• 한국전산유체공학회:학술대회논문집
• /
• 2007.04a
• /
• pp.153-158
• /
• 2007

Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.509-509
• /
• 2011

Superhydrophobic surfaces on alloyed steels were fabricated with a non-conventional method of plasma etching and subsequent water immersion procedure. High aspect ratio nanopatterns of nanoflake or nano-needle were created on the steels with various Cr content in its composition. With CF4 plasma treatment in radio-frequence chemical vapor deposition (r.-f. CVD) method, steel surfaces were etched and fluorinated by CF4 plasma, which induced the nanopattern evolution through the water immersion process. It was found that fluorine ion played a role as a catalyst to form nanopatterns in water elucidated with XPS and TEM analysis. The hierarchical patterns in micro- and nano scale leads to superhydrophobic properties on the surfaces by deposition of a hydrophobic coating with a-C:H:Si:O film deposited with a gas precursor of hexamethlydisiloxane (HMDSO) with its lower surface energy of 24.2 mN/m, similar to that of curticular wax covering lotus surfaces. Since this method is based on plasma dry etching & coating, precise patterning of surface texturing would be potential on steel or metal surfaces. Patterned hydrophobic steel surfaces were demonstrated by mimicking the Robinia pseudoacacia or acacia leaf, on which water was collected from the humid air using a patterned hydrophobicity on the steels. It is expected that this facile, non-toxic and fast technique would accelerate the large-scale production of superhydrophobic engineering materials with industrial applications.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.62-65
• /
• 2007

Conventional semiconductor processes have been utilized to fabricate 3.5-inch OTFT-driven OLEDs with a resolution of $176\;{\times}\;144$ pixels on plastic substrates. By using a PC-OVD method to deposit a pentacene layer and optimizing patterning and the following processes, we could complete a uniform and reliable integration procedure for an active matrix organic light emitting devices on a plastic substrate. The technical importance of ours is the applicability of conventional semiconductor process to organic materials on plastic substrates. Although there are many hurdles to overcome, our approach and technical improvements are proved to be applicable to plastic electronics.

• Transactions on Electrical and Electronic Materials
• /
• v.12 no.4
• /
• pp.131-134
• /
• 2011

Back-end-of-line using ultra low-k (ULK; k < 2.5) has been required to reduce resistive capacitance beyond 45 nmtechnologies, because micro-processing units need higher speed and density. There are two strategies to manufacture ULK inter-layer dielectric (ILD) materials using an air-gap (k = 1). The former ULK and calcinations of ILD degrade the mechanical strength and induce a high cost due to the complication of following process, such as chemical mechanical polishing and deposition of the barrier metal. In contrast, the air-gap based low-k ILD with a relatively higher density has been researched on the trench-type with activity, but it has limited application to high density devices due to its high air-gap into the next metal layer. The height of air-gap into the next metal layer was reduced by changing to the via-typed air-gap, up to about 50% compared to that of the trench-typed air-gap. The controllable ULK was easily fabricated using the via-typed air-gap. It is thought that the via-type air-gap made the better design margin like via-patterning in the area with the dense and narrow lines.

• Journal of the Semiconductor & Display Technology
• /
• v.14 no.3
• /
• pp.61-66
• /
• 2015

Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.

• Proceedings of the KIEE Conference
• /
• 2003.07c
• /
• pp.1903-1905
• /
• 2003

전자기력을 이용하여 탐침형 정보저장장치의 미디어를 제어할 수 있는 초정밀 구동기를 제작하였다. 탐침형 정보저장장치는 데이터 비트의 크기가 10nm 수준이고, 단일 캔틸레버가 점유하는 영역의 크기가 수십 ${\mu}m$${\times}$수십${\mu}m$ 수준이므로, 미디인 구동기는 수 nm의 위치 정확도 및 수십 ${\mu}m$ 수준의 변위 그리고 100Hz이상의 공진 주파수를 확보하여야한다. 본 연구에서 제작한 탐침형 정보저장장치의 미디어 구동기는 고저항 Si wafer 표면을 Deep RIE로 patterning한 후 그 내부를 도금으로 채워 구리 코일을 형성하고 이를 영구자석과 결합시킨 후, 구리 코일에 전류를 흘려 미디어를 구동하는 방식이다. 사용된 영구자석은 SmCo 자석이며 코일의 폭은 $100{\mu}m$이고 간격은 $20{\mu}m$, 높이는 $70{\mu}m$로 결정하였으며, 100Hz 이상의 공진 주파수를 확보하기 위하여 스프링 재질은 구리보다 상대적으로 stiff한 Si을 사용하였다. 미디어의 크기는 $20{\times}20mm^2$, 전체 구동기의 크기는 $30{\times}30mm^2$이며 측정결과 최대변위는 140mA 인가 시 약 ${\pm}127{\mu}m$이다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.65-65
• /
• 2010

Extreme ultraviolet lithography (EUVL) is expected to be applied for making patterns below 32 nm in device industry. An ultrathin EUV photoresist (PR) of a few nm in thickness is required to reduce minimum feature size further. Here, we show that pentacene molecular layers can be employed as a new EUV resist for the first time. Dots and lines in nm scale are successfully realized using the new molecular resist. We clearly provide the mechanism for forming the nanopatterns with scanning photoemission microscope (SPEM), EUV interference lithography (EUV-IL), atomic force microscope (AFM), photoemission spectroscopy (PES), etc. The molecular PR has several advantages over traditional polymer EUV PRs; for example, high thermal/chemical stability, negligible outgassing, ability to control the height and width on the nanometer scale, leaving fewer residuals, no need for a chemical development process and thus reduction of chemical waste to make the nanopatterns. Besides, it could be applied to any substrate to which pentacene bonds chemically, such as $SiO_2$, SiN, and SiON, which is of importance in the device industry.

• Tribology and Lubricants
• /
• v.35 no.5
• /
• pp.294-299
• /
• 2019

Most previous studies on water repellent surfaces using lasers rely on the use of pico- or femtosecond lasers. However, in industrial application, these methods have the disadvantages of high cost and low efficiency. In this study, we implement a hydrophobic surface using a high-power general-purpose diode laser. We have fabricated the microsurface using laser groove processing technology, and we present the correlation of wettability characteristics with space and width. The metal material is stainless steel (SUS 304), and the groove height during laser processing is set to $30{\mu}m$ to evaluate the wettability based on the gap and width of various grooves. Results show that the contact angle of the groove-shaped surface is increased by $40^{\circ}$ or more as compared with the surface without patterning, and the contact angle in the parallel direction is greater than that in the perpendicular direction. Results from contact angle hysteresis measurement experiments show that the groove width has a greater influence on the contact angle history than does the gap between grooves. In addition, the coating reveals that the contact angle can be increased using a chemical method and that the laser grooving process can further improve the wetting properties of the surface.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.2
• /
• pp.44-47
• /
• 2019

Amorphous carbon layer (ACL) is actively used as an etch mask. Recent advances in patterning ACL requires the next level of durability of hard mask in high aspect ratio etch in near future semiconductor manufacturing, and it is worthwhile to know the surface property of ACL thin film to enhance the property of etch hard mask. In this research, ACL are deposited by 6 inch plasma enhanced chemical vapor deposition system with $C_3H_6$ and $N_2$ gas mixture. Surface properties of deposited ACL are investigated depending on gas flow, pressure, RF power. Fourier transform infrared is used for the analysis of surface chemistry, and X-ray photoemission spectra is used for the structural analysis with the consideration of the contents of $sp^2$ and $sp^3$ through fitting of C1s. Also mechanical properties of deposited ACL are measured in order to evaluate hardness.

• Journal of the Korean institute of surface engineering
• /
• v.51 no.6
• /
• pp.387-392
• /
• 2018

Nanopatterning is one of the essential nanotechnologies to fabricate electronic and energy nanodevices. Therefore, many research group members made a lot of efforts to develop simple and useful nanopatterning methods to obtain highly ordered nanostructures with functionality. In this study, in order to achieve pattern formation of three-dimensional (3D) hierarchical nanostructures, we introduce a simple and useful patterning method (nano-transfer printing (n-TP) process) consisting of various linewidths for diverse materials. Pt and $WO_3$ hybrid line structures were successfully stacked on a flexible polyimide substrate as a multi-layered hybrid 3D pattern of Pt/WO3/Pt with line-widths of $1{\mu}m$, $1{\mu}m$ and 250 nm, respectively. This simple approach suggests how to fabricate multiscale hybrid nanostructures composed of multiple materials. In addition, functional hybrid nanostructures can be expected to be applicable to various next-generation electronic devices, such as nonvolatile memories and energy harvesters.