• 한국광학회:학술대회논문집
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• 한국광학회 2004년도 제15회 정기총회 및 동계학술발표회
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• pp.130-131
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• 2004

• 한국재료학회:학술대회논문집
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• 한국재료학회 2000년도 추계학술발표강연 및 논문개요집
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• pp.90-90
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• 2000

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.179-182
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• 2011

• 한국진공학회지
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• 제6권4호
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• pp.321-325
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• 1997

LCD용 칼라 필터를 제작하는 방법으로 감광성 고분자(photosensitive polymer)에 광 리소그라피(photolithography)기술이 많이 이용되어지고 있다. 이로 인해 감광성 고분자 표 면의 물리적, 화학적 성질이 변하게 되는데, 이는 후속 공정인 플라즈마 식각이나 ITO 전극 의 증착 등에도 많은 영향을 주므로, 각 공정에 따른 이들 고분자의 표면 연구는 매우 중요 하다. 본 논문에서는 blue 칼라 필터의 고분자 표면에 대한 연구를 SIMS와 XPS를 이용하 여 수행하였으며, 표면의 거칠기 변화를 AFM을 통해 관찰하였다. SIMS와 XPS결과로부터 초기 공정인 blue 칼라 필터를 스핀 코팅하고 pre bake한 상태에서는 주로 칼라 필터의 주 성분인 단량체와 결합제의 고분자 물질이 표면에 드러나 있다가, 노광 과정을 거치고 post bake한 시료에서는 색깔을 내는 안료 성분이 표면에 드러남을 확인하였고, AFM을 통해서 는 post bake후에 표면에 더 거칠어 짐을 관찰하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.124-124
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• 2010

Currently, extreme ultraviolet lithography (EUVL) is being investigated for next generation lithography. EUVL is one of competitive lithographic technologies for sub-22nm fabrication of nano-scale Si devices that can possibly replace the conventional photolithography used to make today's microcircuits. Among the core EUVL technologies, mask fabrication is of considerable importance due to the use of new reflective optics having a completely different configuration compared to those of conventional photolithography. Therefore, new materials and new mask fabrication process are required for high performance EUVL mask fabrication. This study investigated the etching properties of SnO2 (Tin Oxide) as a new absorber material for EUVL binary mask. The EUVL mask structure used for etching is SnO2 (absorber layer) / Ru (capping / etch stop layer) / Mo-Si multilayer (reflective layer) / Si (substrate). Since the Ru etch stop layer should not be etched, infinitely high selectivity of SnO2 layer to Ru ESL is required. To obtain infinitely high etch selectivity and very low LER (line edge roughness) values, etch parameters of gas flow ratio, top electrode power, dc self - bias voltage (Vdc), and etch time were varied in inductively coupled Cl2/Ar plasmas. For certain process window, infinitely high etch selectivity of SnO2 to Ru ESL could be obtained by optimizing the process parameters. Etch characteristics were measured by on scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analyses. Detailed mechanisms for ultra-high etch selectivity will be discussed.

• 센서학회지
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• 제1권2호
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• pp.101-106
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• 1992

반도체 pH 센서인 pH-ISFET와 효소 고정화막을 기술적으로 결합한 FET형 반도체 요소 및 포도당센서를 제조하고 그 동작특성을 조사하였다. 사진식각기술을 이용하여 pH-ISFET의 수소이온 감지막 위에 urease와 glucose oxidase를 감광성 고분자 물질인 PVA(polyvinyl alcohol)-SbQ(stilbazolium group)로 고정화(immobilization)시켰다. 제조된 요소센서와 포도당센서는 각각 $0.5{\sim}50{\;}mg/dl$ 범위의 요소농도와 $10{\sim}1000{\;}mg/dl$의 포도당 농도를 정량 할 수 있었다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2013년도 춘계학술대회 논문집
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• pp.809-809
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• 2013

We report a new method for highly controllable local patterning of a hydrogel on microfabricated cantilevers and fabrication of all hydrogel microcantilevers. We constructed a dynamic mask based photolithography setup using a commercial beam projector, a 3-axis microstage and other optical components. Dynamic masks generated from the beam projector controlled the shape, size, and position of hydrogel patterns while the 3-axis microstage mainly controlled the thickness of hydrogel patterns and hydrogel microcantilevers. Using the constructed setup, polyethyleneglycol diacrylate (PEGDA) was patterned on microfabricated cantilevers in a highly controlled manner. Currently, the smallest PEGDA patternable is a 5-${\mu}m$-diameter circle with a thickness of ~$10{\mu}m$. To confirm thicknesses of patterned PEGDAs on silicon microcantilevers, resonance frequencies of microcantilevers were measured before and after each PEGDA patterning. Thicknesses extracted from resonance measurements showed good agreement with measurements using an optical microscope. In addition, PEGDA microcantilevers with various dimensions and thicknesses were fabricated on glass and silicon substrates. Surfaces of fabricated all hydrogel microcantilevers were flat enough to facilitate other post processing and to be used for various sensing applications.

• 한국진공학회지
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• 제8권1호
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• pp.31-35
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• 1999

본 연구에서는 반도체 소자에서 일렉트로마이그레이션에 기인하는 Al-1%Si 박막배선의 길이 변화에 따른 수명시간 의존도를 조사하였다. 사용된 Al-1%Si 박막배선은 표준 사진식각 공정(standard photolithography process)을 사용하여 제작된 직선형 패턴이다. 직선형 패턴은 100에서 1600 $mu extrm{m}$ 범위의 길이 변화를 갖도록 제작하였다. Ti underlayer가 없는 시편보다 Ti underlayer가 있는 시편에서 Al-1%Si 박막배선의 수명시간이 더 길게 나타났다. Ti underlayer를 갖는 시편에서 electromigration에 대한 저항성을 향상시키는 것으로 사료되어진다. Al-1%Si 박막배선의 길이에 의존하는 수명시간은 800$\mu\textrm{m}$ 이하에서 포화되는 경향을 나타내었다.

• 한국세라믹학회지
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• 제45권11호
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• pp.739-743
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• 2008

Microfluidic device can be applied in a wide range of chemical and biological technology. In this paper, ceramic-based T-type passive mixers for microfluidic applications were fabricated by LTCC process combined with thick film photolithography. The base ceramic material in thick film was amorphous cordierite $((Mg,Ca)_2Al_4Si_5O_{18})$ and photoimageable polymers were added to give a photosensitivity. Two types of passive mixer, which showed the channel width of 1.0 mm and $200{\mu}m$, respectively, were designed considering mixing efficiency in the channel and their microfluidic properties were discussed in detail.

• 한국전기전자재료학회논문지
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• 제16권1호
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• pp.46-52
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• 2003

In this paper, we fabricated PRT(platinum resistance thermometers) with the trimming technology using high fine laser system. U. V.(wavelength： 355nm) laser was mainly used for adjusting Pt thin films resistors to 100Ω at 0$^{\circ}C$. Internationally, the accepted A-class tolerance of temperature sensor is ${\pm}$0.06Ω at 0$^{\circ}C$. according to DIN EN 60751. The width of trimmed lines was about 10$\mu\textrm{m}$ and the best trimming conditions of Pt thin films were power : 37mW, frequency : 200Hz and bite size：1.5$\mu\textrm{m}$. And 96 resistors, fabricated by photolithography and etching process, have 79∼90Ω and 91∼102Ω as the proportion of 45.7% and 57.3%, respectively. As result of sitting Pt thin films resistors to the target value(109.73Ω at 25$^{\circ}C$), 82.3% of all resistors had the tolerance within ${\pm}$0.03Ω and the others(17.7％) were within ${\pm}$0.06Ω of A-class tolerance. The PRTs which wore fabricated in this research had excellent characteristics as follows； high accuracy, international standard TCR(temperature coefficient of resistance) value, long-term stability, wide temperature range, good linearity and repeatability, rapid response time, etc.