1 |
Y. J. Lee, J. I. Im, and S. H. Lee, "Development of the RF SAW filters based on PCB substrate", IEEE Freq. Cont. Sym. Proc., p. 334, 2006
|
2 |
S. Entwistle, N. Mawston, and S. Robinson, "Wireless & portable enabling technology strategies analysis showcase", Strategy Analytics, Electronica., p. 10, 2004
|
3 |
P. V. Wright, "Integrated front-end modules for cell phones", IEEE Ultras. Symp. Proc., p. 564, 2005
|
4 |
P. Selmeier, R. Grunwald, A. Przadka, H. Kruger, G. Feiertag, and C. Ruppel, "Recent and advances in SAW packaging", IEEE Ultras. Symp. Proc., p. 283, 2001
|
5 |
S. Yoshimoto, Y. Yamamoto, Y. Takahashi, and E. Otsuka, "Multi-band RF SAW filter for mobile phone using surface mount plastic package", IEEE Ultras. Symp. Proc., p. 113, 2002
|
6 |
K. W. Baik, "Electronic packaging technology", The J. of KIEEME(in Korean), Vol. 16, No. 7, p. 3, 2003
|