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http://dx.doi.org/10.9726/kspse.2014.18.3.087

Study on the Thermal Behavior of Immersion Cooled LED Lighting Engines  

Kim, Kyoung Joon (Department of Mechanical & Automotive Engineering, Pukyong National University)
Publication Information
Journal of Power System Engineering / v.18, no.3, 2014 , pp. 87-92 More about this Journal
Abstract
This study is aimed at investigating the thermal behavior of immersion-cooled high power LED lighting engines. 3D CFD models have been generated for the numerical analysis. Five cases in terms of the configuration of LED chips have been explored for various passive cooling conditions of the lighting engine, i.e., the natural air convection with a lens, the natural air convection without a lens, the deionized water-immersion cooling condition with a lens. The numerical study reveals that the deionized water-immersion cooled lighting engine has nearly twice better thermal performance than the natural air convection cooled lighting engine containing a lens. The investigation has also demonstrated that the four chips configuration has the better thermal performance than the single chip configuration.
Keywords
LED Lighting; Immersion Cooling; Thermal Behavior; CFD;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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1 G. Chang, C.M. Park, and E.P. Kim, 2007, "A Study on Development of Liquid Cooled Plate for Cooling of a Communication Electronic Device with High Heat Generation", Journal of the Korean Society of Power Engineering, Vol. 11, No. 2, pp. 26-31.   과학기술학회마을
2 K. A. Hoffmann, S. T. Chiang, 1998, "Computational Fluid Dynamics Volume I", 3rd Ed., Engineering Education System, Wichita, KS, U.S.A.
3 M. Arik, J. Petroski, and S. Weaver, 2002, "Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes", Proceedings of the 8th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, United States, pp. 113-120.
4 J. Kim, 2013, "Barrier-Transition Cooling in LED", Journal of the Korean Society of Power Engineering, Vol. 17, No. 5, pp. 44-51.   과학기술학회마을
5 D.-W. Kim, E. Rahim, A. Bar-Cohen, and B. Han, 2010, "Direct Submount Cooling of High-Power LEDs", IEEE Transactions on Components Packaging Technologies, Vol. 33, No. 4, pp. 698-712.   DOI   ScienceOn
6 J.-C. Wang, R.-T. Wang, T.-L. Chang et al., 2010, "Development of 30Watt High Power LEDs Vapor Chamber-Based Plate", International Journal of Heat and Mass Transfer, Vol. 53, No. 19, pp. 3990-4001.   DOI   ScienceOn
7 S. Liu, J. Yang, Z. Gan, et al., 2008, "Structural Optimization of Microjet Based Cooling System for High Power LEDs", International Journal of Thermal Science, Vol. 47, pp. 1086-1095.   DOI   ScienceOn
8 X. Luo and S. Liu, 2007, "A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs", IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp. 475-484.   DOI   ScienceOn
9 P.C. Tsai, R. W. Chang, and Y. K. Su, 2007, "Lifetime Tests and Junction-Temperature Measurement of InGaN Light-Emitting Diodes Using Patterned Sapphire Substrates", Journal of Lightwave Technology, Vol. 25, No. 2, pp. 591-596   DOI   ScienceOn