• 제목/요약/키워드: polycrystalline 3C-SiC

검색결과 159건 처리시간 0.033초

Direct deposition technique for poly-SiGe thin film achieving a mobility exceeding 20 $cm^2$/Vs with ~30 nm thick bottom-gate TFTs

  • Lim, Cheol-Hyun;Hoshino, Tatsuya;Hanna, Jun-Ichi
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1028-1031
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    • 2009
  • High quality poly-SiGe thin films were prepared on 6-inch substrates using Reactive-thermal CVD with $Si_2H_6$ and $GeF_4$ around at $500^{\circ}C$ directly. Its thickness uniformity was ~ 3% on the entire substrate area. N-channel mobility of ~30 nm thick bottom-gate TFTs exceeded 20 $cm^2$/Vs without any further crystallization.

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유도결합 플라즈마-마그네트론 스퍼터링 방법을 이용한 저온 폴리실리콘 제조 (Fabrication of Low Temperature Poly-Silicon by Inductively Coupled Plasma Assisted Magnetron Sputtering)

  • 유근철;박보환;주정훈;이정중
    • 한국표면공학회지
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    • 제37권3호
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    • pp.164-168
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    • 2004
  • Polycrystalline silicon thin films were deposited by inductively coupled plasma (ICP) assisted magnetron sputtering using a gas mixture of Ar and $H_2$ on a glass substrate at $250^{\circ}C$. At constant Ar mass flow rate of 10 sccm, the working pressure was changed between 10mTorr and 70mTorr with changing $H_2$ flow rate. The effects of RF power applied to ICP coil and $Ar/H_2$ gas mixing ratio on the properties of the deposited Si films were investigated. The crystallinity was evaluated by both X-ray diffraction and Raman spectroscopy. From the results of Raman spectroscopy, the crystallinity was improved as hydrogen mixing ratio was increased up to$ Ar/H_2$=10/16 sccm; the maximum crystalline fraction was 74% at this condition. When RF power applied to ICP coil was increased, the crystallinity was also increased around 78%. In order to investigate the surface roughness of the deposited films, Atomic Force Microscopy was used.

Ferroelectric $SrBi_2Ta_2O_9$ Thin Films by Liquid-Delivery Metalorganic Chemical Vapor Deposition using $Sr[Ta(OEt)_5(dmae)]_2$ and $Bi(C_6H_5)_3$

  • Shin, Wonng-Chul;Choi, Kyu-Jeong;Park, Chong-Man;Yoon, Soon-Gil
    • The Korean Journal of Ceramics
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    • 제6권3호
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    • pp.219-223
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    • 2000
  • The ferroelectric SBT films were deposited on Pt/Ti/SiO$_2$/Si substrates by liquid injection metalorganic chemical vapor deposition (MOCVD) with single-mixture solution of Sr[Ta(OEt)$_5$(dmae)]$_2$and Bi(C$_6$ 6/H$_5$)$_3$. The Sr/Ta and Bi/Ta ratio in SBT films depended on deposition temperature and mol ratio of precursor in the single-mixture solution. At the substrate temperature of 40$0^{\circ}C$, Sr/Ta and Bi/Ta ratio were close to 0.4 and 1 at precursor mol ratio of 0.5~1.0, respectively. As-deposited film was amorphous. However, after annealing at 75$0^{\circ}C$ for 30 min in oxygen atmosphere, the diffraction patterns indicated polycrystalline SBT phase. The remanent polarization (Pr) and coercive field (Ec) of SBT film annealed at 75$0^{\circ}C$ were 4.7$\mu$C/$\textrm{cm}^2$ and 115.7kV/cm at an applied voltage of 5V, respectively. The SBT films annealed at 75$0^{\circ}C$ showed practically no polarization fatigue up to 10$^10$ switching cycles.

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Cd$_{0.96}$Ze$_{0.04}$Te 박막의 전기 광학적 특성 (The electrical and optical properties of Cd$_{0.96}$Ze$_{0.04}$Te thin films)

  • 김선옥;현준원
    • 한국표면공학회지
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    • 제31권6호
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    • pp.389-392
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    • 1998
  • We have investigated the crystal properties of the Cd0.96Zn0.04Te(CZT) films evaporated on the Si(100) substrates by Elecctron Beam Evaporator(EBE) techique. The compositions of the As-preared films were different about 4% of atomic ratio, The films stucture was observad to be polycrystalline in cubic phase. Diffraction peaks were notable at the substrate temperature of $300^{\circ}C$. The reflectance measurements yield $E_1$=3.25~3.29 eV $E_1$+${\Delta}_1$=3.76~3.83 eV and $E_2$=5.08 eV,showing that the films wear in cubic phase. For the film evaporated at the substrate temperature of $150^{\circ}C$, the peaks of photocurrent are at 720nm and 980nm.

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Electrical Properties of $Ba_{1-x}Sr_xTiO_3$ Thin Films Deposited by Metalorganic Chemical Vapor Deposition

  • Yoon, Jong-Guk;Yoon, Soon-Gil;Lee, Won-Jea
    • The Korean Journal of Ceramics
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    • 제1권4호
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    • pp.204-208
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    • 1995
  • The microstructure and electrical propetries were investigated for polycrystalline $Ba^{1-x}Sr_xTiO_3$(BST) thin films deposited on Pt/Ti/$SiO_2$(PTSS) and Pt/MgO(PM) substrates by metalorganic chemical vapor deposition (MOCVD). BST films on PTSS have coulmnar and porous structures, while on PM have an equiaxied and dense structure. The dielectric constant and a dissipation factor of BST films on PTSS and 20 fC/$\mu \textrm{cm}^3$ on PTSS and 12fC/$\mu \textrm{cm}^2$ on PM was obtained at an applied electric field of 0.06 MV/cm. Leakage current density of BST films on PM was smaller than that on PTSS. The leakage current density level was about $8\times10^{-8}A/\textrm{cm}^2$ at 0.04MV/cm.

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Sol-Gel법으로 증착된 $Bi_4Ti_3O_{12}$ 박막의 형태적, 구조적 특성과 강유전성에 Gadolinium 치환이 미치는 효과 (Influence of Gd Substitution on the Morphological, Structural and Ferroelectric Properties of $Bi_4Ti_3O_{12}$ Thin Films Obtained by Sol-Gel Method)

  • 강동균;김병호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.341-342
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    • 2006
  • Gadolinium-substituted bismuth titanate, $Bi_{3.3}Gd_{0.7}Ti_3O_{12}$ (BGT), thin films were successfully fabricated on Pt(111)/Ti/$SiO_2$/Si substrates by a sol-gel method and their structural and ferroelectric properties have been characterized. Fabricated BGT thin films were found to be random orientations, which were confirmed by X-ray diffraction experiment and scanning electron microscope analysis. The remanent polarization ($2P_r$)) of BGT thin film annealed at $720^{\circ}C$ was $25.85\;{\mu}C/cm^2$ at an applied voltage of 5 V. The BGT thin films exhibited a 11 % reduction in their switching charge after no less than $10^{11}$ switching cycles at a frequency of 1 MHz.

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고밀도 플라즈마 CVD 방법에 의한 TiN barrier metal 형성과 특성 (Characteristics of TiN Barrier Metal Prepared by High Density Plasma CVD Method)

  • 최치규;강민성;오경숙;이유성;오대현;황찬용;손종원;이정용;김건호
    • 한국재료학회지
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    • 제9권11호
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    • pp.1129-1136
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    • 1999
  • TEMAT precursor를 사용하여 다양한 증착 조건으로 ICP-CVD 방법으로 Si(100) 기판 위에 TiN 박막을 형성하였다. 형성된 TiN 박막의 결정상, 미세구조, 그리고 전기적 특성은 XRD, XPS, HRTEM, 그리고 전기적 측정으로 특성을 조사하였다. BI 구조를 갖는 다결정 TiN 박막은 기판의 온도가 $200^{\circ}C$ 이상의 온도에서 형성되었다. TiN(111) 박막은 기판의 온도가 $300^{\circ}C$에서 TEMAT, $\textrm{N}_{2}$, 그리고 Ar 가스의 유량이 10, 5, 그리고 5sccm으로 반응로에 주입할 때 형성되었다. TiN/Si(100) 계면은 TiN과 $\textrm{SiO}_2$사이에 계면반응이 없었으며 평탄하였다. 기판의 온도가 $500^{\circ}C$에서 형성된 TiN 박막의 비저항, carrier 농도와 이동도는 21 $\mu\Omega$cm, 9.5$\times\textrm{10}^{18}\textrm{cm}^{-3}$$462.6\textrm{cm}^{2}$/Vs으로 주어졌다.

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기판 효과에 따른 저 자장 영역에서의 자기저항 효과에 관한 연구 (The Low-field Tunnel-type Magnetoresistance Characteristics of Thin Films Deposited on Different Substrate)

  • 이희민;심인보;김철성
    • 한국자기학회지
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    • 제12권2호
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    • pp.41-45
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    • 2002
  • 졸-겔법으로 제조된 La/sub 0.7/Pb/sub 0.3/MnO₃(LPM)박막의 기판 효과에 따른 저 자장 영역에서의 터널형 자기저항 효과에 대하여 연구하였다. 다결정 LPMO 박막은 SiO₂/Si(100) 기판과 그 위에 확산 방지막(diffusion barrier)으로 안정화 지르코니아(yttria-stabilized zirconia, YSZ) 중간층을 도입한 기판에 증착하였으며, 반면에 c-축 방향 성장을 갖는 박막의 경우 LaA1O₃(001) (LAO) 단결정 기판을 사용하였다. LPMO/LAO 박막에서의 rocking curve 측정 결과 full width half maximum (FWHM) 값은 0.32°값을 가짐을 알 수 있었다. 상온(300 K)에서 측정한 자기저항비(MR ratio) 값은 500 Oe리 외부자장을 인가시 LPMO/SiO₂/Si 박막의 경우 0.52%, LPMO/YSZ/SiO₂/Si 박막인 경우는 0.68% 그리고, LPMO/LAO의 경우에는 0.4%에도 미치지 못하는 값을 가졌다. 이때 MR최대값을 나타내는 peaks는 자기이력 곡선의 보자력 부근에서 나타남으로 그 두 결과가 잘 일치함을 보여 주고 있다. 이러한 저 자장 영역에서의 자기저항 값의 타이는 박막 시료의 기판 효과에 의한 grain boundary특성의 차이로부터 기인된다.

MgO의 고온 Creep에 미치는 미량 첨가물의 영향 (Effect of Minor Additives on the MgO Creep)

  • 김환
    • 한국세라믹학회지
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    • 제14권3호
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    • pp.182-186
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    • 1977
  • Compression creep of polycrystalline magnesia at about 1$600^{\circ}C$ under 5-40kg/$\textrm{cm}^2$ was examined, and also the effects on it of minor additives such as B2O3, CaO and SiO2 were examined. The high temperature creep of high purity magnesia was primarily controlled by the Nabarro-Herring type lattice diffusion of Mg in magnesia. B2O3 was included in the molten state and showed on increasing B2O3 contents. Some of the CaO and SiO2 were also included in the molten state, promoted the grain boundary sliding, so that creep rate was increased with an increasing content of them.

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다결정 박막 트랜지스터 적용을 위한 SiNx 박막 연구 (A Study on the Silicon Nitride for the poly-Si Thin film Transistor)

  • 김도영;김치형;고재경;이준신
    • 한국전기전자재료학회논문지
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    • 제16권12S호
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    • pp.1175-1180
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    • 2003
  • Transformer Coupled Plasma Chemical Vapor Deposited (TCP-CVD) silicon nitride (SiNx) is widely used as a gate dielectric material for thin film transistors (TFT). This paper reports the SiNx films, grown by TCP-CVD at the low temperature (30$0^{\circ}C$). Experimental investigations were carried out for the optimization o(SiNx film as a function of $N_2$/SiH$_4$ flow ratio varying ,3 to 50 keeping rf power of 200 W, This paper presents the dielectric studies of SiNx gate in terms of deposition rate, hydrogen content, etch rate and leakage current density characteristics lot the thin film transistor applications. And also, this work investigated means to decrease the leakage current of SiNx film by employing $N_2$ plasma treatment. The insulator layers were prepared by two step process; the $N_2$ plasma treatment and then PECVD SiNx deposition with SiH$_4$, $N_2$gases.