• 한국분말재료학회지
• /
• 제29권6호
• /
• pp.511-516
• /
• 2022

Electroless plating is widely utilized in engineering for the metallization of insulator substrates, including polymers, glass, and ceramics, without the need for the application of external potential. Homogeneous nucleation of metals requires the presence of Sn-Pd catalysts, which significantly reduce the activation energy of deposition. Therefore, rinsing conducted during Sn sensitization and Pd activation is a key variable for the formation of a uniform seed layer without the lack or excess of catalysts. Herein, we report the optimized rinsing process for the functionalization of Sn-Pd catalysts, which enables the uniform FeCo metallization of the glass fibers. Rinsing enables good deposition of the FeCo alloy because of the removal of excess catalysts from the glass fiber. Concurrently, excessive rinsing results in a complete removal of the Sn-Pd nucleus. Collectively, the comprehensive study of the proposed nanomaterial preparation and surface science show that the metallization of insulators is a promising technology for electronics, solar cells, catalysts, and mechanical parts.

• 청정기술
• /
• 제17권2호
• /
• pp.103-109
• /
• 2011

전기도금의 seed layer를 형성하는 무전해 동도금 공정의 throwing power (TP)와 두께 편차를 개선하기 위한 공정 최적화 방법을 제시하였다. 실험계획법 (DOE)을 이용하여 가능한 모든 공정 인자들 가운데 TP와 두께 편차에 가장 큰 영향을 미치는 주요 인자를 파악해 보았다. 균일성을 가진 via filling을 위해서는 도금액 내의 Cu 이온의 농도를 높여주고 도금 온도를 낮추어 주는 것이 바람직한 것으로 판단되었으며 이는 표면 반응성의 측면에서 설명되었다. Kinetic Monte Carlo (MC) 모사가 이를 시각화하기 위해 도입되었으며 실험에서 관찰된 현상을 정성적으로 무리 없이 설명할 수 있었다. 실험계획법을 이용한 체계적인 실험과 이를 뒷받침하는 이론적인 모사가 결합된 본 연구의 접근법은 관련 공정에서 유용하게 활용될 수 있을 것이다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.366-369
• /
• 2003

The vertical fountain plating system with the point contact has been used in semiconductor industry. But the plating shape in the opening of photoresist becomes gradated shape, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. So, we designed the tilted electrode ring contact to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha$-step. A photoresist was coated to a thickness of $60{\mu}m$ and vias were patterned by a contact aligner After via opening, solder layer was electroplated using the fountain plating system and the tilted electrode ring contact system. In $\alpha$-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were ${\pm}16%,\;{\pm}3.7%$ respectively. In this study, we could get high uniformity bumps by the tilted electrode ring contact system. So, tilted electrode ring contact system is expected to improve workability and yield in module process.

• Corrosion Science and Technology
• /
• 제6권5호
• /
• pp.257-260
• /
• 2007

In order to further improve the corrosion resistance and wear resistance of the Ni-P coatings of electroless plating, electroless Ni-P/n-$Al_2O_3$ composite deposits were prepared by adding some nano $Al_2O_3$ Particles in Ni-P plating bath. The bath composition and proproties were studied in this paper. The orthogonal test was applied in order to get the new composite solution, taking the initial stable potential as evaluation standard and considering the elements correlation at the same time. The processing parameters have been optimized by single factor experiment in which the depositing speed was chosen as the evaluation standard. The results showed that the process is stable and the composite Ni-P/n-$Al_2O_3$ deposits werebright and smooth, whose hardness and corrosion resistance are much better than simple Ni-P coatings. Furthermore the surface appearance and structure of the composite Ni-P/n-$Al_2O_3$ coating were investigated by SEM and XRD method. It was proved that the coating surface is typical cystiform cells and its structure is amorphous. All test results ofcomposite coating showed that all various physical coating properties had been improved by adding nano-particles. The hardness of optimal coating is more than 600HV and increases to 1000HV after heat-treating, and its hardness is 20~50% higher than Ni-P coating. The rust points appeared in 200 hour by immersing the coating into the 10%HCl solution and the corrosive speed is $3{\times}10^{-3}mg/(cm^2{\cdot}h)$which was obtained after 300 hour. In the same condition Ni-P coating is $5.6{\times}10^{-3}mg/(cm^2{\cdot}h)$. The salt spray resistance of the layers can exceed 600h with the thickness $20{\mu}m$.

• 자원리싸이클링
• /
• 제21권6호
• /
• pp.39-44
• /
• 2012

무전해 구리 도금폐수로부터 증발농축 및 전해채취법을 이용하여 구리를 회수하기 위한 연구를 수행하였다. 무전해 구리 도금폐수의 분석결과, Cu 함량은 582 mg/l로 나타났으며, 미량의 Fe 성분이 함유되어 있었다. 또한, 로셀염의 첨가로 인하여 COD 9,560 mg/l, TOC 13,100 mg/l로써 매우 높았으며, 포름알데히드가 산화된 formic acid의 함량은 7.73%로 나타났다. 실험결과, 구리의 전해채취시 전류밀도가 증가할수록 전류효율은 감소하는 것으로 나타났다. 또한, 전류효율을 80% 이상으로 유지하기 위해서는 구리의 전해채취시 전류밀도를 $40mA/cm^2$ 이하로 낮추어야 함을 알 수 있었다. 전해채취를 통해 얻은 Cu중의 평균 Fe 함량은 황산농도 2 vol% 및 10 vol%에서 각각 0.021% 및 0.01%로 나타나 황산농도가 높을수록 Fe 혼입을 억제할 수 있는 것으로 나타났다.

• 한국표면공학회지
• /
• 제42권4호
• /
• pp.157-160
• /
• 2009

Many fundamental studies have been carried out regarding waste water and hazardous gas treatments technologies using the photolysis effect of $TiO_2$. However, a permanent use of $TiO_2$ particles immobilized using organic or organic-inorganic binders is impossible. In this study, Ni-$TiO_2$ composite coating was produced by electroless plating to trap $TiO_2$ particles in the Ni coating layer. The electroless plating was performed in the bath solutions with three different concentrations of $TiO_2$ particles : 10 g/l, 20 g/l, and 40 g/l. The surface and photolytic characteristics of the coating layer was investigated by the use of SEM, a scratch tester, and an UV-Visible spectrophotometer. The results showed that the amounts of immobilized $TiO_2$ particles and the photolytic rate of the coating increased with the initial content of $TiO_2$ particles in the electroless bath. In addition, the photolytic rate of the Ni-$TiO_2$ composite coating was remarkably promoted by etching process in 10% HCl solution.

• 한국전산유체공학회:학술대회논문집
• /
• 한국전산유체공학회 2008년도 12th Asian Congress of Fluid Mechanics
• /
• pp.60.2-60.2
• /
• 2008

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2009년도 추계학술대회 논문집
• /
• pp.199-200
• /
• 2009

• 한국표면공학회지
• /
• 제21권3호
• /
• pp.114-129
• /
• 1988

The principles of the physical vapour deposition processes(PVC); evaporation, sputting, and ion plating are presented and compared with each other with respect to coating properties, deposition rate and process control. The significance of coating sources and vacuum equipment for hard materials coating is discussed.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1995년도 하계학술대회 논문집 C
• /
• pp.1419-1421
• /
• 1995

Nickel micro-structures are fabricated by electroless plating which shows better uniformity. Positive resist AZ4562 of 7 um thickness is patterned with minimum width of 2 um on poly-silicon as for sacrificial layer. The growth rate of Ni electroless plating is 10um/h both for the seed layer of Pt and TiW. TiW is found to be more practical than Pt, since it is very difficult to remove Pt with negligible damage to Ni structures.