 no.2
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• pp.146-151
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• 2011

The physical properties of poly (ethylene 2,6-naphthalate) (PEN) copolymers were studied. PEN copolymers were synthesized successfully from the mixtures of ethylene glycol(EG), 1,3-propanediol (PD) and l,4-butanediol (BD) with 2,6-dimethyl naphthalene dicarboxylate. The results indicated that PEN copolymers showed an amorphous state when the content of BD(PD) in applied EG/BD(EG/PD) mixtures was less than 40% during the polycondensation. As a result, the lowering of thermal properties, orientation, and mechanical properties was found, however, the dimensional stability was improved. This is a promising result to apply the synthesized PEN copolymers as flexibles substrates.

• Membrane Journal
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• v.25 no.2
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• pp.85-98
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• 2015

A global trend of replacing metal or glass containers with polymer-based packaging materials has been prevalent in the food packaging industry due to their ease in processibility, excellent transparency, and good cost efficiency. Barrier polymers tend to show low permeabilities for atmospheric gases such as oxygen, carbon dioxide, and water vapor, which allow them to be utilized in the food and beverage packaging industry. With the current global trend, expansion of polymeric packaging materials to new markets such as oxygen sensitive juices, flavored water, and energy drinks requires improved $CO_2$ and $O_2$ barrier properties. The improvement of the existing polymer-based barrier platform will enable a rapid market impact. In this paper, the current barrier technologies such as (1) antiplasticization-induced barrier materials, (2) synergistic effect of antiplasticization and crystallization, (3) new barrier polymers, (4) nanocomposite materials, and (5) polymer blending are introduced with their characterization techniques for the development of advanced packaging materials.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2004.05a
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• pp.74-80
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• 2004

Among inorganic materials, it is grounding resistance lower agent of new form that use being strata style clay and makes using water soluble polymer by main material to organic substance. Water soluble polymer chains are dispertion in water because water soluble polymer reacts with water if is done and these discrete polymer chains are inserted to floor of being strata style clay with water. This material that moisture content is very excellent and rate of expansion, electrical conductivity that measure after supplies water of 300wt % as well as is excellent. Can prevent corrosion or electrolytic corrosion of grounding bar securing very environmentally, chemically and pollution of soil. When applied to general grounding rod worker $7{\sim}8$ times ground resistance reduction effect of not application.

• Journal of Applied Reliability
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• v.8 no.4
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• pp.155-166
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• 2008

PTH cracks are caused by the mismatch of coefficient of thermal expansion(CTE) between polymer and laminated materials, and are one of the main failure mechanisms of multi layer boards. In spite of its importance, it is usually hard to measure or detect them because of its small size and invisibility. To detect PTH cracks more effectively, this paper proposes a theoretical model that can estimate the resistance value from crack size of PTHs. Using four-point probe resistance measurement method, the resistance value of test coupons is measured. Through measured data, we verify the validity of the proposed theoretical model and set up criteria of failure.

• Laser Solutions
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• v.11 no.2
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• pp.26-32
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• 2008

Micro lens array (MLA) is widely used in information technology (IT) industry fields, for examples such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method, micro etching, electroplating, micromachining and laser local heating. Laser local thermal-expansion (LLTE) technology demonstrates the formation of microdots on the surface of polymer substrate, in this paper. We have also investigated the new direct fabrication method of placing the MLA on the surface of a SU-8 photoresist layer. We have obtained the 3D shape of the micro lens processed by UV laser irradiation and have experimentally verified the optimal process conditions.

• Journal of the Korea institute for structural maintenance and inspection
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• v.11 no.5
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• pp.89-98
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• 2007

This study investigates the deformation behavior, related to debonding failure, of adhesion and repairing-strengthening materials of RC construction. A strain-stress curve shows that when the stress of specimens reached the highest and then fails, the strain value of cement mortar is $2.0{\times}10^{-3}$, while concrete was indicated at around $1.3{\times}10^{-3}$, epoxy resins are $0.8{\times}10^{-3}$, polymer mortar is $2.5{\times}10^{-3}$, steel plate is $2.5{\times}10^{-3}$, and carbon bar was $9.1{\times}10^{-3}$, respectively. For a thermal expansion coefficient with temperature variation, those basis materials, cement mortar and concrete, exhibited around $10{\mu}{\varepsilon}/{^{\circ}C}$, but adhesive materials, such as epoxy resins and polymer mortar, were $41{\sim}54{\mu}{\varepsilon}/{^{\circ}C}$ and $-0.5{\sim}0.7{\mu}{\varepsilon}/{^{\circ}C}$, respectively. In the case of steel plate is similar to basic materials but carbon fiber is indicates at $-1.7{\mu}{\varepsilon}/{^{\circ}C}$, which is the lowest value. Especially, between basic and adhesive materials, the thermal expansion coefficient was highly different. Although the coefficient depends on the type of epoxy resins, it is clear that the epoxy resins are susceptible to be debonded in nature, when the difference of environmental temperature varies more than $20{\sim}35{^{\circ}C}$.

• Carbon letters
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• v.19
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• pp.1-11
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• 2016

In efforts to characterize and understand the properties and processing of phenylethynyl-terminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.