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http://dx.doi.org/10.7473/EC.2017.52.2.136

Preparation of Solventless UV Curable Thermally Conductive Pressure Sensitive Adhesives and Their Adhesion Performance  

Baek, Seung-Suk (Department of Polymer Science & Engineering, Materials Chemistry and Engineering Laboratory, Dankook University)
Park, Jinhwan (Department of Polymer Science & Engineering, Materials Chemistry and Engineering Laboratory, Dankook University)
Jang, Su-Hee (Department of Polymer Science & Engineering, Materials Chemistry and Engineering Laboratory, Dankook University)
Hong, Seheum (Department of Polymer Science & Engineering, Materials Chemistry and Engineering Laboratory, Dankook University)
Hwang, Seok-Ho (Department of Polymer Science & Engineering, Materials Chemistry and Engineering Laboratory, Dankook University)
Publication Information
Elastomers and Composites / v.52, no.2, 2017 , pp. 136-142 More about this Journal
Abstract
Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.
Keywords
pressure sensitive adhesive; adhesion; thermal conductivity; boron nitride; aluminum oxide;
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