Pad Surface Characteristics and their Effect on Within Wafer Non-Uniformity in Chemical Mechanical Polishing (화학 기계적 연마에서 패드표면 특성이 웨이퍼 불균일도에 미치는 영향)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2009.06a
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- pp.58-58
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- 2009