• Title/Summary/Keyword: photo curable

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Preparation of UV Curable Gel Polymer Electrolytes and Their Electrochemical Properties

  • Oh, Boo-Keun;Jung, Won-Il;Kim, Dong-Won;Rhee, Hee-Woo
    • Bulletin of the Korean Chemical Society
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    • v.23 no.5
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    • pp.683-687
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    • 2002
  • We have investigated the effect of the number of ethylene oxide (EO) units inside poly(ethylene glycol)dimethacrylate (PEGDMA) on the ionic conductivity of its gelled polymer electrolyte, whose content ranges from 50 to 80 wt%. PEGDMA gelled polym er electrolytes, a crosslinked structure, were prepared using simple photo-induced radical polymerization by ultraviolet light. The effect of the number of EO on the ionic conductivity was clearly shown in samples of lower liquid electrolyte content. We have concluded that the ionic conductivity increased in proportion to both the number of EO units and the plasticizer content. We have also studied the electrochemical properties of 13PEGDMA (number of EO units is 13) gelled polymer electrolyte.

A Study on a Microreplication Process for Real 3D Structures Using a Soft Lithography (동분말이 함유된 에폭시 수지를 이용한 마이크로 기어의 제작에 관한 연구)

  • Chung Sungil;Park Sunjoon;Lee Inhwan;Jeong Haedo;Cho Dongwoo
    • Journal of the Korean Society for Precision Engineering
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    • v.21 no.12
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    • pp.29-36
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    • 2004
  • In this paper, a new replication technique for a real 3D microstructure was introduced, in which a master Pattern WES made of photo-curable epoxy using a microstereolithography technology, and then it was transferred onto an epoxy-copper particle composite. A helical gear was selected as one of the real 3D microstructure for this study, and it was replicated from a pure epoxy to an epoxy composite. In addition, the transferability of the microreplication process was evaluated, and the properties of :he epoxy composite were compared to that of the pure epoxy, including hardness, wear-resistance and thermal conductivity.

A Single Low Twisted Nematic Mode for a Transflective LCD with a Self-Integrated Retardation Layer

  • Kim, Jin-Yool;Na, Jun-Hee;Lee, Sin-Doo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.411-414
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    • 2005
  • We have developed a transflective liquid crystal display (LCD) with a single cell gap and a low twisted nematic (LTN) mode in combination with a self-integrated retardation layer. The retardation layer was made of UV curable liquid crystalline material in one step of photo masking process and has both the homeotropic and the planar parts. The proposed transflective configuration has advantages in a simple fabrication process, and the possibility for a single driving scheme due to the similarity between the transmittance and the reflectance.

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Micro pH Sensor Using Patterned Hydrogel with pH Indicators

  • Jang, Ji-Sung;Kwon, Sung-Hoon
    • Journal of Sensor Science and Technology
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    • v.20 no.4
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    • pp.234-237
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    • 2011
  • This paper presents a study into pH Indicator-Embedded hydrogel micro-particles which are encoded various shapes according to the captured indicator. We incorporate various pH indicators into a photo-curable hydrogel, PEG-DA(Poly(ethylene glycol) diacrylate). Using the latest fluidic lithography techniques, we can easily fabricate variously patterned hydrogel particles based on in-situ photopolymerization of the PEG-DA in a micro-fluidic channel. The shape of the particle is related to the pH indicator inside the particle. We demonstrate that the micro pH sensors change their colors according to the pH levels. The micro pH sensors have various characteristics that are related to the curing time, particle size, etc. By changing these conditions, we can adjust the long term stability and reaction time of the hybrid micro pH sensors.

Fabrication of Real 3D Shape Components Using Bi-Sn Alloys (Bi-Sn 합금을 이용한 3차원 미세 구조물의 제작기술 개발)

  • Chung, Sung-Il;Park, Sun-Joon;Im, Yong-Gwan;Choi, Jae-Young;Jeong, Hae-Do
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.5
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    • pp.624-631
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    • 2004
  • In this paper, new replication techniques fur a metal microcomponent having a real 3D shape were introduced. Helical gear was selected as one of a real 3D microcomponents for this study. The helical gear, which was made of photo-curable resin, was fabricated as a master pattern by microstereolithography technology. Then, a silicone rubber mold was fabricated from the master pattern. Lastly, a final bismuth alloy pattern was transferred from the silicone rubber mold by the microcasting process. In this paper, the replication technique is described in detail from the master pattern to the final pattern with some investigation on factors related to the technique.

Preparation of Solventless UV Curable Thermally Conductive Pressure Sensitive Adhesives and Their Adhesion Performance

  • Baek, Seung-Suk;Park, Jinhwan;Jang, Su-Hee;Hong, Seheum;Hwang, Seok-Ho
    • Elastomers and Composites
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    • v.52 no.2
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    • pp.136-142
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    • 2017
  • Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

Synthesis and Characterization of UV-curable Aliphatic Epoxy Acrylate (자외선 경화형 지방족 에폭시 아크릴레이트의 합성 및 특성분석)

  • Kim, Young Chul;Lee, Byung-Hoon
    • Journal of Adhesion and Interface
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    • v.10 no.4
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    • pp.191-198
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    • 2009
  • UV-curable aliphatic epoxy acrylates were prepared by the reaction of glycerol diglycidyl ether (GDE) with 2-carboxyethyl acrylate (2-CEA) or 2-hydroxyethyl acrylate (2-HEA). The structures of the epoxy acrylates were characterized by FT-IR, $^1H$-NMR, and $^{13}C$-NMR and the yield was obtained by prep-LC. The UV- and the thermal-curing behaviors of the product were investigated using photo-DSC and DSC, respectively. The reactivity of 2-CEA was higher than 2-HEA and the yield of the product (GEA-C) which was prepared using 2-CEA was about 83%. The maximum UV-curing time ($T_{max}$) of the GEA-C contained non-reactive components and by-product was about 10 seconds. The GEA-C showed low color difference (${\Delta}E^*$), low viscosity, and good thermal stability - its value was 2.51, 192 cps, and $299^{\circ}C$ (at 5% weight loss), respectively. The activation energies ($E_a$) of thermal-curing reaction calculated from Kissinger and Ozawa-Flynn-Wall method were 91~92 kJ/mol.

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Curing and Coating Properties of Photo-Curable Self-Photoinitiating Acrylate (광경화형 자가광개시 아크릴레이트의 경화특성 및 도막물성)

  • Han, A-Ram;Hong, Jin-Who;Kim, Hyun-Kyoung
    • Journal of Adhesion and Interface
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    • v.15 no.1
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    • pp.22-30
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    • 2014
  • Self-photoinitiating acrylate (SPIA) which can undergo self-initiation under UV irradiation was synthesized by a Michael addition in the presence of a base catalyst. The SPIA polymerizations were investigated by photo-differential scanning calorimeter (photo-DSC) and surface physical properties such as pendulum hardness and pencil hardness. The results showed that the SPIA can cure upon UV irradiation by itself without a photoinitiator. But we found out that both the curing rate and the conversion were too low for the self-curing reaction of SPIA. In order to improve the SPIA curing properties, we introduced the SPIA/cationic hybrid system and observed the effects of the addition of commercial free radical type monomer and photoinitiator on the curing behaviors. SPIA/cationic hybrid system was the best suitable to improve the SPIA curing properties. The kinetic analysis indicated that the cationic monomer and photoinitiator apparently accelerated the cure reaction and rate of the hybrid SPIA system, mostly due to the synergistic effect of cationic monomer and photoinitiator increasing the mobility of active species and the generation of reactive species (free radical, cation) during the photopolymerization process. The physical properties showed that, unlike typical free radical system, the hybrid systems did not show oxygen inhibition effect because of cationic reaction on the coating surface.

Fabrication of the Imaging Lens for Mobile Camera using Embossing Method (엠보싱 공법에 의한 카메라 모듈용 광학렌즈 성형기법에 대한 연구)

  • Lee, C.H.;Jin, Y.S.;Noh, J.E.;Kim, S.H.;Jang, I.C.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.05a
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    • pp.79-83
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    • 2007
  • We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.

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A Study on the Polymer Lithography using Stereolithography (광조형법을 이용한 고분자 리소그래피에 관한 연구)

  • Jung Young Dae;Lee Hyun Seop;Son Jae Hyuk;Cho In Ho;Jeong Hae Do
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.1
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    • pp.199-206
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    • 2005
  • Mask manufacturing is a high COC and COO process in developing of semiconductor devices because of mask production tool with high resolution. Direct writing has been thought to be the one of the patterning method to cope with development or small-lot production of the device. This study consists two categories. One is the additional process of the direct and maskless patterning generation using SLA for easy and convenient application and the other is a removal process using wet-etching process. In this study, cured status of epoxy pattern is most important parameter because of the beer-lambert law according to the diffusion of UV light. In order to improve the contact force between patterns and substrate, prime process was performed and to remove the semi-cured resin which makes a bad effects to the pattern, spin cleaning process using TPM was also performed. At a removal process, contact force between photo-curable resin as an etching mask and Si wafer is important parameter.