• Bulletin of the Korean Chemical Society
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• 제23권5호
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• pp.683-687
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• 2002

We have investigated the effect of the number of ethylene oxide (EO) units inside poly(ethylene glycol)dimethacrylate (PEGDMA) on the ionic conductivity of its gelled polymer electrolyte, whose content ranges from 50 to 80 wt%. PEGDMA gelled polym er electrolytes, a crosslinked structure, were prepared using simple photo-induced radical polymerization by ultraviolet light. The effect of the number of EO on the ionic conductivity was clearly shown in samples of lower liquid electrolyte content. We have concluded that the ionic conductivity increased in proportion to both the number of EO units and the plasticizer content. We have also studied the electrochemical properties of 13PEGDMA (number of EO units is 13) gelled polymer electrolyte.

• 한국정밀공학회지
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• 제21권12호
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• pp.29-36
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• 2004

In this paper, a new replication technique for a real 3D microstructure was introduced, in which a master Pattern WES made of photo-curable epoxy using a microstereolithography technology, and then it was transferred onto an epoxy-copper particle composite. A helical gear was selected as one of the real 3D microstructure for this study, and it was replicated from a pure epoxy to an epoxy composite. In addition, the transferability of the microreplication process was evaluated, and the properties of :he epoxy composite were compared to that of the pure epoxy, including hardness, wear-resistance and thermal conductivity.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.411-414
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• 2005

We have developed a transflective liquid crystal display (LCD) with a single cell gap and a low twisted nematic (LTN) mode in combination with a self-integrated retardation layer. The retardation layer was made of UV curable liquid crystalline material in one step of photo masking process and has both the homeotropic and the planar parts. The proposed transflective configuration has advantages in a simple fabrication process, and the possibility for a single driving scheme due to the similarity between the transmittance and the reflectance.

• 센서학회지
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• 제20권4호
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• pp.234-237
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• 2011

This paper presents a study into pH Indicator-Embedded hydrogel micro-particles which are encoded various shapes according to the captured indicator. We incorporate various pH indicators into a photo-curable hydrogel, PEG-DA(Poly(ethylene glycol) diacrylate). Using the latest fluidic lithography techniques, we can easily fabricate variously patterned hydrogel particles based on in-situ photopolymerization of the PEG-DA in a micro-fluidic channel. The shape of the particle is related to the pH indicator inside the particle. We demonstrate that the micro pH sensors change their colors according to the pH levels. The micro pH sensors have various characteristics that are related to the curing time, particle size, etc. By changing these conditions, we can adjust the long term stability and reaction time of the hybrid micro pH sensors.

• 대한기계학회논문집A
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• 제28권5호
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• pp.624-631
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• 2004

In this paper, new replication techniques fur a metal microcomponent having a real 3D shape were introduced. Helical gear was selected as one of a real 3D microcomponents for this study. The helical gear, which was made of photo-curable resin, was fabricated as a master pattern by microstereolithography technology. Then, a silicone rubber mold was fabricated from the master pattern. Lastly, a final bismuth alloy pattern was transferred from the silicone rubber mold by the microcasting process. In this paper, the replication technique is described in detail from the master pattern to the final pattern with some investigation on factors related to the technique.

• Elastomers and Composites
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• 제52권2호
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• pp.136-142
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• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

• 접착 및 계면
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• 제10권4호
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• pp.191-198
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• 2009

지방족 에폭시 수지인 glycerol diglycidyl ether (GDE)에 단관능성 아크릴 수지인 2-carboxyethyl acrylate (2-CEA) 또는 2-hydroxyethyl acrylate (2-HEA)를 반응시켜 지방족 에폭시 아크릴레이트를 제조하였다. FT-IR, $^1H$-NMR, 그리고 $^{13}C$-NMR를 사용하여 생성물을 확인하였고, 수율은 prep-LC를 사용하여 얻었다. 생성물의 자외선 경화거동은 photo-DSC를 사용하였고, 열경화 반응성은 DSC를 사용하여 얻었다. 2-CEA의 반응성이 2-HEA보다 월등히 높음을 알 수 있었고, 2-CEA로부터 제조한 지방족 에폭시 아크릴레이트(GEA-C)의 수율은 약 83%이었다. 촉매를 제거한 GEA-C 생성물의 자외선 경화반응($T_{max}$)은 약 10 s로 빠르게 진행되었다. GEA-C는 투명하고, 내열성이 우수하며 저점도를 갖고 있음을 확인할 수 있었다. ${\Delta}E^*$는 2.51, 점도는 192 cps, 5% 중량감소 때의 온도는 $299^{\circ}C$이었다. Kissinger와 Ozawa-Flynn-Wall 식으로 얻은 GEA-C의 열경화 반응의 활성화에너지($E_a$)는 91~92 kJ/mol이었다.

• 접착 및 계면
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• 제15권1호
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• pp.22-30
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• 2014

본 연구는 자가광개시형 아크릴레이트를 Michael addition 반응을 이용하여 합성하고 자유라디칼, 양이온 및 하이브리드 시스템을 통해 배합-경화-물성 상관관계를 유도하여 이들의 경화물성, 표면 물성을 Photo-DSC, 진자경도, 연필경도 및 내오염성 측정을 이용하여 평가하였다. 그 결과, 자유라디칼 반응형 모노머 첨가를 통해 경화 특성의 향상을 유도할 수 있었으나, 일정량 이상의 모노머 첨가 시 반응성 저하로 인해 경화성이 오히려 저하되었으며, 이는 자유라디칼 반응형 모노머에 의한 이동성의 향상이 SPIA의 경화 향상에는 한계가 있음을 확인하였다. 자유 라디칼 광개시제에 의한 자유 라디칼의 생성과 자가광개시 반응에 의한 자유라디칼이 동시에 연속적으로 반응에 참여되어 우수한 경화 특성을 보였으며, 양이온 시스템을 접목한 하이브리드 시스템의 경우 양이온계 광개시제와 양이온계 모노머가 라디칼 생성과 확산까지 촉진 시켜 우수한 경화특성을 보이며, 라디칼 중합에 비해 산소에 의한 영향이 적은 양이온 중합의 영향으로 표면물성을 비롯한 도막 물성 또한 가장 우수하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.79-83
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• 2007

We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.

• 한국정밀공학회지
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• 제22권1호
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• pp.199-206
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• 2005

Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.