• 한국정밀공학회지
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• 제24권4호
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• pp.147-152
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• 2007

UV laser ablation of polyimide is a combination of photochemical and photothermal mechanism. Photochemical mechanism is that molecular bonds are broken by photon energy and photothermal is evaporation and melt expulsion. When the laser processing, the etching depth needs to be calculated for prediction of processing result. In this paper, in order to predict the laser etching depth of polyimide by UV laser with the wavelength of 355nm, the theoretical model which includes both the photothermal and the photochemical effect was introduced. The model parameters were obtained by comparing with experimental results. The 3rd harmonic $Nd:YVO_4$ laser system was used in the experiment. From these experimental and theoretical results, the laser ablation of a polyimide was verified to achieve the highest quality microstructure.

• 한국정밀공학회지
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• 제22권9호
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• pp.60-68
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• 2005

To investigate the effects of beam focusing in the etching of polymers with short pulse Excimer lasers, a polymer etching model of SSB's is combined with a beam focusing model. Through the numerical simulation, it was found that in the high laser fluence region, SSB model considering both photochemical and thermal contribution is considered to be suitable to predict the etched hole shape than a simple photochemical etching model. The average temperature distribution into the substance obtained by assuming 1-D heat transfer is found to be fairly similar to the fluence distribution on the ablated surface. The experimental etching data fur polymers are used to give material properties for ablation model. The fitted etch depth curve gives a nice agreement with the experimental data.

• 한국정밀공학회지
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• 제22권7호
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• pp.38-46
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• 2005

In laser machining such as drilling with $CO_2$ or Nd:YAG laser, and etching or ablation with Excimer laser, one of the most important parameters affecting the machining is known to be beam characteristics. In this paper a numerical study is performed to investigate the effects of beam parameters, especially in the process of excimer laser ablation of polymers. Results of different beam conditions reveal that if the ablated depth is small compared to beam size the simple photochemical etching model is suitable to predict the etched shape, and that the importance of precise alignment becomes large as beam quality factor becomes larger.

• 한국정밀공학회지
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• 제21권12호
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• pp.13-20
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• 2004

Manufacturing process for the microfluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in microfluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master fur nickel mold insert. The mechanism fur ablative decomposition of PET with KrF excimer laser $({\lambda}: 248 nm, pulse duration: 5 ns)$ was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the .eaction between PC (polycarbonate) and KrF excimer laser beam generate too much su.face debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electroforming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

• 한국레이저가공학회지
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• 제6권1호
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• pp.33-40
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• 2003

The ablative decomposition mechanism of PMMA(polymethyl methacrylate) and PET(polyethylene terephthalate) with KrF excimer laser(λ : 248nm, pulse duration: 5㎱) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET is a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET is dominated by photochemical process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1857-1860
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• 2003

The ablative decomposition mechanism of PMMA(polymethyt methacrylate), PET(polyethylene terephthalate) and PC(polycarbonate) with KrF excimer laser(λ: 248nm, pulse duration: 5ns) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET, PC are a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET, PC are dominated by photochemical process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.655-656
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.613-614
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• 2011

• 한국레이저가공학회지
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• 제6권2호
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• pp.35-41
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• 2003

In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation by excimer laser radiation could be used successfully to make 3-D microstructure of PET. The mechanism for ablative decomposition of PET with KrF excimer laser(λ: 248nm, pulse duration: 5ns) was explained by photochemical process. And this process showed PET to be adopted in polymer master for nickel mold insert. Nickel electroforming by using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

• 한국광학회지
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• 제14권3호
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• pp.312-320
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• 2003

본 연구에서는 355 nm의 파장을 갖는 Nd:YVO$_4$ 3고주파 DPSS 레이저를 이용하여 폴리머의 3차원 미세형상 가공기술을 개발하였다. UV레이저와 폴리머의 어블레이션에 관한 메커니즘을 설명하였으며 비교적 UV영역에서 파장이 긴 355 nm파장의 영역에서는 광열분해 반응으로 가공되고 이에 따른 폴리머의 광학적 특성을 살펴보았다. 광 흡수율 특성이 우수한 폴리머가 광가공 특성이 좋은 것으로 나타났으나 벤젠구조가 많이 포함되어 있는 폴리이미드의 경우는 광분해후 다시 새로운 화학적 결합이 이루어져 가공부 면이 좋지 않은 면을 보였다. 레이저의 다중 주사방식으로 가공하기위하여 표면의 오염이 적은 폴리카보네이트를 시편으로 사용하여 3차원 적으로 모델링한 직경 1 mm와 500 $\mu\textrm{m}$의 마이크로 팬을 가공하였다. 레이저 발진 효율이 높고 유지비가 적은 355 nm의 DPSSL을 이용한 3차원 가공기술의 개발로 향후 저비용으로 빠른 시간에 미세부품을 개발하는 기술에 기여할 것으로 예상된다.