• 제목/요약/키워드: paste-fill

검색결과 43건 처리시간 0.03초

Simple 프로세스로 제조된 TiO2 페이스트를 이용한 염료감응 태양전지의 전기화학적 특성 (Electrochemical Properties of Dye-sensitized Solar Cells Using TiO2 Paste Prepared by Simple Process)

  • ;박주영;구할본
    • 한국전기전자재료학회논문지
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    • 제27권11호
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    • pp.718-724
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    • 2014
  • In this work, in order to manufacture the photoelectrode of dye-sensitized solar cells, the different anatase $TiO_2$ paste was prepared by simple route using hydrothermal method. In comparison with the traditional preparing process, the hydrothermally synthesized $TiO_2$ gel was used to make paste directly. Thus, the making process was simplified and the solar conversion efficiency was improved. In comparison with 5.34% solar energy efficiency of HP-1 photoelectrode, the 6.23% efficiency of HDP-1 electrode was improved by 16.67%. This is because hydrothermally synthesized $TiO_2$ gel was used to make paste directly, the dispersibility between $TiO_2$ particles was improved and get the smoother network, leading to the charge transport ability of the electron generated in dye molecular was improved. Further, HDP-2 photoelectrode delivered the best results with Voc (open circuit voltage), Jsc (short circuit current density) FF (fill factor) and ${\eta}$(solar conversion efficiency) were 0.695 V, $15.81mA\;cm^{-2}$, 61.48% and 6.80%, respectively. In comparison with 5.34% of HP-1 photoelectrode, it was improved by 27.34%.

파우더와 솔더를 이용한 저비용 비아홀 채움 공정 (Low Cost Via-Hole Filling Process Using Powder and Solder)

  • 홍표환;공대영;남재우;이종현;조찬섭;김봉환
    • 센서학회지
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    • 제22권2호
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    • pp.130-135
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    • 2013
  • This study proposed a noble process to fabricate TSV (Through Silicon Via) structure which has lower cost, shorter production time, and more simple fabrication process than plating method. In order to produce the via holes, the Si wafer was etched by a DRIE (Deep Reactive Ion Etching) process. The via hole was $100{\mu}m$ in diameter and $400{\mu}m$ in depth. A dielectric layer of $SiO_2$ was formed by thermal oxidation on the front side wafer and via hole side wall. An adhesion layer of Ti and a seed layer of Au were deposited. Soldering process was applied to fill the via holes with solder paste and metal powder. When the solder paste was used as via hole metal line, sintering state and electrical properties were excellent. However, electrical connection was poor due to occurrence of many voids. In the case of metal powder, voids were reduced but sintering state and electrical properties were bad. We tried the via hole filling process by using mixing solder paste and metal powder. As a consequence, it was confirmed that mixing rate of solder paste (4) : metal powder (3) was excellent electrical characteristics.

Aluminum 및 Aluminum-Boron후면 전극에 따른 단결정 실리콘 태양전지 특성 (Characteristics of Mono Crystalline Silicon Solar Cell for Rear Electrode with Aluminum and Aluminum-Boron)

  • 홍지화;백태현;김진국;최성진;김남수;강기환;유권종;송희은
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2011년도 추계학술발표대회 논문집
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    • pp.34-39
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    • 2011
  • Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

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소결 온도 변화에 따른 $TiO_2$ 전극의 AFM 표면형상 비교 및 DSC 효율 특성 (AFM morphology of $TiO_2$ electrode with differential sintering temperature and efficiency properties Dye-Sensitized solar cells)

  • 김현주;이동윤;구보근;이원재;송재성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.461-462
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    • 2005
  • In order to improve the efficiency of dye-sensitized solar cell (DSC), $TiO_2$ electrode screen-printed on transparent conducting oxide (TCO) substrate was sintered in variation with different temperature(350 to $550^{\circ}C$). $TiO_2$ electrode on fluorine doped tin oxide (FTO) glass was assembled with Pt counter electrode on FTO glass. I-V properties of DSC were measured under solar simulator. Also, effect of sintering temperature on surface morphology of $TiO_2$ films was investigated to understand correlation between its surface morphology and sintering temperature. Such surface morphology was observed by atomic force microscopy (AFM). From the measurement results, at sintering temperature of $500^{\circ}C$, both efficiency and fill factor of DSC were mutually complementary, enhancing highest fill factor and efficiency. Consequently, it was considered that optimum sintering temperature of $\alpha$-terpinol included $TiO_2$ paste is at $500^{\circ}C$.

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석회석 미분말을 혼입한 시멘트 페이스트의 수화반응 및 역학적 특성 분석에 관한 연구 (A Study on Hydration kinetics and Mechanical Properties of Cement Paste Incoporating Limestone Filler)

  • 신기수;방미진;박기봉
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2017년도 춘계 학술논문 발표대회
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    • pp.230-231
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    • 2017
  • The addition of a limestone filler(LF) to fill into the voids between cement and aggregate particles can reduce the cementitious paste volume. This paper aim to evaluate the influence of LF contents on the hydration kinetics and compressive strength. Hydration kinetics were evaluate using heat of hydration, ignition loss and thermal analysis. The heat of hydration was measured using Isothermal Calorimetry. The degree of hydration was measured using ignition loss. Hydration product analysis was carried out by Thermal Gravimetric and Differential Thermal Analysis. The results show that the addition of LF reduces not only the initial setting time and heat of hydration peak, also degree of hydration and rate of strength development at early age increase with the addition of LF. It can be concluded the LF fills the pore between cement particles due to formation of carboaluminate, which may accelerate the setting of cement pastes.

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열형-롤 각인으로 형성한 Ag 격자 패턴과 전도성 고분자 코팅을 이용한 투명전극 필름 제작에 관한 연구 (Study and Fabrication of Transparent Electrode Film by using Thermal-Roll Imprinted Ag Mesh Pattern and Coated Conductive Polymer)

  • 유종수;조정대;윤성만;김도진
    • 한국정밀공학회지
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    • 제27권9호
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    • pp.11-15
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    • 2010
  • In this study, to fabricate a low-resistance and high optical transparency electrode film, the following steps were performed: the design and manufacture of electroforming stamp, the fabrication of a thermal roll-imprinted polycarbonate (PC) patterned films, the filled low-resistance Ag paste using doctor blade process on patterned PC films and spin coating by conductive polymers. As a result of PC films imprinted line width of $26.69{\pm}2\;{\mu}m$, channel length of $247.57{\pm}2\;{\mu}m$, and pattern depth of $7.54{\pm}0.2\;{\mu}m$. Ag paste to fill part of the patterned film with conductive polymer coating and then the following parameters were obtained: a sheet resistance of $11.1\;{\Omega}/sq$ optical transparency values at a wavelength of 550 nm was 80.31 %.

TiO2 전극의 소결 온도에 따른 DSSCs의 전기적 특성 및 AFM 형상 비교 (Comparison of Electrical Properties and AFM Images of DSSCs with Various Sintering Temperature of TiO2 Electrodes)

  • 김현주;이동윤;이원재;구보근;송재성
    • 한국전기전자재료학회논문지
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    • 제18권6호
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    • pp.571-575
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    • 2005
  • In order to improve the efficiency of dye-sensitized solar cell (DSSC), $TiO_2$ electrode screen-printed on transparent conducting oxide (TCO) substrate was sintered in variation with different temperature$(350\;to\;550^{\circ}C)$. $TiO_2$ electrode on fluorine doped tin oxide (FTO) glass was assembled with Pt counter electrode on FTO glass. I-V properties of DSSCs were measured under solar simulator. Also, effect of sintering temperature on surface morphology of $TiO_2$ films was investigated to understand correlation between its surface morphology and sintering temperature. Such surface morphology was observed by atomic force microscopy (AFM). Below sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively lower due to lower open circuit voltage. Oppositely, above sintering temperature of $500^{\circ}C$, efficiency of DSSCs was relatively higher due to higher open circuit voltage. In both cases, lower fill factor (FF) was observed. However, at sintering temperature of $500^{\circ}C$, both efficiency and fill factor of DSSCs were mutually complementary, enhancing highest fill factor and efficiency. Such results can be explained in comparison of surface morphology with schematic diagram of energy states on the $TiO_2$ electrode surface. Consequently, it was considered that optimum sintering temperature of a-terpinol included $TiO_2$ paste is at $500^{\circ}C$.

고효율, 저가화 태양전지에 적합한 Ni/Cu 금속 전극 간격에 따른 특성 평가 (Investigation of the Ni/Cu metal grid space for high-effiency, low cost crystlline silicon solar cells)

  • 김민정;이지훈;조경연;이수홍
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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    • pp.225-229
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    • 2009
  • The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

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플라이애쉬와 고로슬래그 미분말을 혼입한 지오폴리머 페이스트의 반응특성 분석 (Reaction Characteristics of Geopolymer Paste Incorporating Fly-ash and GGBS)

  • 신기수;박기봉
    • 한국건축시공학회지
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    • 제20권4호
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    • pp.321-330
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    • 2020
  • 지오폴리머의 반응성은 원재료의 구성성분 및 Si/Al비, Na/Al비, 물-결합재비, 비정질 요소 등을 고려하여 명확한 메커니즘을 규명하는 것은 매우 중요하다. 따라서 원재료 및 알칼리 활성화제의 구성성분을 고려한 %Na2O, Ms는 반응성을 결정하는 중요한 요소가 된다. 하지만 다수의 연구에서는 알칼리 활성화제의 농도와 양생 조건 등의 기본적인 요소만을 고려하는 한계점을 나타내고 있다. 따라서 본 연구에서는 %Na2O, Ms 및 고로슬래그 미분말의 혼입량에 따른 지오폴리머 페이스트의 강도특성, 반응열, 길이변화, 미세구조 분석을 실시하였다.

소성조건에 따른 Gravure Off-set 태양전지의 전기적 특성변화 (Electric property changes of Gravure Off-set solar cells according to firing conditions)

  • 김정모;김동주;배소익
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2011년도 제42회 하계학술대회
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    • pp.1382-1383
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    • 2011
  • 결정질 실리콘 태양전지에서 전극 형성 공정은 Voc(Open-circuit voltage), Isc(Short-circuit current), Rser(Series resistance), Rshunt(Shunt resistance), FF(Fill factor) 특성에 영향을 주기 때문에 매우 중요하다. 하지만 paste와 선 공정에서의 조건에 따라 특성이 바뀌기 때문에 소성 공정을 최적화하기는 쉽지 않다. 본 연구에서는 Gravure Off-set printing 방식을 이용하여 결정질 실리콘 기판 표면에 미세 전극 형성 공정을 하고 소성 조건 최적화를 위해 peak 온도와 ramp-up 속도를 변화시켜 각 조건별 특성을 비교하였다. Peak 온도가 커질수록, contact resistance의 감소에 따라 Rser가 줄어들었다. 본 연구를 통해 Voc는 619mV, FF는 77.9%로 측정되는 Gravure Off-set 태양전지에 최적화된 소성 공정 조건을 확보하였다.

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