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Numerical Analysis of Effects of Velocity Inlet and Residual Layer Thickness of Resist on Bubble Defect Formation  

Lee, Woo Young (School of Mechanical Engineering, Korea University of Technology and Education)
Kim, Nam Woong (School of Mechanical Engineering, Dongyang Mirae University)
Kim, Dong Hyun (Dept. of Mechanical Engineering, Soonchunhyang University)
Kim, Kug Weon (Dept. of Mechanical Engineering, Soonchunhyang University)
Publication Information
Journal of the Semiconductor & Display Technology / v.14, no.3, 2015 , pp. 61-66 More about this Journal
Abstract
Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.
Keywords
Resist layer thickness; Velocity inlet; Bubble; Nanoimprint Lithography(NIL);
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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1 Kim, K.W., Noorani, R.I. and Kim, N.W., "A Study on the Uniformity Improvement of Residual Layer of a Large Area Nanoimprint Lithography," Journal of the Semiconductor & Display Technology, Vol. 9, No. 4, pp. 19-23, 2010.
2 Kim, K.W., "Prediction of Residual Layer Thickness of Large-area UV Imprinting Process," Journal of the Semiconductor & Display Technology, Vol. 12, No. 2, pp. 79-84, 2013.
3 Morihara, D., Hiroshima, H., and Hirai, Y., "Numerical study on Bubble Trapping in UV-nanoimprint Lithography," Microelectronic Engineering, Vol. 86, No. 4-6, pp. 684-687, 2009.   DOI
4 Nagaoka, Y., Morihara, D., Hiroshima, H., and Hirai, Y., "Simulation study on Bubble Trapping in UV Nanoimprint Lithography," Journal of Photopolymer Science and Technology, Vol. 22, No. 2, pp. 171-174, 2009.   DOI
5 Liang, X., Tan, H., Fu, Z., and Chou, S. Y., "Air Bubble Formation and Dissolution in Dispensing Nanoimprint Lithography," Nanotechnology, Vol. 18, No. 2, pp. 1-7, 2007.
6 Reddy, S., Schunk, P. R., and Bonnecaze, R. T., "Dynamics of Low Capillary Number Interfaces Moving through Sharp Features," Physics of Fluids, Vol. 17, No. 12, pp. 122104-1-6, 2005.   DOI
7 Reddy, S., and Bonnecaze, R. T., "Simulation of Fluid Flow in the Step and Flash Imprint Lithography Process," Microelectronic Engineering, Vol. 82, No. 1, pp. 60-70, 2005.   DOI
8 Seok, J.M., Kim, N.W., "Analytic and Numerical Study for air Bubble Defect of UV-NIL Process," Journal of the Korean Society of Manufacturing Technology Engineers, Vol. 21, No. 3 pp. 473-478, 2012.   DOI