Diamond Conditioner Wear Characterization for a Copper CMP Process |
Boruckia, L.
(Araca, Inc.)
Zhuang, Y. (Araca, Inc.) Kikuma, R. (Mitsubishi Materials Corporation) Rikita, N. (Mitsubishi Materials Corporation) Yamashita, T. (Mitsubishi Materials Corporation) Nagasawa, K. (Mitsubishi Materials Corporation) Lee, H. (The University of Arizona) Sun, T. (The University of Arizona) Rosales-Yeomans, D. (The University of Arizona) Philipossian, A. (The University of Arizona) Stout, T (Veeco Instruments, Inc.) |
1 | L. Borucki, Y. Sampumo, Y. Zhuang, A. Philipossian, T. Merchant, and J. Zabasajja, 'Measurement of Diamond Conditioner Microwear', Proc. of 22nd VLSI Multilevel Interconnection Conference (VMIC), p. 441, 2005 |
2 | L. Borucki, Y. Zhuang, and A. Philipossian, 'Physics and Modeling of Fundamental CMP Phenomena', Proc. of 22nd VLSI Multilevel Interconnection Conference (VMIC), p. 175, 2005 |
3 | L. J. Borucki, T. Witelski, C. P. Please, P. R. Kramer, and D. Schwendeman, 'A theory of pad conditioning for chemical mechanical polishing', J. of Engineering Mathematics, Vol. 50, p. 1, 2004 DOI |
4 | J. Sorooshian, L. Borucki, D. Stein, R. Timon, D. Hetherington, and A. Philipossian, 'Revisiting the removal rate model for oxide CMP', Trans. ASME J. Tribology, Vol. 127, No.3, p. 639, 2005 DOI ScienceOn |
5 | K. L. Johnson, 'Contact Mechanics', Cambridge U. Press, 1985 |
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