Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Surface Properties of ACL Thin Films Depending on Process Conditions

공정 조건에 따른 비정질 탄소막 표면 물성분석

  • Kim, Kwang Pyo (Department of Electronics Engineering, Myongji University) ;
  • Choi, Jeong Eun (Department of Electronics Engineering, Myongji University) ;
  • Hong, Sang Jeen (Department of Electronics Engineering, Myongji University)
  • 김광표 (명지대학교 공과대학 전자공학과) ;
  • 최정은 (명지대학교 공과대학 전자공학과) ;
  • 홍상진 (명지대학교 공과대학 전자공학과)
  • Received : 2019.06.08
  • Accepted : 2019.06.24
  • Published : 2019.06.30
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Abstract

Amorphous carbon layer (ACL) is actively used as an etch mask. Recent advances in patterning ACL requires the next level of durability of hard mask in high aspect ratio etch in near future semiconductor manufacturing, and it is worthwhile to know the surface property of ACL thin film to enhance the property of etch hard mask. In this research, ACL are deposited by 6 inch plasma enhanced chemical vapor deposition system with $C_3H_6$ and $N_2$ gas mixture. Surface properties of deposited ACL are investigated depending on gas flow, pressure, RF power. Fourier transform infrared is used for the analysis of surface chemistry, and X-ray photoemission spectra is used for the structural analysis with the consideration of the contents of $sp^2$ and $sp^3$ through fitting of C1s. Also mechanical properties of deposited ACL are measured in order to evaluate hardness.

Keywords

References

  1. Abe, H., Yoneda, M., and Fujiwara, N., "Developments of Plasma Etching Technology for Fabricating Semiconductor Devices," Japanese Journal of Applied Physics, Vol. 47, No. 3, pp. 1435-1455, 2008. https://doi.org/10.1143/JJAP.47.1435
  2. Lee, S., Won, J., Choi, J., Park, J., Jee, Y., Lee, H., and Byun, D., "Comparative Study on the Properties of Amorphous Carbon Layers Deposited from 1-Hexene and Propylene for Dry Etch Hard Mask Application in Semiconductor Device Manufacturing," Thin Solid Films, Vol. 519, No. 20, pp. 6683-6687, 2011. https://doi.org/10.1016/j.tsf.2011.04.077
  3. Chun, H. Oskomov, K. Sochugov, N., Lee, J., You, Y. and Cho, T., "Hydrocarbon Plasma of a Low-Pressure Arc Discharge for Deposition of Highly-Adhesive Hydrogenated DLC films," Journal of the Korea Society of Semiconductor Equipment Technology, Vol. 2, No. 1, pp. 1-5, 2003.
  4. Robertson, J. "Diamond-like Amorphous Carbon," Materials Science and Engineering: R: Reports, Vol. 37, No. 4-6, pp. 129-281, 2002. https://doi.org/10.1016/S0927-796X(02)00005-0
  5. Horn, T. D., "Amorphous Carbon Hard Mask for Multiple Patterning Lithography," Journal of the Microelectronic Engineering Conference, Vol. 21, No. 1, Article 1, 2015.
  6. Cho, I., Lee, N., Chang, S., An, S., Yoon, Y., and Zoh, K., "Analysis of Characteristics and Optimization of Photo-degradation condition of Reactive Orange 16 Using a Box-Behnken Method," Journal of Korean Society of Environmental Engineers, Vol. 28, No. 9, pp. 917-925, 2006.
  7. Mutsukura, N., Inoue, S.I., and Machi, Y., "Deposition Mechanism of Hydrogenated Hardcarbon Films in a CH4 RF Discharge Plasma," Journal of Applied Physics, Vol. 72, No. 1, pp. 43-53, 1992. https://doi.org/10.1063/1.352145
  8. Kim, M., Hwang, C., and Kim, H., "Electrical Characteristics of Low-k SiOCH Thin Film Deposited by BTMSM/$O_2$ High Flow Rates" Journal of the Semiconductor & Display Equipment Technology, Vol. 7, No. 1, pp. 41-45, 2008.
  9. Jang, S., Xu, L., and Cho, U., "A Study on Graphene Oxide and Carboxylated Styrene-Butadiene Rubber(XSBR) Nanocomposites" Journal of the Semiconductor & Display Technology, Vol. 16, No. 1, pp. 52-58, 2017.
  10. Manage, D. P., Perz, J. M., Gaspari, F., Sagnes, E., and Zukotynski, S., "Atmospheric Aging and Thermal Annealing Effects in a-C:H Thin Films," Journal of Non-Crystalline Solids, Vol. 270, No. 1-3, pp. 247-254, 2000. https://doi.org/10.1016/S0022-3093(00)00059-4
  11. Saha, R., and Nix, W. D., "Effects of the Substrate on the Determination of Thin Film Mechanical Properties by Nanoindentation," Acta Materialia, Vol. 50, No. 1, pp. 23-38, 2002. https://doi.org/10.1016/S1359-6454(01)00328-7
  12. Peng, X.L., and Clyne, T.W., "Mechanical Stability of DLC Films on Metallic Substrates: Part I-Film Structure and Residual Stress Levels," Thin Solid Films, Vol. 312, No. 1-2, pp. 207-218, 1998. https://doi.org/10.1016/S0040-6090(97)00588-9
  13. Koidl, P., Wild, Ch., Dischler, B., Wagner, J., and Ramsteiner, M., "Plasma Deposition, Properties and Structure of Amorphous Hydrogenated Carbon Films," Materials Science Forum, Vol. 52, pp. 41-70, 1991. https://doi.org/10.4028/www.scientific.net/MSF.52-53.41