• Title/Summary/Keyword: passive chip

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A 8-bit Variable Gain Single-slope ADC for CMOS Image Sensor

  • Park, Soo-Yang;Son, Sang-Hee;Chung, Won-Sup
    • Journal of IKEEE
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    • v.11 no.1 s.20
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    • pp.38-45
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    • 2007
  • A new 8-bit single-slope ADC using analog RAMP generator with digitally controllable dynamic range has been proposed and simulated for column level or per-pixel CMOS image sensor application. The conversion gain of ADC can he controlled easily by using frequency divider with digitally controllable diviber ratio, coarse/fine RAMP with class-AB op-amp, resistor strings, decoder, comparator, and etc. The chip area and power consumption can be decreased by simplified analog circuits and passive components. Proposed frequency divider has been implemented and verified with 0.65um, 2-poly, 2-metal standard CMOS process. And the functional verification has been simulated and accomplished in a 0.35$\mu$m standard CMOS process.

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A Simple Dual Band Filter Design with 0603 Case Size using IPD Technology for 1.8 GHz and 2.5 GHz DC-block Application

  • Li, De-Zhong;Wang, Cong;Kyung, Gear Inpyo;Kim, Nam-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.385-386
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    • 2008
  • In this paper, a simple dual band filter chip is designed with 0603 case size using IPD technology. The dual-band filter achieves high frequency band at 2.5 GHz and low frequency band at 1.8 GHz. The insertion losses in high frequency band and low frequency band are -0.195 dB and -0.146 dB, respectively. The return losses in these bands are -22.7 dB and -22.8 dB, respectively. The simple dual-band filter based on SI-GaAs substrate is designed within die size of about 1.3 $mm^2$.

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Design of Low Power OLED Driving Circuit (저소비 전력 OLED 디스플레이 구동 회로 설계)

  • 신홍재;이재선;최성욱;곽계달
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.919-922
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    • 2003
  • This paper presents a novel low power driving circuit for passive matrix organic lighting emitting diodes (OLED) displays. The proposed driving method for a low power OLED driving circuit which reduce large parasitic capacitance in OLED panel only use current driving method, instead of mixed mode driving method which uses voltage pre-charge technique. The driving circuit is implemented to one chip using 0.35${\mu}{\textrm}{m}$ CMOS process with 18V high voltage devices and it is applicable to 96(R.G.B)X64, 65K color OLED displays for mobile phone application. The maximum switching power dissipation of driving power dissipation is 5.7mW and it is 4% of that of the conventional driving circuit.

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Planar Fashionable Circuit Board Technology and Its Applications

  • Lee, Seul-Ki;Kim, Bin-Hee;Yoo, Hoi-Jun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.3
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    • pp.174-180
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    • 2009
  • A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

Development of Miniature Quad SAW Filter Bank based on PCB Substrate

  • Lee, Young-Jin;Kim, Chang-Il;Paik, Jong-Hoo
    • Transactions on Electrical and Electronic Materials
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    • v.9 no.1
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    • pp.33-37
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    • 2008
  • This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

Study on the Thermal Behavior of Immersion Cooled LED Lighting Engines (담금 냉각되는 LED 조명엔진의 열특성에 대한 연구)

  • Kim, Kyoung Joon
    • Journal of Power System Engineering
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    • v.18 no.3
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    • pp.87-92
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    • 2014
  • This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.

Fabrication of Switch Module for ATM Exchange System using MCM Technology (멀티칩 기술을 이용한 ATM 교환기용 Switch 모듈 제작)

  • Ju, Cheol-Won;Kim, Chang-Hun;Han, Byeong-Seong
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.49 no.8
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    • pp.433-437
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    • 2000
  • We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.

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An RFID Tag Using a Planar Inverted-F Antenna Capable of Being Stuck to Metallic Objects

  • Choi, Won-Kyu;Son, Hae-Won;Bae, Ji-Hoon;Choi, Gil-Young;Pyo, Cheol-Sig;Chae, Jong-Suk
    • ETRI Journal
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    • v.28 no.2
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    • pp.216-218
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    • 2006
  • This letter presents the design for a low-profile planar inverted-F antenna (PIFA) that can be stuck to metallic objects to create a passive radio frequency identification (RFID) tag in the UHF band. The designed PIFA, which uses a dielectric substrate for the antenna, consists of a U-slot patch for size reduction, several shorting pins, and a coplanar waveguide feeding structure to easily integrate with an RFID chip. The impedance bandwidth and maximum gain of the tag antenna are about 0.3% at 914 MHz for a voltage standing wave ratio (VSWR) of less than 2 and 3.6 dBi, respectively. The maximum read range is about 4.5 m as long as the tag antenna is on a metallic object.

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The Prediction of mixing with Helix Index for 3-Dimensional channel in micro (3 차원 마이크로 채널에서 나선지수에 의한 혼합예측)

  • Jung, Seung-Hoon;Maeng, Joo-Sung
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2460-2464
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    • 2008
  • The present paper suggests new method to know the effects of molecular diffusion and the helicity of microchannel flows on mixing in passive micromixers, which are essential components of a microfluidic chip. In this study, 'Helix Index' is newly defined as the magnitude of chaotic advection. Relationship between Helix Index and Mixing Index is analyzed numerically such as the wide range of Peclet and Reynolds numbers in three dimensional serpentine microchannel when using soluble solutions (water/glycerol). As a result, a simple algebraic equation is derived by this relationship based on a regression analysis. The algebraic equation is found to be able to accurately predict the mixing performance without solving the coupled, complex momentum and mass transfer equations.

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An Integrated LTCC Inductor and Its Application (LTCC 기술을 이용한 마이크로 인덕터 및 응용)

  • Kim Chan-Young;Kim Hee-Jun
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.53 no.11
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    • pp.680-686
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    • 2004
  • An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.