1 |
G. Chang, C.M. Park, and E.P. Kim, 2007, "A Study on Development of Liquid Cooled Plate for Cooling of a Communication Electronic Device with High Heat Generation", Journal of the Korean Society of Power Engineering, Vol. 11, No. 2, pp. 26-31.
과학기술학회마을
|
2 |
K. A. Hoffmann, S. T. Chiang, 1998, "Computational Fluid Dynamics Volume I", 3rd Ed., Engineering Education System, Wichita, KS, U.S.A.
|
3 |
M. Arik, J. Petroski, and S. Weaver, 2002, "Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes", Proceedings of the 8th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, United States, pp. 113-120.
|
4 |
J. Kim, 2013, "Barrier-Transition Cooling in LED", Journal of the Korean Society of Power Engineering, Vol. 17, No. 5, pp. 44-51.
과학기술학회마을
|
5 |
D.-W. Kim, E. Rahim, A. Bar-Cohen, and B. Han, 2010, "Direct Submount Cooling of High-Power LEDs", IEEE Transactions on Components Packaging Technologies, Vol. 33, No. 4, pp. 698-712.
DOI
ScienceOn
|
6 |
J.-C. Wang, R.-T. Wang, T.-L. Chang et al., 2010, "Development of 30Watt High Power LEDs Vapor Chamber-Based Plate", International Journal of Heat and Mass Transfer, Vol. 53, No. 19, pp. 3990-4001.
DOI
ScienceOn
|
7 |
S. Liu, J. Yang, Z. Gan, et al., 2008, "Structural Optimization of Microjet Based Cooling System for High Power LEDs", International Journal of Thermal Science, Vol. 47, pp. 1086-1095.
DOI
ScienceOn
|
8 |
X. Luo and S. Liu, 2007, "A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs", IEEE Transactions on Advanced Packaging, Vol. 30, No. 3, pp. 475-484.
DOI
ScienceOn
|
9 |
P.C. Tsai, R. W. Chang, and Y. K. Su, 2007, "Lifetime Tests and Junction-Temperature Measurement of InGaN Light-Emitting Diodes Using Patterned Sapphire Substrates", Journal of Lightwave Technology, Vol. 25, No. 2, pp. 591-596
DOI
ScienceOn
|